Press Release Summary:
DA 150 Series Die Attach Adhesives can be cured at 150°C. Adhesive is suitable for insulating and conductive die attach applications. Material offers high thermal conductivity, reliability and no delamination.
Original Press Release:
DA 150 High Temperature, Fast Cure Die Attach Adhesive Series Materials
The DA 150 series materials are YINCAE's new fast curing die attach adhesives. The DA 150 series offers conductive and insulating options to suit a large variety of applications. These products can be cured quickly at 150°C and offers outstanding electrical conductivity. In addition to these two major benefits, the DA 150 series materials also offers no delamination, high reliability, and high thermal conductivity. DA 150 series die attach adhesive materials are commercially available and are currently being used for insulating and conductive die attach applications.
Additional information regarding DA 150 products is available by contacting YINCAE at email@example.com.
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at www.yincae.com.
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.