Thermal Interface Materials

New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm

New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm

SARCON® thermal interface materials provide thermal conductivity between 1.3 and 4.5 W/m°K with a thermal resistance between 0.19 and 2.58°Cin2/W. Balances the performance demands of thermal conductivity, thermal resistance, gap thickness and production cost. Offered in pre-cut sheets that can be die-cut or trimmed to virtually any size or proprietary shape for the perfect component fit.

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New TIM Gap Filler from Nanoramic Features High Thermal Stability

New TIM Gap Filler from Nanoramic Features High Thermal Stability

Available in Thermexit-HP-40 and Thermexit-El-20 variants. Thermexit-HP-40 offers >40W/mK high thermal conductivity while Thermexit-El-20 offers >20W/mK without the use of silicone-based resin. Ideal for consumer electronics, power supplies, automotive electronics, LED, LCD and optical displays, motor controls, high power density semiconductors, batteries and energy storage devices.

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New Heat Sink Grease from ACL Staticide is REACH and RoHS Compliant

New Heat Sink Grease from ACL Staticide is REACH and RoHS Compliant

Available in 5-ounce tubes that is compatible with most materials used in electrical and electronic assemblies. Offers dialectic strength and low bleed properties that make it ideal for various applications including engineering and design work. Comes in ready-to-use convenient delivery system that does not dry out, harden or melt.

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