Thin Bond Line Thermal Interface Material

Carteret, NJ – Sarcon® SG-26SL is an easy-to-apply, thermally conductive and electrically non-conductive silicone-based compound that exhibits a low thermal resistance.

When dispensed between a component such as a CPU or power converter and a heat sink, this material delivers a thermal conductivity of 2.6 W/m°K. The product's physical characteristics and minimal bleed and evaporation properties make Sarcon® SG-26SL a great choice for thin bond line applications. If any board re-work is required, the material can be removed by simply wiping with a cloth.

Sarcon® SG-26SL delivers consistent performance across broad temperatures ranging from -55°C to 205°C.  Packaging options include pre-filled syringes and bulk jars for manual or automated dispensing applications. 

About Fujipoly® America Corporation

Fujipoly® America Corporation is a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd. of Japan. A QS-9000-registered company, Fujipoly® America Corporation specializes in the fabrication of silicone rubber technology. It is a leader in the areas of elastomeric connectors, thermal interface materials, fusible tapes, LCD bezel assemblies, and custom silicon rubber intrusions. Fuji Polymer Industries Co., Ltd., has eight divisions worldwide, located in North America, Europe and Asia and an international network of distributors and representatives. The company's North American operations are based in Carteret, New Jersey. For more information, call (732) 969-0100 or visit us on the Web at

Fujipoly® Contact:      

Frank Hobler        

Fujipoly® America Corporation     


All Topics