New Halogen Free Material Comes with Thermal Conductivity of 0.70 W/mK
Available with core thickness ranging from 0.0020 in. (0.05 mm.) to 0.063 in. (1.5 mm.). Capable of operating at continuous operating temperature up to 175°C. Ideal for applications requiring high voltage, high power, and long-term thermal stability.
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New Thermal Interface Material is Ideal for Applications with Delicate or Varied Height Components on PCB
Available in four sheet thicknesses (0.5, 1.0, 1.5, 2.0 mm.) up to a maximum dimension of 300 mm. x 200 mm. Delivers thermal conductivity of 8.0 W/m°K with thermal resistance as low as 0.05°C•in2/W at 43.5 PSI. Suitable for environments with operating temperatures ranging from -40 to +150°C.
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New Line of Thermal Gap Fillers with Electrical Insulative Properties
LG23A and LG30A simply dispense in a liquid form that will cure at room temperature. Delivers a thermal conductivity of 2.3 and 3.0 W/m°K respectively. Ideal for filling large, complex and uneven gaps between heat generating components.
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New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm
SARCON® thermal interface materials provide thermal conductivity between 1.3 and 4.5 W/m°K with a thermal resistance between 0.19 and 2.58°Cin2/W. Balances the performance demands of thermal conductivity, thermal resistance, gap thickness and production cost. Offered in pre-cut sheets that can be die-cut or trimmed to virtually any size or proprietary shape for the perfect component fit.
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Responsible Spill Remediation in the Food & Beverage Industry
There are two major areas in which food & beverage product handling will take place: processing and distribution. As with all product handling scenarios, spills are an inevitable occurrence within both of these spaces.
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New Thermal Gel from Henkel Offers Stable Viscosity in Storage and in Use
Accommodates gaps up to 3.0 mm. and provides production simplicity as pre-cured formulation requires no mixing or refrigeration. Features vertical gap stability with no slipping during more than 1,000 hours of gap stability testing. Can withstand environmental and positioning demands of infrastructure components.
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New PG45A Thermal Interface Material Requires Low Compression Force
Offers thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with thermal conductivity of 4.5 W/m°K. Available in three sheet thicknesses (1.5, 2.0, and 2.5 mm.) up to maximum dimension of 300mm x 200 mm. Operating temperature ranges from -40 to +150°C.
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New GAP PAD TGP 10000ULM Thermal Interface Materials are Ideal for Telecom and Datacom Applications
Provides high thermal conductivity of 10.0 W/m-K within an ultra-low modulus and low assembly stress formulation. Filler technology and low modulus formulations unite high thermal conductivity with low Page 2/2 assembly stress. Offers heat removal from critical components that supports 5G telecom infrastructure and consumer mobility designs.
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New TIM Gap Filler from Nanoramic Features High Thermal Stability
Available in Thermexit-HP-40 and Thermexit-El-20 variants. Thermexit-HP-40 offers >40W/mK high thermal conductivity while Thermexit-El-20 offers >20W/mK without the use of silicone-based resin. Ideal for consumer electronics, power supplies, automotive electronics, LED, LCD and optical displays, motor controls, high power density semiconductors, batteries and energy storage devices.
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New Heat Sink Grease from ACL Staticide is REACH and RoHS Compliant
Available in 5-ounce tubes that is compatible with most materials used in electrical and electronic assemblies. Offers dialectic strength and low bleed properties that make it ideal for various applications including engineering and design work. Comes in ready-to-use convenient delivery system that does not dry out, harden or melt.
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New Thermally Conductive Gap Filler Pads for Delicate Components or Widely Varying Gap Distances
Exhibits compression forces less than 15PSI, depending on thickness. Thickness options range from 1.00mm to 5.00mm with thermal conductivity between 1.5 and 2.8 W/m K. TIMs help avoid overstressing the PCB and fragile solder joints as interface material is compressed between the heatsink and board-level components during assembly.
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Eliminate Expensive Repairs with the Hot-Shot Pipe Thawing Machine
The new Hot Shot Pipe Thawing Machine delivers an innovative and highly effective approach to thawing frozen pipes. Easy to use and versatile, it is loaded with robust features that further suit it to many challenging environments. To learn all about it, see our video.
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