Latest BLA0007 Light Array from Balluff Can Measures up to 6 Objects in 16 mm Light Field
Identifies size and position with precision with IO-Link and can detect cable, wire, or threads as small as 0.3 mm. Offers object diameter, object position, gap width, gap position and edge position work modes. Features include exact position detection, simple size differentiation of diameters, quality inspection gap dimensions and precise edge detection.
Read More »Latest BLA0007 Light Array from Balluff Can Measures up to 6 Objects in 16 mm Light Field
Identifies size and position with precision with IO-Link and can detect cable, wire, or threads as small as 0.3 mm. Offers object diameter, object position, gap width, gap position and edge position work modes. Features include exact position detection, simple size differentiation of diameters, quality inspection gap dimensions and precise edge detection.
Read More »New VU19P Virtex UltraScale FPGA from Xilinx Enables Prototyping and Emulation
Comes with 35 billion transistors that provides logic density and I/O count on a single device. Ideal for test, measurement, compute, networking, aerospace and defense-related applications. Features 9 million system logic cells, up to 1.5 terabits per-second of DDR4 memory bandwidth and up to 4.5 terabits per-second of transceiver bandwidth, and over 2,000 user I/Os.
Read More »New VU19P Virtex UltraScale FPGA from Xilinx Enables Prototyping and Emulation
Comes with 35 billion transistors that provides logic density and I/O count on a single device. Ideal for test, measurement, compute, networking, aerospace and defense-related applications. Features 9 million system logic cells, up to 1.5 terabits per-second of DDR4 memory bandwidth and up to 4.5 terabits per-second of transceiver bandwidth, and over 2,000 user I/Os.
Read More »Third Party Logistics and Fulfillment
This whitepaper provides an overview of third party logistics (3PL) and fulfillment services.
Read More »New CoB SMT VCSEL Array Eliminates The Need for Wire Bonds
Provides high performance using near-infrared light-emitting laser diodes or LEDs for 3D sensing. Device has integrated solder balls and mounts directly to a PCB using standard SMT with built-in hermeticity. Ideal for automotive long-range LiDAR prototypes for low power mobile and in-cabin 3D sensing applications.
Read More »New CoB SMT VCSEL Array Eliminates The Need for Wire Bonds
Provides high performance using near-infrared light-emitting laser diodes or LEDs for 3D sensing. Device has integrated solder balls and mounts directly to a PCB using standard SMT with built-in hermeticity. Ideal for automotive long-range LiDAR prototypes for low power mobile and in-cabin 3D sensing applications.
Read More »New Achronix Speedster7t Family Designed to Accept Data from Multiple High-speed Sources
Include high-bandwidth GDDR6 interfaces, 400G Ethernet ports and PCI Express Gen5. Features a revolutionary new 2D network-on-chip (NoC) and a high-density array of new machine learning processors (MLP). Speedster7t is the fusion of flexible FPGA technology with ASIC core efficiency and provides support for GDDR6 memories.
Read More »New Achronix Speedster7t Family Designed to Accept Data from Multiple High-speed Sources
Include high-bandwidth GDDR6 interfaces, 400G Ethernet ports and PCI Express Gen5. Features a revolutionary new 2D network-on-chip (NoC) and a high-density array of new machine learning processors (MLP). Speedster7t is the fusion of flexible FPGA technology with ASIC core efficiency and provides support for GDDR6 memories.
Read More »Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification
Designation Enables Space Customers to Leverage RTG4 FPGAs' Easy Prototyping and Fast Design Times ALISO VIEJO, Calif., Aug. 28, 2018 /PRNewswire/ -- Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), today announced its RTG4™ high-speed signal processing radiation-tolerant field programmable gate arrays (FPGAs) have achieved Qualified Manufacturers...
Read More »Microsemi RTG4 FPGAs Become Industry's First High-Speed Signal Processing Radiation-Tolerant FPGAs to Achieve QML Class V Qualification
Designation Enables Space Customers to Leverage RTG4 FPGAs' Easy Prototyping and Fast Design Times ALISO VIEJO, Calif., Aug. 28, 2018 /PRNewswire/ -- Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), today announced its RTG4™ high-speed signal processing radiation-tolerant field programmable gate arrays (FPGAs) have achieved Qualified Manufacturers...
Read More »More performance and functionality for Sinumerik 828D CNC
Siemens new SINUMERIK 828D ADVANCED, SINUMERIK 828D and SINUMERIK 828D BASIC sets the standard for productivity enhancements of turning and milling operations on standardized machines and simplify the automation of grinding machines. See our video to learn all about it.
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