New GAP PAD TGP 10000ULM Thermal Interface Materials are Ideal for Telecom and Datacom Applications
Provides high thermal conductivity of 10.0 W/m-K within an ultra-low modulus and low assembly stress formulation. Filler technology and low modulus formulations unite high thermal conductivity with low Page 2/2 assembly stress. Offers heat removal from critical components that supports 5G telecom infrastructure and consumer mobility designs.
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New TIM Gap Filler from Nanoramic Features High Thermal Stability
Available in Thermexit-HP-40 and Thermexit-El-20 variants. Thermexit-HP-40 offers >40W/mK high thermal conductivity while Thermexit-El-20 offers >20W/mK without the use of silicone-based resin. Ideal for consumer electronics, power supplies, automotive electronics, LED, LCD and optical displays, motor controls, high power density semiconductors, batteries and energy storage devices.
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New Heat Sink Grease from ACL Staticide is REACH and RoHS Compliant
Available in 5-ounce tubes that is compatible with most materials used in electrical and electronic assemblies. Offers dialectic strength and low bleed properties that make it ideal for various applications including engineering and design work. Comes in ready-to-use convenient delivery system that does not dry out, harden or melt.
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New Thermally Conductive Gap Filler Pads for Delicate Components or Widely Varying Gap Distances
Exhibits compression forces less than 15PSI, depending on thickness. Thickness options range from 1.00mm to 5.00mm with thermal conductivity between 1.5 and 2.8 W/m K. TIMs help avoid overstressing the PCB and fragile solder joints as interface material is compressed between the heatsink and board-level components during assembly.
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The Business Sale Process
To learn more about BMI Mergers & Acquisition's 15-step plan, and how they can help you sell your business, download this white paper now.
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Don't Get Stressed Out
Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...
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New Sarcon GR45A for Higher Power Electronics Applications
Offered in thicknesses from 0.50mm to 5.0mm and can be custom cut to precisely fit the shape you need up to a maximum dimension of 300mm × 200mm. Delivers thermal conductivity of 6.0 W/m•K. Thermal resistance ranges from 0.24 to 0.70 °C•in2/W.
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New Thermal Gap Filler Available in Sheets up to 300 x 200 mm
Sarcon® GR80A-00-100GY delivers a thermal conductivity of 13.0 W/m•K with a thermal resistance of only 1.0° C•in2/W. Silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. Can be die-cut to fit users exact application shape.
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Fujipoly Releases Sarcon PG80A Thermal Interface Material for Applications Requiring Material Compression Between 30 and 90 Percent
Available in 0.5, 1.0, 1.5 and 2.0 mm sheet thicknesses up to maximum dimension of 300 x 200 mm. Exhibits a thermal resistance of 0.08°C.in²/W at 14.5 PSI and a thermal conductivity of 13 W/m°K. Suitable for applications with operating temperature ranging from -40 to +150°C.
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Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
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Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
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Custom Fabrication & Machining Services with Over 30 Years of Experience
As a trusted manufacturer to customers across a broad range of industries, Key Gas Components is a premier provider of CNC machining and tube fabrication. Our entire organization is quality driven and customer-centric, with broad-based manufacturing capabilities that can accommodate the most challenging requirements. See our video to learn more.
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