New Sarcon GR45A for Higher Power Electronics Applications
Offered in thicknesses from 0.50mm to 5.0mm and can be custom cut to precisely fit the shape you need up to a maximum dimension of 300mm × 200mm. Delivers thermal conductivity of 6.0 W/m•K. Thermal resistance ranges from 0.24 to 0.70 °C•in2/W.
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New Thermal Gap Filler Available in Sheets up to 300 x 200 mm
Sarcon® GR80A-00-100GY delivers a thermal conductivity of 13.0 W/m•K with a thermal resistance of only 1.0° C•in2/W. Silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. Can be die-cut to fit users exact application shape.
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Fujipoly Releases Sarcon PG80A Thermal Interface Material for Applications Requiring Material Compression Between 30 and 90 Percent
Available in 0.5, 1.0, 1.5 and 2.0 mm sheet thicknesses up to maximum dimension of 300 x 200 mm. Exhibits a thermal resistance of 0.08°C.in²/W at 14.5 PSI and a thermal conductivity of 13 W/m°K. Suitable for applications with operating temperature ranging from -40 to +150°C.
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Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...
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Understanding Water Hammer
DFT Inc's engineers have been working with professionals in a range of industries for decades, helping to identify and resolve the underlying causes of water hammer. In this eBook you will learn about many of these common causes, how they impact your system and some of the basic changes you can make to eliminate them. In this eBook you will learn: What causes water hammer and why it is such a persistent problem. The role design plays in reducing the risk water hammer poses to your system. DFT's professional recommendations for coping with water hammer.
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Indium Corporation Introduces m2TIM Interface Material That Improves Thermal Conductivity
Available in InGa and InGaSn variants and offers wetting ability to metallic and non-metallic surfaces. Combines liquid metal with a solid metal preform for providing reliable thermal conductivity for heat dissipation. Exhibits low interfacial resistance and eliminates the risk of pump-out of the liquid alloy.
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Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...
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New Bergquist Gap Pad Thermal Interface Materials Feature Low Assembly Stress
Include TGP 6000ULM and TGP 7000ULM materials with thermal conductivity of 6.0 W/m-K and 7.0 W/m-K respectively. Offered in custom-cut shapes and sizes with top and bottom side protective liners. Used in telecom and datacom applications such as routers, switches, servers and base band units.
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Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material Irvine, CA – Notching its second notable industry prize, Henkel’s BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors in the Global Technology Awards’ adhesives/coatings/encapsulants/TIMs category. The award contest, which is sponsored by Global SMT and Packaging...
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Henkel Highlights Thermal Management Solutions at the Battery Show North America 2018
BERGQUIST® Brand Liquid and Pad Thermal Interface Materials Improve Performance, Lifetime and Reliability of Li-Ion Automotive Battery Systems Irvine, CA – Henkel’s BERGQUIST® brand of thermal management materials is the market leader in versatile, reliable and cost-effective heat dissipation solutions across nearly all electronic market segments. In the automotive space, specifically...
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New Thermal Interface Pad from Fujipoly Offers a Thermal Conductivity of 17.0 W/m.
Sarcon® 30XR-m Thermal Interface Pad is available in 200 mm × 150 mm size sheets with 0.3 mm thick TIM or can be die-cut to fit application shape. Exhibiting a thermal resistance of 0.30° C•in²/W, unit is used as an interface material between heat source and nearby heat sink.
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TPA Motion Introduces Industry's First Compact Robotic Positioner for Medical Devices
TPA Motion's microplate handling robots are designed specifically for medical instruments and lab automation devices. Check out the video to learn more.
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