Thermal Interface Materials

Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Thermal Interface Materials

Henkel Innovations Take Top Honors at IPC APEX EXPO Event

Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...

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Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019
Thermal Interface Materials

Indium Corporation Features Metal Thermal Interface Materials for Burn-in and Test at TestConX Workshop 2019

Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at TestConX on March 3-6 in Mesa, Ariz. A pure indium Heat-Spring® in the HSK pattern can be clad on one side with a thin layer of aluminum, which will prevent the indium from sticking to the device under test (DUT). Due to the thinness of the aluminum,...

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Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Thermal Interface Materials

Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade

Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material Irvine, CA – Notching its second notable industry prize, Henkel’s BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors in the Global Technology Awards’ adhesives/coatings/encapsulants/TIMs category. The award contest, which is sponsored by Global SMT and Packaging...

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Henkel Highlights Thermal Management Solutions at the Battery Show North America 2018
Thermal Interface Materials

Henkel Highlights Thermal Management Solutions at the Battery Show North America 2018

BERGQUIST® Brand Liquid and Pad Thermal Interface Materials Improve Performance, Lifetime and Reliability of Li-Ion Automotive Battery Systems Irvine, CA – Henkel’s BERGQUIST® brand of thermal management materials is the market leader in versatile, reliable and cost-effective heat dissipation solutions across nearly all electronic market segments. In the automotive space, specifically...

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Electrolube Address Major Market Changes to the Thermal Management of LEDs
Thermal Interface Materials

Electrolube Address Major Market Changes to the Thermal Management of LEDs

Ahead of emerging changes within the LED market, global electro-chemicals manufacturer, Electrolube, has addressed growing concerns affecting LED manufacturers regarding the thermal management of LEDs. The changes that will impact on the LED market are being driven by 2 major factors surrounding the issue of silicone. Firstly, silicone-based thermal management materials have been found to...

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Sarcon® GR14A-50GY Thermal Interface Material offers thermal conductivity of 1.6 W/m•K.
Miscellaneous Materials

Sarcon® GR14A-50GY Thermal Interface Material offers thermal conductivity of 1.6 W/m•K.

Sarcon® GR14A-50GY Thermal Interface Material is operated in a temperature range of -30 to +120°C. Unit is available in sheets of up to 300mm x 200mm dimensions and offers thermal resistance of .61° C•in2/W at 14.5 PSI. This 0.5mm thick product is offered in tacky surface, hardened surface or reinforced with nylon mesh. Thermal interface material is suitable for heat generating components...

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Simple Connection MGB with EtherNet/IP

The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.

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