FIB/SEM Systems utilize 3D reconstruction software.

Press Release Summary:



Designed to work with all DualBeam focused ion beam/scanning electron microscope platforms, Auto Slice & View v4.0 software enables 3D structure and composition of samples at nanometer scale. Imaging can be combined with analytical capabilities, such as energy dispersive x-ray spectrometry and electron backscatter diffraction, to ensure that no information is lost in sectioning of sample. Algorithms help to ensure uniform thickness of slices and precise and reproducible placement of each cut.





Original Press Release:



FEI Enhances DualBeam Productivity, Precision and Ease-of-Use with New Slice & View Software



The ability to obtain faster, easier, better results increases productivity and lowers cost-per-sample. 



Hillsboro, Ore.—FEI (NASDAQ: FEIC) today announced the release of the latest version of its Auto Slice &View three-dimensional (3D) reconstruction software, which makes 3D imaging faster, easier, more accurate and cost effective. The software works with all of FEI’s current DualBeam focused ion beam (FIB)/scanning electron microscope (SEM) platforms to enable 3D structure and composition of samples at the nanometer scale. DualBeam users across all disciplines, including materials science, life sciences, semiconductor and oil & gas, can benefit from the new, enhanced software.



“FEI pioneered the development of the DualBeam and its use to reconstruct 3D structures,” said Jean-Bernard Cazeaux, vice president of FEI’s Applications Software Group. “This latest version of our Auto Slice & View software leverages our extensive experience to provide a better tool to enable users to obtain the results they need in a shortened timeframe -- and with limited effort. Ultimately, the results provide a better representation of all the information available from the sample volume and significant improvements in laboratory productivity.”



FEI’s new Slice & View software 4.0 features several enhancements, some of the highlights include:



Productivity – Imaging can be combined with analytical capabilities, such as energy dispersive x-ray spectrometry (EDS) and electron backscatter diffraction (EBSD), to ensure that no information is lost in the sectioning of the sample. Automated procedures can be modified on-the-fly, with the ability to add analytical signals if an unexpected feature is revealed. Imaging and analysis can be dynamically directed to selected areas of the section or applied only on certain slices to save time. Slice & View analyses can be performed at multiple sites to allow long, unattended runs over night or weekends. Advanced tiling and stitching capabilities maintain high spatial resolution over sections larger than a single field of view.



Precision and accuracy – New algorithms help to ensure uniform thickness of the slices and precise and reproducible placement of each cut, allowing for higher accuracy.



Ease of use – A redesigned interface optimizes user guidance and ensures that critical information is presented if needed. A prompted workflow approach streamlines the setup of automated procedures, and any procedure can be tagged as a template to serve as the basis for future analyses.



Current users of version 3.0 can upgrade to the new 4.0 version. For more information about FEI’s Auto Slice & View software, please visit http://www.fei.com/software/auto-slice-and-view/.



About FEI

FEI Company (Nasdaq: FEIC) designs, manufactures and supports a broad range of high-performance microscopy workflow solutions that provide images and answers at the micro-, nano- and picometer scales. Its innovation and leadership enable customers in industry and science to increase productivity and make breakthrough discoveries. Headquartered in Hillsboro, Ore., USA, FEI has over 2,800 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.

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