Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017

Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif.

Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF provides reliable and consistent dispensing of a standard racetrack deposit using automated time/pressure or auger-based dispensing equipment.

Indium8.9HF eliminates failure modes, such as blow-hole, reduces solder creep, and increases solder joint shear strength. The flux is suitable for use with all standard Pb-free higher-melting alloys, such as those based on SnSb and SnAg.

For more information about Indium Corporation’s Indium8.9HF solder paste, visit www.indium.com/indium8.9hf.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

Contact:

Anita Brown,

Corporate Communications

Indium Corporation

abrown@indium.com

tel: +1.315.381.7524 34

Robinson Road

Clinton, NY 13323 USA

www.indium.com

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