New Flux Products

Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium

Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 in Niskayuna, New York, USA. Indium Corporation’s soldering materials for HIA applications have a proven track record of success in more than two billon front-end module SiP devices manufactured over the last three years....

New NC 256 Zero Residue Flux is Ideal for Lead Free Applications

Can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components. Used for soldering wetting and eliminates the cleaning process and can be used for mass reflow process or rework process. Designed for wafer ball bumping and advanced components attachment to eliminate cleaning process.

Spray Fluxing Systems have integrated ultrasonic nozzle generator.

SonoFlux fluxers, including SonoFlux Servo, SonoFlux EZ, and SonoFlux 2000F systems, are available with ECHO ultrasonic generator technology. Energy efficient as well as- CE-certified and RoHS-compliant, ECHO accelerates swap out of any nozzle without changing any settings to facilitate maintenance and replacement of nozzles. Corrosion-resistant and- IP67-rated M8 cable connection enhances...

Water-Soluble Solder Paste is suited for PCB assembly.

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.- In addition to- minimizing voiding on QFNs, BGAs, and CSPs, product also maintains tack over time...

Electric Aviation and a Sustainable Future

This white paper provides an in-depth overview into electric aviation and a sustainable future.

Submerged Arc Welding Flux is formulated for chrome-moly steels.

Formulated to improve weld quality on chrome-moly, creep-resistant steels, SWX 160 provides low-residual content weld deposit to help reduce risk of temper embrittlement in high-temperature applications. This neutral, agglomerated, fluoride-basic flux also helps meet X-factor requirements and provides impact toughness. Resulting slag detaches easily to help minimize post-weld cleaning. Suitable...

Submerged Arc Flux comes in lightweight, heavy-duty packaging.

OK submerged arc welding flux is available with Flux Pack™ packaging, which- uses heavy-duty LDPE (low-density polyethylene) material to protect dry agglomerated welding flux against moisture re-absorption from atmosphere. Packaging, by affording extended shelf life, ensures fresh and dry flux is ready to use for high-production SAW applications. Net weight of flux packaging is 50 lb, which...

Sono-Tek Corporation Sells 4,000 Fluxers in 40 Years

Milton, NY — Sono-Tek Corporation (OTC BB: SOTK) is proud to announce the sale of its 4,000th fluxer to Jabil Circuit Inc.- This milestone was achieved in Sono-Tek's 40th year in business. Sono-Tek's founder, Harvey Berger, invented and patented the first ultrasonic atomizing nozzle in 1975. Sono-Tek subsequently pioneered the ultrasonic spray fluxing industry for PCB manufacturing with the...

The Balver Zinn Group Going for VOC Emission Reduction with Low-VOC Fluxes during Productronica

The Balver Zinn Group announces that it will exhibit in Hall A4, Booth #261 at the international Productronica Trade Fair, scheduled to take place November 10 - 13, 2015 at the New Munich Trade Fair Centre in Munich, Germany. They will highlight the company’s extensive range of Cobar’s low-VOC fluxes for VOC emission reduction. In today’s production technology of electronic products the...

Indium Corporation Features Ultra-Low Residue No-Clean Flip-Chip Flux at SEMICON Taiwan

Indium Corporation will feature the newest in flux technology with its ultra-low and near-zero residue (ULR/NZR) no-clean Flip-Chip Flux product line at SEMICON Taiwan 2015 in Taipei, Taiwan. Indium Corporation’s ultra-low and near-zero residue no-clean Flip-Chip Fluxes eliminate the cost of cleaning flux residues and prevent damage to the die from stresses during cleanings. Flip-Chip Flux...

Flux Coating helps meet flatness, tight tolerance needs.

Available for solder preforms,- LV1000- is halide-free, meets ROL0 requirements, and- passes Telcordia GR-78 testing in unactivated state. Durability of glossy, uniform coating facilitates integration of this material into automated assembly processes, while minimal voiding accommodates bottom termination components that do not allow for proper outgassing of volatized flux. With tolerances...