Burn-In Systems

LGA Socket supports 2.54 mm pitch devices.
Electronic Sockets

LGA Socket supports 2.54 mm pitch devices.

Designed to JEDEC STD. MO-220, Model CBT-LGA-5002 operates from -55 to 180°CÂ- and features IC guide for LGA edge alignment. Contactor consists of stamped spring pin with 19 g actuation force per pin and cycle life of 500,000 insertions. Unit has current capacity of 4 A, self inductance of 0.93 nH, insertion loss of less than 1 dB at 21.9 GHz, and capacitance of 0.097 pF. Mounted using...

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Electronic Sockets

LGA Socket for Hand Test/Burn-In operates from -55 to +180°C.

Used to test LGA package with 25 x 21 mm body and 0.5 mm pitch, CBT-LGA-5000 features IC guide that promotes precise LGA edge alignment, clamshell lid, and compression screw for applying down force. ContactorÂ- is stamped spring pin with 31 g actuation force per pin and cycle life of 500,000 insertions. Properties include contactor self inductance of 0.88 nH, insertion loss of

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QFP Test and Burn-In Socket offers movable ground pin option.
Burn-In Systems

QFP Test and Burn-In Socket offers movable ground pin option.

Matching QFP type IC packages with exposed pads, double shoulder contact IC500 Open Top series with movable ground pin option and no lead foot touching can be equipped with crown shaped or flat head ground pins to accommodate application requirements. Ground pin design allows center pin to actuate in conjunction with movement of push cover; 2-step actuation ensuresÂ- socket remains auto-load...

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Electronic Sockets

Extreme Temperature QFN Socket matches needs of 0.5 mm devices.

Model SBT-QFN-4016 socket features contactor, designed with outside spring and flat stamped plungers, offering 31 g actuation force/pin and cycle life of 500,000 insertions. Contactor has current capacity of 4 A and self-inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, and capacitance of 0.097 pF. Measuring 10 x 10 mm, socket mounts to PCB with no soldering and includes IC...

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QFN Socket supports 12 x 12 mm devices with 0.5 mm pitch.
Electronic Sockets

QFN Socket supports 12 x 12 mm devices with 0.5 mm pitch.

Designed to JEDEC STD, Model SBT-QFN-4015 features contact design with outside spring and flat stamped plungers for burn-in and test applications. Contactor provides current capacity of 4 A, self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, and 0.097 pF capacitance. Operating from -55 to +180°C, socket includes IC guide for precise QFD edge alignment, and swivel lid...

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Electronic Sockets

Hi-Temp CSP Sockets enable testing of any area-array device.

Accommodating use from -55 to +200°C, AR4HT Series incorporate low-profile (0.45 mm) contact structure that provides compliance for ATE testing and burn-in. Sockets work with various area-array devices, including BGA, LGA, QFN, DFN, CSP, MLCC, and POP, as well as bumped die with full and partial arrays. With life expectancy of 10,000+ actuations, products can accommodate IC devices with...

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BGA Socket addresses burn-in characterization requirements.
Electronic Sockets

BGA Socket addresses burn-in characterization requirements.

Featuring floating guide for precise ball to pin alignment, Model CBT-BGA-6011 supports 9 x 12 mm, 1 mm pitch, 48-position, 9 x 11 ball array configuration. Contactor delivers 0.93 nH self inductance, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Current capacity for each contactor is 8 A at 80°C temperature rise. Operating from -55 to...

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Electrical Contactors

Aehr Test Systems Announces Follow-on Waferpak(TM) Contactor Orders

Fremont, CA (August 5, 2010) - Aehr Test Systems (Nasdaq: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received approximately $2 million in follow-on orders for multiple FOX(TM)-1 WaferPak contactors from a leading manufacturer of semiconductor memory devices. The WaferPak contactors are scheduled to ship during the next four months. We are...

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Burn-In and Test Sockets feature clam-shell lid design.
Electronic Sockets

Burn-In and Test Sockets feature clam-shell lid design.

Suitable for most any package type, Burn-In and Test Sockets feature floating Z-axis pressure plate that allows for tolerances in package thickness. Sockets use flat pin technology for 0.4 mm, 0.5 mm, and larger pitch devices. Highest performance pin provides bandwidth up to 30 GHz at -1 db with current capacity of 3.0 A. Built with plastic and aluminum, machined semi-custom pogo pin sockets have...

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Spring Pin Socket addresses burn-in and test applications.
Electronic Sockets

Spring Pin Socket addresses burn-in and test applications.

Operating from -55 to +180°C, Model SBT-BGA-6505 features stamped spring pin contactor with 26 g actuation force per ball and cycle life of 100,000 insertions. Contactor provides self inductance of 0.88 nH, insertion loss of less than 1 dB at 20 GHz, capacitance of 0.097 pF, and current capacity of 4 A at 80°C temperature rise. Featuring floating guide for precise ball to pin...

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Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life
Sponsored

Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life

For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.

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