Electron Microscope has all-digital design.
Press Release Summary:
Tecnai(TM) G2 transmission electron microscope (TEM) achieves sub-Angstrom imaging and 0.1 eV analysis resolution at 200 kV. Run under Windows XP, Tecnai v3.0 operating software controls microscope and all detectors. It offers TEM Imaging and Analysis software with image and data processing functionality. Also included, Inspect3D Xpress hardware provides tomography reconstruction package that accelerates realignment and 3D reconstruction techniques.
Original Press Release:
FEI Introduces Hardware and Software Upgrades for Tecnai(TM) G2 TEM
New Operating Software, and Inspect3D Xpress Advance Tecnai's Fully Embedded Operation and Fast Time to Smart Data
HILLSBORO, Ore., Aug. 1 -- FEI released new software and hardware for its market-leading Tecnai(TM) G2 transmission electron microscope (TEM) at Microscopy and Microanalysis 2005 Conference today in Honolulu. The new software (Tecnai 3.0) delivers enhanced ease of operation of the Tecnai TEM and ensures full benefit of the system's leading- edge performance. The new hardware features an innovative computer-based technology, Inspect3D Xpress, for unprecedented speed with 3D image reconstruction.
The new Tecnai 3.0 operating software takes full digital control of the microscope and all detectors to the next level. Running under WindowsXP, the new software enhances overall system stability and performance, further boosting the Tecnai's ease of operation and decreased time to highest quality data. It includes a new version of TEM Imaging and Analysis software (TIA) with enhanced image and data processing functionality. The software now supports and embeds a wider scope of third-party CCD cameras.
The new Inspect3D Xpress is an all-new tomography reconstruction package that dramatically speeds quality realignment and 3D reconstruction techniques. This revolutionary product utilizes the latest computer technology to enhance image reconstruction speeds by a factor of 100x, achieving an industry milestone in high resolution 3D imaging.
"These software and accessory advances continue the Tecnai's promise of fast time to smart data and full system integration for greater productivity," said Vahe Sarkissian, FEI's CEO and Chairman. "Together, the Tecnai and our newly released Titan(TM) (S)TEM represent the most powerful solutions for ultra-high resolution electron microscopy for users working in NanoResearch, NanoBiology and NanoElectronics."
FEI's award-winning Tecnai G2 TEM remains an industry-standard for advanced ultra-high resolution electron microscopy with more than 500 Tecnai TEMs installed worldwide since 1998. The Tecnai's philosophy of fast time to smart data with proprietary applications software results in high productivity without compromising quality of results, making it ideal for every application and every market. It is currently the only all-digital transmission electron microscope system on the market and is the commercial platform that first achieved sub-Angstrom imaging (at 200kV) and analysis resolution (0.1eV at 200kV).
FEI will also feature its recently-released Nova NanoSEM and its line of industry-leading DualBeam(TM) (focused ion beam/scanning electron microscope) systems at this year's Microscopy and Microanalysis conference where more than 1,600 individuals are expected to will have an opportunity to see the latest developments from FEI and attend technical presentations from FEI scientists and customers.
About FEI
FEI's Tools for Nanotech(TM), featuring focused ion-and electron-beam technologies, deliver 3D characterization, analysis and modification capabilities with resolution down to the sub-Angstrom level. With R&D centers in North America and Europe and sales and service operations in more than 40 countries around the world, FEI is bringing the nanoscale within the grasp of leading researchers and manufacturers and helping to turn some of the biggest ideas of this century into reality. More information can be found on the FEI website at: www.feicompany.com/ .
CONTACT: Dan Zenka, APR, Director, Worldwide Public Relations for FEI Company/Corporate Headquarters, +1-503-726-2695, or dzenka@feico.com
Web site: www.feicompany.com/
