Burn-In Systems

Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System

Thermal Simulation Dramatically Reduces Time to Design Complex Burn-in Test System

(January 15, 2008) - Antares Advanced Test Technologies used Flomerics' Flotherm thermal simulation software to develop a new burn-in test system for electronic components in one-third the amount of time that would have been required using conventional design methods. The design of the test system was challenging because of the need to maintain low thermal resistance between the heating and...

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Burn-In System adapts to other vendor's boards.

Burn-In System adapts to other vendor's boards.

Providing 16 user-defined pattern and power zones, LC-1 Logic Burn-In with Test System accommodates 64 burn-in boards up to 24 x 12.5 in. and 128 I/O or 32 burn-in boards up to 24 x 24 in. and 256 I/O. Offering programmable temperature control up to 150Â-

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Test and Burn-In Socket suits applications up to 1 GHz.

Test and Burn-In Socket accommodates devices from 41-55 mmÂ-² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM,...

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Test and Burn-In Socket suits applications under 1 GHz.

Designed for use with devices from 14-27 mmÂ-², CSP/MicroBGA pressure-mounted socket requires no soldering and incorporates spring probe contacts, integral plastic alignment posts, and 4-point crown that ensures scrub on solder oxides. Signal path during test is 0.077 in. and operating temperature is -67 to +302Â-

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Test/Burn-In Socket accommodates devices up to 13 mm-².

Type BGA/CSP test and burn-in socket handles devices with pitch from 0.50 mm or larger in applications up to 1 GHz. Solderless, pressure-mount, compression spring probes are located by 2 molded plastic alignment pins and secured with 4 stainless steel screws. Socket accommodates up to 500,000 cycles. Spring probe contacts are 9-12 g per contact for 0.50-0.75 mm pitches, and 17-20 g per contact...

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Test Socket withstands rigors of burn-in and HAST testing.

Test Socket withstands rigors of burn-in and HAST testing.

Integra 27 has molded frame with custom-designed interposer insert and integral clamshell lid. Insert is loaded with spring-contact probes that offer insertion life of 500,000 cycles, inductance as low as 0.33 nH, and bandwidths well over 10 GHz. Socket is made of PPS with beryllium copper or nickel silver contacts. Temperature rating is -55 to +150Â-

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