Flow Room Temperature Underfill eliminates pre-heating a substrate.
Press Release Summary:
SMT 88UL Flow Room Temperature Underfill provides reworkability, drop test, quicker storage conditions and thermal cycling performance. Unit comes with ability to flow into gaps below 10µm at room temperature. Product is suitable for microelectronics industry.
Original Press Release:
SMT 88UL Super-Fast Flow Room Temperature Underfill
YINCAE has developed a new innovative, room temperature flow, capillary underfill: SMT 88UL.
SMT 88UL is a super-fast flow capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate. As a result, SMT 88UL eliminates additional steps required for traditional capillary underfills, thus reducing process time and costs. In addition to costs savings, SMT 88UL offers excellent reworkability, very good drop test and thermal cycling performance, as well as easy storage conditions. These results point to SMT 88UL being the next generation board level underfill for the Microelectronics industry.
Additional information regarding SMT 88UL is available by contacting YINCAE at info@yincae.com.
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
Contact:
Eric
Technical Engineer
YINCAE Advanced Materials, LLC
19 Walker Way
Albany, NY, 12205
Phone: 518-452-2880
Url: www.yincae.com
Email: techsupport@yincae.com
