Fujipoly Releases Sarcon PG80A Thermal Interface Material for Applications Requiring Material Compression Between 30 and 90 Percent
Available in 0.5, 1.0, 1.5 and 2.0 mm sheet thicknesses up to maximum dimension of 300 x 200 mm. Exhibits a thermal resistance of 0.08°C.in²/W at 14.5 PSI and a thermal conductivity of 13 W/m°K. Suitable for applications with operating temperature ranging from -40 to +150°C.
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Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
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Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
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Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...
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Bulk Briner 101: What You Need to Know When Considering a Bulk Briner
If you're thinking about switching from packaged to bulk salt, check out this white paper and see if a bulk briner is right for your application.
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New Bergquist Gap Pad Thermal Interface Materials Feature Low Assembly Stress
Include TGP 6000ULM and TGP 7000ULM materials with thermal conductivity of 6.0 W/m-K and 7.0 W/m-K respectively. Offered in custom-cut shapes and sizes with top and bottom side protective liners. Used in telecom and datacom applications such as routers, switches, servers and base band units.
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Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material Irvine, CA – Notching its second notable industry prize, Henkel’s BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors in the Global Technology Awards’ adhesives/coatings/encapsulants/TIMs category. The award contest, which is sponsored by Global SMT and Packaging...
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Henkel Highlights Thermal Management Solutions at the Battery Show North America 2018
BERGQUIST® Brand Liquid and Pad Thermal Interface Materials Improve Performance, Lifetime and Reliability of Li-Ion Automotive Battery Systems Irvine, CA – Henkel’s BERGQUIST® brand of thermal management materials is the market leader in versatile, reliable and cost-effective heat dissipation solutions across nearly all electronic market segments. In the automotive space, specifically...
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New Thermal Interface Pad from Fujipoly Offers a Thermal Conductivity of 17.0 W/m.
Sarcon® 30XR-m Thermal Interface Pad is available in 200 mm × 150 mm size sheets with 0.3 mm thick TIM or can be die-cut to fit application shape. Exhibiting a thermal resistance of 0.30° C•in²/W, unit is used as an interface material between heat source and nearby heat sink.
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Electrolube Address Major Market Changes to the Thermal Management of LEDs
Ahead of emerging changes within the LED market, global electro-chemicals manufacturer, Electrolube, has addressed growing concerns affecting LED manufacturers regarding the thermal management of LEDs. The changes that will impact on the LED market are being driven by 2 major factors surrounding the issue of silicone. Firstly, silicone-based thermal management materials have been found to...
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Sarcon® GR14A-50GY Thermal Interface Material offers thermal conductivity of 1.6 W/m•K.
Sarcon® GR14A-50GY Thermal Interface Material is operated in a temperature range of -30 to +120°C. Unit is available in sheets of up to 300mm x 200mm dimensions and offers thermal resistance of .61° C•in2/W at 14.5 PSI. This 0.5mm thick product is offered in tacky surface, hardened surface or reinforced with nylon mesh. Thermal interface material is suitable for heat generating components...
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Simple Connection – MGB with EtherNet/IP
The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.
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