Silicone Potting Compound features lightweight formulation.
Press Release Summary:
Utilizing advanced micro balloon technology fillers, 20-1634 Light Weight Silicone Potting Compound features specific gravity of 0.82, making it suited for applications that require low weight, flexibility, high heat resistance, and optimized electrical insulation properties. Two-component silicon elastomer features Shore A hardness of 34 and tensile strength of 125 psi. Formulated without solvents or other toxic materials, product is safe to handle and releases no by-products during cure.
Original Press Release:
Light Weight Silicone Potting and Encapsulating Compound
Adding less weight to electronic assemblies is an important consideration for design engineers. This is especially true for automotive, aerospace and consumer electronic applications. Our chemists developed the 20-1634 Light Weight Silicone Potting Compound to assist in keeping the weight off. The 20-1634 is less than half the weight of most commercially available potting and encapsulating compounds. The 20-1634 utilizes advanced micro balloon technology fillers and the result is a specific gravity of 0.82. Many filled potting compounds can have specific gravities of 2.0 or higher.
The 20-1634 is ideal for applications that require low weight, flexibility, high heat resistance, and excellent electrical insulation properties. It is also formulated without solvents or other toxic materials.
Epoxies, Etc. has been formulating solutions for electronic circuitry and assemblies for over 25 years. Our chemists and engineers are able to provide application support.
More information about the 20-1634 Silicone is available on our web site; http://www.epoxies.com/_resources/common/userfiles/file/20-1634R.pdf
Technical Support can be reached by phone 401-946-5564 or sales@epoxies.com Samples are available.
