YINCAE Advanced Materials, LLC

YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
Adhesives & Sealants

YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance

YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...

Read More »
Adhesives & Sealants

SMT 158HA Liquid Encapsulant offers a CTE of 20 ppm/K.

Designed for large component with small bumps, SMT 158HA Liquid Encapsulant offers 156°C glass transition temperature and high adhesion strength. Unit’s high viscosity allows air to escape from gaps in underfilling processes. SMT 158HA provides conditions to enable void free underfill and enable the devices to exhibiting lower thermal stress.

Read More »
Adhesives & Sealants

High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste

(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the...

Read More »
Adhesives & Sealants

BP 256 Ball Attach Adhesive

(Albany, NY) January 13, 2017 - BP 256 is YINCAE’s new ball attach adhesive product. BP 256 has been designed to enhance solder joint reliability and eliminate cleaning processes for LEAD-FREE ball bumping procedures on CSP, BGA, Flip chip, and PoP devices. It is compatible with current ball bumping processes. BP 256 is generally applied via printing or pin transfer methods and can replace...

Read More »
Materials

Challenges of Miniaturization: Thermal Management

The semiconductor industry works continuously on making devices following Moore's Law, which states that the density of components will double every two years. This miniaturization has caused devices to become less effective at dealing with heat. Traditional methods are no longer viable as they are incapable of providing the necessary heat transfer. YINCAE has developed thermal management...

Read More »
YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
Adhesives & Sealants

YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance

YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...

Read More »
Company News

IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732

(Albany, NY) - 2/6/2018 – IPC APEX EXPO is just two weeks away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer. YINCAE Advanced Materials offers innovative and premier products including: adhesives,...

Read More »
Company News

IPC APEX 2018 is 1 Month Away! Visit YINCAE at Booth 2732

(Albany, NY) 1/8/2018 - IPC APEX EXPO is almost one month away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer. YINCAE Advanced Materials offers innovative and premier products including: adhesives,...

Read More »
Company News

IPC APEX 2018 is 2 Months Away! Visit YINCAE at Booth 2732

Albany, NY - 12/11/2017 - IPC APEX EXPO is nearly two months away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer. YINCAE Advanced Materials offers innovative and premier products including: adhesives,...

Read More »
Adhesives & Sealants

SMT 158HA Liquid Encapsulant offers a CTE of 20 ppm/K.

Designed for large component with small bumps, SMT 158HA Liquid Encapsulant offers 156°C glass transition temperature and high adhesion strength. Unit’s high viscosity allows air to escape from gaps in underfilling processes. SMT 158HA provides conditions to enable void free underfill and enable the devices to exhibiting lower thermal stress.

Read More »
Adhesives & Sealants

High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste

(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the...

Read More »

All Topics