Epoxy Compound withstands exposure to thermal cycling.

Press Release Summary:

EP30FL Epoxy Potting and Encapsulation compound has low viscosity and can be used in both thick and thin cross sections. Generating low exotherm during cure, it cures at room temperature with low shrinkage. Electrically insulated compound adheres to both similar and dissimilar substrates, is 100% reactive, does not contain any volatiles, and withstands mechanical shock and vibration.

Original Press Release:


A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ. Master Bond EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherm during cure even though it cures relatively quickly at room temperature. Shrinkage upon cure is exceptionally low.

Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates. Because of its flexibility it is particularly recommended for use in environments exposed to thermal cycling. Additionally it can withstand mechanical shock and vibration. The hardened compound has superior electrical insulation properties and resistance to water.

Master Bond EP30FL is available in 1/2 pint, pint, quart, gallon and 5 gallon pail kits.

For further information, please contact:

James Brenner

154 Hobart Street, Hackensack, New Jersey 07601-3922

Tel: 201-343-8983 o FAX: 201-343-2132 Visit our Website at www.masterbond.com Or E-Mail us at Main@Masterbond.com

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