Fujipoly America

Don't Get Stressed Out
Materials

Don't Get Stressed Out

Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...

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Fujipoly Introduces Sarcon 45-YR-a Thin Film with a Thermal Conductivity of 2.2 W/m.K
Optics & Photonics

Fujipoly Introduces Sarcon 45-YR-a Thin Film with a Thermal Conductivity of 2.2 W/m.K

The Sarcon 45-YR-a Thin Film is available in rolls or can be die-cut to required specification. It is suitable for applications that operate in temperatures ranging from -40°C to +150°C. The film features a thermal resistance as low as .33°C•in2/W. It is fabricated from silicone material with a thickness of 0.45 mm and eliminates the near-microscopic air gaps exist between heat source and...

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New Zebra Gold Elastomeric Connectors are Constructed from Silicone Core
Construction Equipment and Supplies

New Zebra Gold Elastomeric Connectors are Constructed from Silicone Core

The Zebra® Gold 8000 A Elastomeric Connectors are designed for transferring both data and power between parallel components and circuit boards. The unit features an electrical resistance of less than 25 mΩ. The connectors are offered in custom lengths ranging from 0.200 in. to 6.00 in. with heights ranging from 0.10 in. to 0.50 in. They come with 0.050 mm x 0.127 mm gold-plated element that...

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Company News

Cool Information from Fujipoly

Carteret, NJ —Thursday, January 16, 2020— Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful whitepapers and webinars as well as an extensive collection of Sarcon® thermal interface material performance datasheets. The whitepapers cover topics such as the Compression Characteristics of...

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Don't Get Stressed Out
Materials

Don't Get Stressed Out

Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...

Read More »
Company News

Fujipoly Announces $500.00 Winner

Carteret, NJ —Thursday, June 20, 2019—Joey Stephan from ETC, Inc. in Middleton, Wisconsin was recently selected as the 2019 Fujipoly® Stay Cool and Get Connected Giveaway winner. He chose a $500.00 American Express Gift Card that can be used for almost any online or instore purchase! All Joey had to do was name his favorite Fujipoly® product, Sarcon® Thermal Interface Material. Due to the...

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Company News

Fujipoly® Announces Free Thermal Interface Material Webinar

Carteret, NJ — Tuesday, February 05, 2019 — On February 26th at 1:30 PM ET, Fujipoly® will host a live webinar that reveals many of the advantages putty-type thermal interface materials offer compared to standard gap filler pads. Thermal interface material expert Christian Mainegra, will also host a live question and answer session immediately follow the 30-minute presentation. Key topics...

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