Press Release Summary:
Die Attach Adhesives offer low curing temperature ranging from 82 to 90°C. Product is used insulating and conductive die attach applications and provides high reliability, and high thermal and electrical conductivity.
Original Press Release:
DA 90 Low Temperature Die Attach Adhesive Series Materials
The DA 90 series materials are YINCAE’s new low temperature die attach adhesives. The DA 90 series offers conductive and insulating options to suit a large variety of applications. These products can be cured at low temperatures (82 – 90°C) and can be used for high temperature applications (215°C for 15 years). In addition to low temperature curing, these products also offer no delamination, high reliability, and high thermal and electrical conductivity. DA 90 series die attach adhesive materials are commercially available and are currently being used for insulating and conductive die attach applications.
Additional information regarding DA 90 products is available by contacting YINCAE at firstname.lastname@example.org.
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us by clicking the following link: http://www.yincae.com/.
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives