Thermal Interface Materials

New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm
Thermal Interface Materials

New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm

SARCON® thermal interface materials provide thermal conductivity between 1.3 and 4.5 W/m°K with a thermal resistance between 0.19 and 2.58°Cin2/W. Balances the performance demands of thermal conductivity, thermal resistance, gap thickness and production cost. Offered in pre-cut sheets that can be die-cut or trimmed to virtually any size or proprietary shape for the perfect component fit.

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Don't Get Stressed Out
Thermal Interface Materials

Don't Get Stressed Out

Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...

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We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

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