Press Release Summary:
SolderPlus No Clean solder paste prepackaged alloy/flux blend is formulated for controlled application by automatic dispensing equipment. It provides control and speed in production soldering processes by producing consistent solder deposits without needing to remove flux residue. This tacky paste is suitable for electronic, electromechanical and telecommunications applications.
Original Press Release:
Solder Paste Produces Consistent Joints Without Cleaning
Lincoln, RI USA - SolderPlus No Clean solder paste increases control and speed in production soldering processes by producing consistent solder deposits without the need to remove flux residue. Typical uses include electronic, electromechanical, telecommunications and other applications where accuracy and high throughput are required.
SolderPlus is a prepackaged alloy/flux blend that is specially formulated for fast, controlled application with automatic dispensing equipment - a combination that provides a degree of
deposit control and consistency not attainable with traditional wire solder.
SolderPlus is a tacky material that stays in place, even on irregular surfaces and part geometries. It can be applied to one part at a time like wire solder or, for a dramatic increase in productivity, pre-applied to an entire batch of parts, then reflowed with in-line or batch heating methods.
Because the No Clean formulation leaves only a minimal amount of clear, hard, non-corrosive residue, there is no need for costly, time-consuming cleaning of parts after soldering.