New Line of Thermal Gap Fillers with Electrical Insulative Properties
LG23A and LG30A simply dispense in a liquid form that will cure at room temperature. Delivers a thermal conductivity of 2.3 and 3.0 W/m°K respectively. Ideal for filling large, complex and uneven gaps between heat generating components.
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New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm
SARCON® thermal interface materials provide thermal conductivity between 1.3 and 4.5 W/m°K with a thermal resistance between 0.19 and 2.58°Cin2/W. Balances the performance demands of thermal conductivity, thermal resistance, gap thickness and production cost. Offered in pre-cut sheets that can be die-cut or trimmed to virtually any size or proprietary shape for the perfect component fit.
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New Thermal Gel from Henkel Offers Stable Viscosity in Storage and in Use
Accommodates gaps up to 3.0 mm. and provides production simplicity as pre-cured formulation requires no mixing or refrigeration. Features vertical gap stability with no slipping during more than 1,000 hours of gap stability testing. Can withstand environmental and positioning demands of infrastructure components.
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New PG45A Thermal Interface Material Requires Low Compression Force
Offers thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with thermal conductivity of 4.5 W/m°K. Available in three sheet thicknesses (1.5, 2.0, and 2.5 mm.) up to maximum dimension of 300mm x 200 mm. Operating temperature ranges from -40 to +150°C.
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Smart Pricing Labels for Smart Retailers
To learn more about ESLs and how companies like ZDA Communications can help, download this whitepaper now.
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New GAP PAD TGP 10000ULM Thermal Interface Materials are Ideal for Telecom and Datacom Applications
Provides high thermal conductivity of 10.0 W/m-K within an ultra-low modulus and low assembly stress formulation. Filler technology and low modulus formulations unite high thermal conductivity with low Page 2/2 assembly stress. Offers heat removal from critical components that supports 5G telecom infrastructure and consumer mobility designs.
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New TIM Gap Filler from Nanoramic Features High Thermal Stability
Available in Thermexit-HP-40 and Thermexit-El-20 variants. Thermexit-HP-40 offers >40W/mK high thermal conductivity while Thermexit-El-20 offers >20W/mK without the use of silicone-based resin. Ideal for consumer electronics, power supplies, automotive electronics, LED, LCD and optical displays, motor controls, high power density semiconductors, batteries and energy storage devices.
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New Heat Sink Grease from ACL Staticide is REACH and RoHS Compliant
Available in 5-ounce tubes that is compatible with most materials used in electrical and electronic assemblies. Offers dialectic strength and low bleed properties that make it ideal for various applications including engineering and design work. Comes in ready-to-use convenient delivery system that does not dry out, harden or melt.
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New Thermally Conductive Gap Filler Pads for Delicate Components or Widely Varying Gap Distances
Exhibits compression forces less than 15PSI, depending on thickness. Thickness options range from 1.00mm to 5.00mm with thermal conductivity between 1.5 and 2.8 W/m K. TIMs help avoid overstressing the PCB and fragile solder joints as interface material is compressed between the heatsink and board-level components during assembly.
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Don't Get Stressed Out
Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...
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New Sarcon GR45A for Higher Power Electronics Applications
Offered in thicknesses from 0.50mm to 5.0mm and can be custom cut to precisely fit the shape you need up to a maximum dimension of 300mm × 200mm. Delivers thermal conductivity of 6.0 W/m•K. Thermal resistance ranges from 0.24 to 0.70 °C•in2/W.
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Solve Any Large-scale Water Control Problem with the Aqua Dam Flood Barrier
Aqua Dam is the ultimate solution for large-scale water control projects. It combines lightweight, large size, and portability all in one innovative product. To learn more about the uses, and applications of Aqua Dam, or to see it in action, check out our new video to get all the details.
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