Press Release Summary:
Offering minimal residue and optimal wetting for lead-free and tin-lead wave soldering applications, NC275LR water-based, halide-free, no-clean liquid flux passes SIR requirements under IPC J-STD-004B test method 220.127.116.11 at process temperature and when air dried. Flux has low fuming and accelerated solvent evaporation traits and is suited for various process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other alloys.
Original Press Release:
AIM's NC275LR VOC-Free Flux Passes New SIR Requirements
CRANSTON, RI -- AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that its NC275LR VOC-free flux meets the new SIR requirements.
Karl Seelig, Vice President of Technology, commented, "NC275LR is really leading-edge technology for VOC-free fluxes. The flux eliminates volatile organic compounds and meets the newest SIR and corrosion testing requirements. Assemblers now can have a high degree of confidence in an environmentally-friendly product that yields the highest electrical resistance."
NC275LR is a water-based, halide-free, no-clean liquid flux formulated to offer low residue and excellent wetting for lead-free and tin-lead wave soldering applications. The new liquid flux passes the new SIR requirements under the IPC J-STD-004B test method 18.104.22.168 at process temperature and when air dried.
NC275LR offers extremely low post-process residues resulting in better aesthetics as well as improved first pass in-circuit testing and a reduced need to clean pallets and conveyors. NC275LR also has proven to reduce preventive maintenance requirements for spray fluxing applications.
Offering a broad activation range, NC275LR has proven to be an excellent flux for a variety of process parameters and applications, including lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper and other alloys. The flux features excellent performance even in extended dwell times. Additionally, NC275LR offers low-fuming and fast solvent evaporation. NC275LR is compatible with a broad range of tin-lead and lead-free alloys and is available in a variety of packaging.
For more information about AIM's NC275LR VOC free flux, visit www.aimsolder.com.
Headquartered in Montreal, Canada, AIM is a leading global manufacturer of assembly materials for the electronics industry. The company produces solder paste, liquid flux, cored wire, bar solder, adhesives, preforms, and specialty alloys such as indium and gold for electronics assembly, PC fabrication, component manufacturing and other industries. For more information, visit AIM on the Web at www.aimsolder.com, or e-mail firstname.lastname@example.org.