Microchip's Low-Power Radiation-Tolerant (RT) PolarFire® FPGA is Available in Engineering Silicon and on a Path to Full QML Class V Spaceflight Qualification
Customers can prototype with the same FPGA silicon and package that is now headed for space qualification Chandler, Ariz., Dec. 2, 2020 – Microchip Technology (Nasdaq: MCHP) today announced it is shipping engineering silicon for its RT PolarFire Field Programmable Gate Array (FPGA) while the device is being qualified to spaceflight component reliability standards. Designers can now create...
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New IA-840F FPGA Card Comes with Board Management Controller
Features tiling architecture with dual QSFP-DDs (4× 100G), PCIe Gen4 x16, and three MCIO expansion ports. Supports Intel oneAPI™ unified software programming environment. Offers passive, active or liquid thermal cooling options.
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New RTG4 Field Programmable Gate Array is QML Class V Qualified
Features 150,000 Logic Elements (LEs), 462 multipliers and 5.2 megabits (Mb) of memory. Offers high-speed signal-processing capabilities and leverage reprogrammable flash memory. Comes with 352 pins for RTG4 FPGAs simplifies system design in applications ranging from satellites and space probes to planet landers and vehicles.
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New Icicle Kit for PolarFire SoC FPGAs is Centered Around 250K Logic Element PolarFire SoC device
Supported by validated and tested power management and clocking devices such as Ethernet PHY, USB controller and current sensors. Includes a PCIe® connector, mikroBUS™ socket, dual RJ45 connector, Micro-USB connector, CAN bus connector, Raspberry Pi® header, JTAG port and SD Card interfaces. Ideally suited for smart embedded imaging, IoT, industrial automation, defense, automotive and...
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Advantages of Nylon Washers and Other Non-Metallic Materials
Check out this white paper to learn about the types of non-metallic washers.
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New Core Arrays for Air-handling OEMs
SA Series is available in standardized 20-inch core modular stacks ranging from 3 (w) x 3 (h) (2,250-CFM) to 8 (w) x 8 (h) (70,000-CFM). Optimized core face area air distribution can be channeled for either side-to-side or over-and-under configurations. Ideal for all large airflow commercial air handlers especially medical, schools, labs, convention centers and other applications where IAQ is...
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New 3 W Back-Emitting VCSEL Array Comes with VoB Technology
Offers single array die that is flip-chipped with standard SMT to printed circuit board (PCB) without the need for a submount carrier. Features back-side etched micro-lenses that enable integrated optics, which further reduces part height with separate optical lenses. Uses copper pillars with solder bumps and mounts directly to a PCB using standard lead-free SMT.
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Microchip Introduces RT PolarFire FPGA with Non-volatile (NV) Technology
Optimized to meet the requirements in spacecraft payload system’s high-speed data paths with the low possible power consumption and heat generation. Withstands total ionizing dose (TID) exposure beyond the 100 kilorads (kRads). Eliminates complexity and recovery downtime of mitigating configuration SEUs.
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Latest BLA0007 Light Array from Balluff Can Measures up to 6 Objects in 16 mm Light Field
Identifies size and position with precision with IO-Link and can detect cable, wire, or threads as small as 0.3 mm. Offers object diameter, object position, gap width, gap position and edge position work modes. Features include exact position detection, simple size differentiation of diameters, quality inspection gap dimensions and precise edge detection.
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New VU19P Virtex UltraScale FPGA from Xilinx Enables Prototyping and Emulation
Comes with 35 billion transistors that provides logic density and I/O count on a single device. Ideal for test, measurement, compute, networking, aerospace and defense-related applications. Features 9 million system logic cells, up to 1.5 terabits per-second of DDR4 memory bandwidth and up to 4.5 terabits per-second of transceiver bandwidth, and over 2,000 user I/Os.
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New CoB SMT VCSEL Array Eliminates The Need for Wire Bonds
Provides high performance using near-infrared light-emitting laser diodes or LEDs for 3D sensing. Device has integrated solder balls and mounts directly to a PCB using standard SMT with built-in hermeticity. Ideal for automotive long-range LiDAR prototypes for low power mobile and in-cabin 3D sensing applications.
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ISO-Certified Plastic Injection Molding from Rodon
The Rodon Group is a proven leader in high-volume, close tolerance injection molding. We offer globally competitive, innovative manufacturing solutions for a broad range of industries. Check out our video to learn more.
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