Thermal Interface Materials

Don't Get Stressed Out
Thermal Interface Materials

Don't Get Stressed Out

Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...

Read More »
Henkel Innovations Take Top Honors at IPC APEX EXPO Event
Thermal Interface Materials

Henkel Innovations Take Top Honors at IPC APEX EXPO Event

Irvine, CA – At last month’s IPC APEX EXPO event in San Diego, CA, Henkel Corporation’s BERGQUIST® GAP PAD® TGP 7000ULM thermal interface material (TIM) and LOCTITE® ECCOBOND® UF 11173 underfill were selected as winning products in the Circuits Assembly magazine NPI Awards contest. The new underfill formulation was also chosen as one of five stand-outs in the IPC APEX EXPO Innovation...

Read More »

All Topics