Thermal Interface Materials

New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm

New Gap Filler Pads Range in Thickness from 0.50 to 5.00 mm

SARCON® thermal interface materials provide thermal conductivity between 1.3 and 4.5 W/m°K with a thermal resistance between 0.19 and 2.58°Cin2/W. Balances the performance demands of thermal conductivity, thermal resistance, gap thickness and production cost. Offered in pre-cut sheets that can be die-cut or trimmed to virtually any size or proprietary shape for the perfect component fit.

Read More »
New TIM Gap Filler from Nanoramic Features High Thermal Stability

New TIM Gap Filler from Nanoramic Features High Thermal Stability

Available in Thermexit-HP-40 and Thermexit-El-20 variants. Thermexit-HP-40 offers >40W/mK high thermal conductivity while Thermexit-El-20 offers >20W/mK without the use of silicone-based resin. Ideal for consumer electronics, power supplies, automotive electronics, LED, LCD and optical displays, motor controls, high power density semiconductors, batteries and energy storage devices.

Read More »
Do You Have Unique Lifting Needs?
Sponsored

Do You Have Unique Lifting Needs?

EZRig Cranes offers lifting solutions that are engineered for robust performance, providing the ultimate in portability. Designed for real-world lifting needs, our products are small and light with options and features that make them ideal for a broad range of applications. See our video to learn how an EZRig Crane can simplify your lifting requirements.

Read More »

All Topics