New EP17HTS-DA Die Attach Epoxy Meets MIL-STD-883J Requirements

Press Release Summary:

  • Offers high die shear strength of 35-40 kg-f at room temperature that is electrically conductive and can withstands high temperatures
  • Features low volume resistivity of less than 0.005 ohm-cm
  • Requires heat cure of 300°F for 2 to 3 hours, followed by post curing at 350°F for 1 to 2 hours

 


Original Press Release:

Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature

Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures. It is a silver filled system. Typically, glass transition temperature (Tg) declines with the addition of a filler like silver. However, with this specialty formulation, a high Tg of 140-150°C is maintained and it passes MIL-STD-883J thermal stability requirements at 200°C.

Its strength profile is also notably robust with a die shear strength of 35-40 kg-f at room temperature. EP17HTS-DA meets NASA low outgassing specifications and its service temperature extends from -80°F to 550°F. It has a low volume resistivity of less than 0.005 ohm-cm and also performs well as a heat conductor.

EP17HTS-DA is a thixotropic paste and can be easily dispensed manually or via automated dispensing systems. This compound is not premixed and frozen and has an unlimited working life at room temperature. It requires a heat cure of 300°F for 2 to 3 hours, followed by post curing at 350°F for 1 to 2 hours.

This product bonds well to many substrates including metals, ceramics and plastics. It is recommended for applications where low volume resistivity and high temperature resistance is required. EP17HTS-DA is available for use in syringes and glass jars, in sizes ranging from 20 grams to several pounds.

Master Bond Die Attach Adhesives
Master Bond EP17HTS-DA is a one part, electrically conductive epoxy with high glass transition temperature (Tg). It offers a high die shear strength and a convenient dispensing profile. Read more about Master Bond’s adhesives for die attach as well as other demanding microelectronic applications at https://www.masterbond.com/industries/die-attach-epoxy-adhesives or contact Tech Support. Phone: +1-201-343-8983 Fax: +1-201-343-2132 Email: technical@masterbond.com.

CONTACT
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: +1-201-343-8983
Fax: +1-201-343-2132

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