Aim, Inc.

VOC-Free Solder Paste has environmentally safe formulation.
Chemicals & Gases

VOC-Free Solder Paste has environmentally safe formulation.

Able to withstand thermal preheats required for palletized selective soldering, NC277Â- halide-free liquid flux has medium residue suitable for extended thermal demands. Product provides broad activation range, accommodating various process parameters and applications that include lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other...

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Solder Paste minimizes post-process residue and graping.
Materials

Solder Paste minimizes post-process residue and graping.

Lead-free and halogen-free, NC259 No-Clean Solder Paste matches chemistry of low-silver/no-silver alloys, such as SN100C® and SAC0307, effectively mitigatingÂ- head-in-pillow defects. Product provides optimized print definition and sustainable solder volume transfer. Shelf life is 9 months when stored at 40–55°F or 4 months when stored at room temperature.

Read More »
AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013
Materials

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

CRANSTON, RIÂ- - April 8, 2013 - AIM Solder, a global leader in the manufacture of solder assembly materials for the electronics industry, will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center. This low-cost, lead-free and halogen-free solder paste offers the...

Read More »
AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show
Materials

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Cranston, Rhode Island- AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA. This low-cost, lead-free, halogen-free solder paste offers the performance of tin-lead and high-silver lead-free solder pastes. Now manufacturers can...

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AIM Solder Accepts 2013 NPI Award for Its New NC277 VOC-Free Flux at the IPC APEX EXPO
Materials

AIM Solder Accepts 2013 NPI Award for Its New NC277 VOC-Free Flux at the IPC APEX EXPO

Cranston, Rhode Island- AIM Solder today announced that it has been awarded a 2013 NPI Award in the category of Flux for its NC277 No-Clean Liquid Flux. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San Diego Convention Center in California. NC277 Liquid Flux is a VOC-Free flux that is as electrically safe as an alcohol-based flux and...

Read More »
AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO
Materials

AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO

Cranston, Rhode Island- AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo, booth #1302, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. NC277 Liquid Flux is formulated to offer a very wide process window and is excellent in extended dwell times. NC277 offers a broad activation range, proving...

Read More »
Materials

Solder Alloy is available in Pb-free bar form.

Available in bar solder form, lead (Pb)-free SN100C solder alloy is comprised of tin-copper-nickelÂ- and germanium and does not contain silver or bismuth. Eutectic alloy, supporting bridge- and icicle-free soldering, produces smooth, bright, well-formed fillets free of micro-cracks regardless of cooling rate. With optimized through-hole penetration and topside fillet formation, alloy does...

Read More »
AIM to Highlight New NC259 Solder Paste at SMTA International 2012
Materials

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo, scheduled to take place Tuesday October 16 and Wednesday, October 17, 2012 from 9 a.m.-5 p.m. at the...

Read More »
AIM to Showcase NC259 Solder Paste at IPC Midwest
Materials

AIM to Showcase NC259 Solder Paste at IPC Midwest

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, will highlight its new NC259 Solder Paste in Booth #603 at the upcoming IPC Midwest Exhibition & Conference, scheduled to take place August 22-23, 2012 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL. This...

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VOC-Free Flux passes SIR and corrosion testing requirements.
Materials

VOC-Free Flux passes SIR and corrosion testing requirements.

Offering minimal residue and optimal wetting for lead-free and tin-lead wave soldering applications, NC275LR water-based, halide-free, no-clean liquid flux passes SIR requirements under IPC J-STD-004B test method 2.6.3.7 at process temperature and when air dried. Flux has low fuming and accelerated solvent evaporation traits and is suited for various process parameters and applications, including...

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Company News

AIM Announces Research & Development Laboratory Expansion in Montreal

CRANSTON, R.I. (PRWEB) FEBRUARY 25, 2020 - AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the expansion of the Research and Development Laboratory at its Montreal, Canada facility, bolstering an already extensive R&D network with laboratories in Mexico, Poland and China. As the needs of the electronics assembly market...

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Company News

AIM's Timothy O'Neill to Present at SMTA LA/OC Expo & Tech Forum on November 2nd, 2017

CRANSTON, R.I. USA - OCTOBER 30, 2017 AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Timothy O’Neill, Technical Marketing Manager, will present at the SMTA LA – Orange County Expo & Tech Forum, scheduled to take place on November 2nd, 2017 at The Grand in Long Beach, CA. The presentation is scheduled for 1:00...

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VOC-Free Solder Paste has environmentally safe formulation.
Chemicals & Gases

VOC-Free Solder Paste has environmentally safe formulation.

Able to withstand thermal preheats required for palletized selective soldering, NC277Â- halide-free liquid flux has medium residue suitable for extended thermal demands. Product provides broad activation range, accommodating various process parameters and applications that include lead-free wave soldering with tin-silver-copper, tin-silver, tin-copper, and other...

Read More »
Solder Paste minimizes post-process residue and graping.
Materials

Solder Paste minimizes post-process residue and graping.

Lead-free and halogen-free, NC259 No-Clean Solder Paste matches chemistry of low-silver/no-silver alloys, such as SN100C® and SAC0307, effectively mitigatingÂ- head-in-pillow defects. Product provides optimized print definition and sustainable solder volume transfer. Shelf life is 9 months when stored at 40–55°F or 4 months when stored at room temperature.

Read More »
AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013
Materials

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

CRANSTON, RIÂ- - April 8, 2013 - AIM Solder, a global leader in the manufacture of solder assembly materials for the electronics industry, will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center. This low-cost, lead-free and halogen-free solder paste offers the...

Read More »
AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show
Materials

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Cranston, Rhode Island- AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA. This low-cost, lead-free, halogen-free solder paste offers the performance of tin-lead and high-silver lead-free solder pastes. Now manufacturers can...

Read More »
AIM Solder Accepts 2013 NPI Award for Its New NC277 VOC-Free Flux at the IPC APEX EXPO
Materials

AIM Solder Accepts 2013 NPI Award for Its New NC277 VOC-Free Flux at the IPC APEX EXPO

Cranston, Rhode Island- AIM Solder today announced that it has been awarded a 2013 NPI Award in the category of Flux for its NC277 No-Clean Liquid Flux. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San Diego Convention Center in California. NC277 Liquid Flux is a VOC-Free flux that is as electrically safe as an alcohol-based flux and...

Read More »
AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO
Materials

AIM Solder to Highlight NC277 No-Clean Flux at the IPC APEX EXPO

Cranston, Rhode Island- AIM Solder announces that it will highlight its new NC277 No-Clean Liquid Flux at the upcoming IPC APEX Expo, booth #1302, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. NC277 Liquid Flux is formulated to offer a very wide process window and is excellent in extended dwell times. NC277 offers a broad activation range, proving...

Read More »
Materials

Solder Alloy is available in Pb-free bar form.

Available in bar solder form, lead (Pb)-free SN100C solder alloy is comprised of tin-copper-nickelÂ- and germanium and does not contain silver or bismuth. Eutectic alloy, supporting bridge- and icicle-free soldering, produces smooth, bright, well-formed fillets free of micro-cracks regardless of cooling rate. With optimized through-hole penetration and topside fillet formation, alloy does...

Read More »
AIM to Highlight New NC259 Solder Paste at SMTA International 2012
Materials

AIM to Highlight New NC259 Solder Paste at SMTA International 2012

CRANSTON, RI - AIM, a leading global manufacturer of solder assembly materials for electronics assembly, PC fabrication, component manufacturing and other industries, announces that it will highlight its new NC259 Solder Paste in booth #401 at the upcoming SMTA International Conference and Expo, scheduled to take place Tuesday October 16 and Wednesday, October 17, 2012 from 9 a.m.-5 p.m. at the...

Read More »

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