YINCAE Advanced Materials, LLC

Materials

New NC 256 Zero Residue Flux is Ideal for Lead Free Applications

Can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components. Used for soldering wetting and eliminates the cleaning process and can be used for mass reflow process or rework process. Designed for wafer ball bumping and advanced components attachment to eliminate cleaning process.

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YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
Adhesives & Sealants

YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance

YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...

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Adhesives & Sealants

SMT 158HA Liquid Encapsulant offers a CTE of 20 ppm/K.

Designed for large component with small bumps, SMT 158HA Liquid Encapsulant offers 156°C glass transition temperature and high adhesion strength. Unit’s high viscosity allows air to escape from gaps in underfilling processes. SMT 158HA provides conditions to enable void free underfill and enable the devices to exhibiting lower thermal stress.

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Adhesives & Sealants

High Reliability & High Temperature Application Solution - Solder Joint Encapsulant Paste

(Albany, NY) September 15, 2017 - Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology - solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the...

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Materials

New NC 256 Zero Residue Flux is Ideal for Lead Free Applications

Can be screen or stencil printed, or dispensed onto the pads of component foot print or dipped onto solder ball of the components. Used for soldering wetting and eliminates the cleaning process and can be used for mass reflow process or rework process. Designed for wafer ball bumping and advanced components attachment to eliminate cleaning process.

Read More »
Company News

YINCAE Advanced Materials, LLC. Proudly Announces ISO 9001:2015 Certification

(Albany, NY) July 16, 2019 -- We’re proud to announce that YINCAE has received its official ISO 9001:2015 certification! This certification is a testament of YINCAE’s commitment to customer satisfaction, quality, and continuous improvement. ISO 9001 is a quality management system standard that was developed by the International Organization for Standardization, an association of governmental...

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YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance
Adhesives & Sealants

YINCAE Launches Diamond Filled Underfill SMT 158D with Higher Thermal Conductivity and Mechanical Resistance

YINCAE’s SMT 158D is a diamond filled liquid epoxy with a thermal conductivity of 6W/mK. The material is easy to dispense, minimizes induced stress and provides high-reliability performance. The epoxy is used for flip chips, chip scale packages, ball grid array devices and package and land grid array applications. The product is also suitable for bare chip protection such as memory cards, chip...

Read More »
Company News

IPC APEX 2018 is 2 Weeks Away! Visit YINCAE at Booth 2732

(Albany, NY) - 2/6/2018 – IPC APEX EXPO is just two weeks away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer. YINCAE Advanced Materials offers innovative and premier products including: adhesives,...

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Company News

IPC APEX 2018 is 1 Month Away! Visit YINCAE at Booth 2732

(Albany, NY) 1/8/2018 - IPC APEX EXPO is almost one month away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer. YINCAE Advanced Materials offers innovative and premier products including: adhesives,...

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Company News

IPC APEX 2018 is 2 Months Away! Visit YINCAE at Booth 2732

Albany, NY - 12/11/2017 - IPC APEX EXPO is nearly two months away! The trade show will take place at the San Diego Convention Center, in San Diego, CA, from February 27th to March 1st, 2018. YINCAE hopes you will stop by our booth # 2732, to learn more about YINCAE and the innovative products we have to offer. YINCAE Advanced Materials offers innovative and premier products including: adhesives,...

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We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

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