New Encapsulants Products

Ceramic-Silicone Potting Compound suits applications to 900

Used to insulate moisture-sensitive electrical components, including cartridge heaters and high power case resistors, Sil-Bond(TM) 905 demonstrates moisture resistance with weight gain of less than 1% after exposure to 900-

Flexible Epoxy withstands cryogenic conditions.

Serviceable over wide range of 4 K to 250-

Process Technology Offers Ceramacast 675 High Temperature Potting Compound

Process Technology, manufacturer of electric immersion heaters, inline heaters, heat exchangers and temperature controls, is now offering Ceramacast 675 for over 70% below reail value. Ceramacast 675 is a high temperature, thermally conductive, aluminum nitride filled ceramic potting compound. It is used in the production of quick response sensors such as thermocouples and resistance temperature...

Potting Compound withstands temperature extremes.

With thermal conductivity of 25 BTU-in./hr-ft2--

Automation Streamlines Medical Kit Assembly

Automation technology is key to streamlining medical kit assembly operations. Our eBook delves into the benefits of automation, the industries it serves, and its role in COVID-19 response.

Ceramic Adhesive suits high temperature potting applications.

Magnesium oxide filled, water based, 2-part ceramic adhesive and coating system Ceramabond(TM) 672 can be used in assembly of high temperature catalytic converters for applications to 2,800-

Potting Compound has flexible, low-viscosity formulation.

Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound...

Ceramic Compound has compressive strength of 11,500 psi.

Ceramacast(TM) 646N is hydraulic-setting, phosphate-bonded, zirconium oxide filled ceramic compound used for encapsulating and potting high temperature electrical components to 3,000-ºF. Supplied as dry powder, potting compound sets hydraulically in 16-24 hr at room temperature. Cured material demonstrates volume resistivity of 109 W-cm and dielectric strength of 250 V/mil.

Silicon-Based Materials suit optical interconnect applications.

Optical Coupling Gel, OE-4000 consists of 2-part, high-purity, transparent silicone gel used for refractive index matching for silica-to-fiber and other optical junctions. One-part transparent silicone elastomer, OE-4100 provides refractive index shifting potential for planar silica-on-silicon optical components. Two-part Photonic-Grade Encapsulant OE-4200 consists of soft silicone elastomer for...

Epoxy Potting Compound provides electrical insulation.

Two-component EP121AO-1 offers thermal conductivity as well as thermal and dimensional stability. It features chemical resistance even when exposed to adverse environmental conditions. Service operating temperature is 475-500-

UV-Cure Encapsulants cure within 26-46 sec.

Hysol 3323, 3327, and 3329 are dam-and-fill products for encapsulation of wire-bonded dies used in Smart Card ICs. Used to form dam, high-viscosity Hysol 3323 has thixotropic nature and glass transition temperature (Tg) of 155-

DoorKing's 1601 Lane Barrier Provides a Higher Level of Traffic Control for Less

DoorKing is proud to introduce an easy add-on to its 1601 Barrier Gate Operator: The 1601 Traffic Lane Barrier. The barrier gate provides greater traffic control while eliminating the need for bollards or crash beams. Check out this video to learn more.