Press Release Summary:
SARCONÂ® SF-Nd Phase Change Thermal Interface Pads have thermal conductivity of 2.0 W/m-K and thermal resistance of only 0.015Â°C inchÂ²/W, at 85 psi. When junction temperature reaches 60Â°C, phase change material changes from solid state and begins to flow, filling all micro-pores of component and heat sink. Wetting action removes all pockets of air, providing best possible heat transfer. Before device is heated, SarconÂ® SF-Nd is dry to the touch.
Original Press Release:
Fujipoly Announces High Performance Phase Change Thermal Interface Pads
Carteret, NJ - (September, 2002) - Fujipoly of America Corporation introduces the SARCON® SF-Nd Phase Change Thermal Interface Pads that features superior thermal conductivity and extremely low thermal resistance.
Fujipoly's SARCON® SF-Nd Phase Change Thermal Interface Pads have thermal conductivity of 2.0 watt/m-K and thermal resistance of only 0.015 degrees-C inch²/Watt, at 85 psi.
This exceptionally low thermal resistance is possible due to the wetting action of the material as it changes from a solid to a liquid at 60 degrees C.
When the junction temperature reaches 60 degrees, the phase change material changes from its solid state and begins to flow, filling all of the micro-pores of the component and heat sink.
This phase changing characteristic allows Sarcon® SF-Nd to compete with the very best of thermal greases.
As the material flows, the wetting action removes all pockets of air, thus providing the best possible heat transfer.
Before the devise is heated though, Sarcon® SF-Nd is dry to the touch and does not exhibit the messy attributes associated with thermal grease.
Sarcon® SF-Nd is perfectly suited for applications in many high-tech industries, such as the computer and game markets, where high speed microprocessors require only the best materials with the lowest thermal resistance.
Sarcon® SF-Nd is provided, kiss-cut, on a continuous roll and are easily removed by pulling on the release tab.
Once removed, the pad is placed on the component, or heat sink, and the release liner is easily removed, leaving only the thermal interface pad.
Thermal management components are necessary for maintaining a device's power while decreasing its size and weight. SARCON® SF-Nd complements the most stringent of design considerations to complement increasingly miniature electronic design objectives.
Among the many applications for Fujipoly's SARCON SF-Nd are heat pipes, microprocessors, thermal conductive insulators for semiconductors, compression jointing materials for thermistors and temperature sensors and thermal conductive material for a variety of heater types.
Prices are as low as .08 per square per square inch. Delivery of samples can be produced in one week. Low production volumes can be produced in three weeks while high production volumes can be produced in four to six weeks.
About Fujipoly of America Corporation
Fujipoly America Corporation is a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd. of Japan. A QS-9000-registered company, Fujipoly America Corporation specializes in the fabrication of silicon rubber technology. It is a leader in the areas of elastomeric connectors, thermal interface materials, fusible tapes, LCD bezel assemblies, and custom silicon rubber intrusions. Fuji Polymer Industries Co., Ltd., has six divisions worldwide, located in North America, Europe and Asia and an international network of distributors and representatives. The company's North American operations are based in Carteret, New Jersey. For more information, call (732) 969-0100 or visit us on the Web at www.fujipoly.com.