Press Release Summary:
Providing protection in extreme environmental conditions, 2-component 20-1634 is suitable for potting electronic assemblies and other industrial applications requiring low weight, flexibility, heat resistance, and optimized electrical insulation properties. Product cures in deep sections, eliminating need for multiple pours. Formulated without solvents or other toxic materials, compound is safe to handle and not hazardous for transportation.
Original Press Release:
Potting and Encapsulating Compound is Light as a Feather
Silicone Elastomer is Less than Half the Weight of Most Commercially Available Potting and Encapsulating Compounds
Epoxies, Etc. develops a low density, two component silicone elastomer. The 20-1634 is a great choice for potting electronic assemblies and other industrial applications requiring low weight, flexibility, high heat resistance, and excellent electrical insulation properties.
The 20-1634 also cures in deep sections eliminating the need for multiple pours. This compound is formulated without solvents or other toxic materials making it safe to handle and not hazardous for transportation.
• Low density
• Deep section curing
• Provides protection in extreme environmental applications
• Solvent free
Samples are available and may be requested from our website: www.epoxies.com
Thank you for considering the release of the 20-1634 Potting and Encapsulating Compound as a News Release in your publication. All inquiries will be handled promptly and professionally.