Flux

Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium
Flux

Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA. Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billon front-end module SiP devices manufactured over the last three years. From...

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Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium
Flux

Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA. Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billon front-end module SiP devices manufactured over the last three years. From...

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Flux

New NC 256 Zero Residue Flux is Ideal for Lead Free Applications

Can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components. Used for soldering wetting and eliminates the cleaning process and can be used for mass reflow process or rework process. Designed for wafer ball bumping and advanced components attachment to eliminate cleaning process.

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Flux

New NC 256 Zero Residue Flux is Ideal for Lead Free Applications

Can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components. Used for soldering wetting and eliminates the cleaning process and can be used for mass reflow process or rework process. Designed for wafer ball bumping and advanced components attachment to eliminate cleaning process.

Read More »
Peristaltic Pump Vs. i-FILL® Technology
Sponsored

Peristaltic Pump Vs. i-FILL® Technology

Intellitech's advanced i-FILL® pumps are used by companies working in some of the world's most demanding sectors, delivering innovative, highly accurate and repeatable results, ensuring ultimate reliability and ease of use for all of our clients.

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Spray Fluxing Systems have integrated ultrasonic nozzle generator.
Flux

Spray Fluxing Systems have integrated ultrasonic nozzle generator.

SonoFlux fluxers, including SonoFlux Servo, SonoFlux EZ, and SonoFlux 2000F systems, are available with ECHO ultrasonic generator technology. Energy efficient as well as- CE-certified and RoHS-compliant, ECHO accelerates swap out of any nozzle without changing any settings to facilitate maintenance and replacement of nozzles. Corrosion-resistant and IP67-rated M8 cable connection enhances...

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Spray Fluxing Systems have integrated ultrasonic nozzle generator.
Flux

Spray Fluxing Systems have integrated ultrasonic nozzle generator.

SonoFlux fluxers, including SonoFlux Servo, SonoFlux EZ, and SonoFlux 2000F systems, are available with ECHO ultrasonic generator technology. Energy efficient as well asÂ- CE-certified and RoHS-compliant, ECHO accelerates swap out of any nozzle without changing any settings to facilitate maintenance and replacement of nozzles. Corrosion-resistant and IP67-rated M8 cable connection...

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Water-Soluble Solder Paste is suited for PCB assembly.
Flux

Water-Soluble Solder Paste is suited for PCB assembly.

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.- In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack over...

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Water-Soluble Solder Paste is suited for PCB assembly.
Flux

Water-Soluble Solder Paste is suited for PCB assembly.

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.Â- In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack...

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Submerged Arc Welding Flux is formulated for chrome-moly steels.
Flux

Submerged Arc Welding Flux is formulated for chrome-moly steels.

Formulated to improve weld quality on chrome-moly, creep-resistant steels, SWX 160 provides low-residual content weld deposit to help reduce risk of temper embrittlement in high-temperature applications. This neutral, agglomerated, fluoride-basic flux also helps meet X-factor requirements and provides impact toughness. Resulting slag detaches easily to help minimize post-weld cleaning. Suitable...

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Submerged Arc Welding Flux is formulated for chrome-moly steels.
Flux

Submerged Arc Welding Flux is formulated for chrome-moly steels.

Formulated to improve weld quality on chrome-moly, creep-resistant steels, SWX 160 provides low-residual content weld deposit to help reduce risk of temper embrittlement in high-temperature applications. This neutral, agglomerated, fluoride-basic flux also helps meet X-factor requirements and provides impact toughness. Resulting slag detaches easily to help minimize post-weld cleaning. Suitable...

Read More »

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