Arrays

AEC-Q100 Qualified and Defense-grade PolarFire® FPGAs Now Available in Volume Production
Arrays

AEC-Q100 Qualified and Defense-grade PolarFire® FPGAs Now Available in Volume Production

Expanded product offering with robust device certification and characterization gives customers programmable logic solutions ideal for thermally challenging environments Chandler, Ariz., Mar. 4, 2021 – Automotive, defense, aerospace and industrial designers who need automotive- and defense-grade programmable logic solutions can now order PolarFire Field Programmable Gate Arrays (FPGAs) in...

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Microchip's Low-Power Radiation-Tolerant (RT) PolarFire® FPGA is Available in Engineering Silicon and on a Path to Full QML Class V Spaceflight Qualification
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Microchip's Low-Power Radiation-Tolerant (RT) PolarFire® FPGA is Available in Engineering Silicon and on a Path to Full QML Class V Spaceflight Qualification

Customers can prototype with the same FPGA silicon and package that is now headed for space qualification Chandler, Ariz., Dec. 2, 2020 – Microchip Technology (Nasdaq: MCHP) today announced it is shipping engineering silicon for its RT PolarFire Field Programmable Gate Array (FPGA) while the device is being qualified to spaceflight component reliability standards. Designers can now create...

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New RTG4 Field Programmable Gate Array is QML Class V Qualified
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New RTG4 Field Programmable Gate Array is QML Class V Qualified

Features 150,000 Logic Elements (LEs), 462 multipliers and 5.2 megabits (Mb) of memory. Offers high-speed signal-processing capabilities and leverage reprogrammable flash memory. Comes with 352 pins for RTG4 FPGAs simplifies system design in applications ranging from satellites and space probes to planet landers and vehicles.

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New Icicle Kit for PolarFire SoC FPGAs is Centered Around 250K Logic Element PolarFire SoC device
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New Icicle Kit for PolarFire SoC FPGAs is Centered Around 250K Logic Element PolarFire SoC device

Supported by validated and tested power management and clocking devices such as Ethernet PHY, USB controller and current sensors. Includes a PCIe® connector, mikroBUS™ socket, dual RJ45 connector, Micro-USB connector, CAN bus connector, Raspberry Pi® header, JTAG port and SD Card interfaces. Ideally suited for smart embedded imaging, IoT, industrial automation, defense, automotive and...

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New Core Arrays for Air-handling OEMs
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New Core Arrays for Air-handling OEMs

SA Series is available in standardized 20-inch core modular stacks ranging from 3 (w) x 3 (h) (2,250-CFM) to 8 (w) x 8 (h) (70,000-CFM). Optimized core face area air distribution can be channeled for either side-to-side or over-and-under configurations. Ideal for all large airflow commercial air handlers especially medical, schools, labs, convention centers and other applications where IAQ is...

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New 3 W Back-Emitting VCSEL Array Comes with VoB Technology
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New 3 W Back-Emitting VCSEL Array Comes with VoB Technology

Offers single array die that is flip-chipped with standard SMT to printed circuit board (PCB) without the need for a submount carrier. Features back-side etched micro-lenses that enable integrated optics, which further reduces part height with separate optical lenses. Uses copper pillars with solder bumps and mounts directly to a PCB using standard lead-free SMT.

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