Thermoplastic Adhesive suits temporary mounting applications.

Press Release Summary:

Crystalbond(TM) 555 temporarily mounts ceramic substrates, semiconductors, and optical crystals that require dicing, polishing, and other machining processes. Ethoxylated-nonyl-phenol material bonds to ceramics, glasses, and metals. It becomes flowable at 120°F and dissolves in hot water. Transparency in thin cross-sections allows user to observe part during processing. Adhesive comes in 10-stick package.

Original Press Release:

New Temporary Mounting Adhesive Now Available

Valley Cottage, NY - August 27, 2004


Crystalbond(TM) 555, a new low melting point thermoplastic adhesive manufactured by Aremco Products, Inc., is now used for the temporary mounting of materials such as ceramic substrates, semiconductors and optical crystals, which require dicing, polishing and other machining processes.


Aremco's Crystalbond(TM) 555 is an ethoxylated nonyl phenol material which bonds readily to ceramics, glasses and metals. Crystalbond(TM) becomes flowable at 120°F and can be dissolved readily in hot water. It is also transparent in thin cross-sections, enabling the user to observe the part during processing.

Crystalbond(TM) 555 is optimal for use in low shear machining processes and for filling gaps and grooves in components requiring temporary mechanical support and to prevent breakout. Applications, found typically in the electronics industry, include dicing of piezoelectric transducers, microelectronic substrates, ceramic green tape, multilayer circuit boards, semiconductors, and optical crystals.

Crystalbond(TM) 555 is shipped in a standard ten stick package, 1/2 " x 1" x 7" per stick. For more information about this advanced product, please contact Aremco's Technical Sales Department.

Contact This Company

All Topics