CPS Technologies Offers Hermetic Microelectronic Packages
Ideal for military, electronics, satellite, and aerospace markets
CPS Technologies, the worldwide leader in the design and production of metal matrix composites, now offers hermetic microelectronic packages. Made from materials such as Kovar, aluminum, and steel, CPS' highly engineered hermetic microelectronic packages enable successful communication for military, electronics, satellite, and aerospace markets.
With over sixty years of combined experience in hermetic microelectronic packaging, CPS has supplied and assembled AlSiC (aluminum silicon carbide) components for use in hermetic microelectronic packages for select customers since 1987. It is now pleased to offer their hermetic microelectronic packages to the market at large.
CPS operates in a vertically integrated 38,000 square foot manufacturing facility in Norton, MA, which is certified to ISO:9001:2000. Providing quality assurance testing to MID-STD 883 and MIL-STD 202, CPS is compliant to DFARS clause 252.225-7014 ALT.1.
CPS' test and plating capabilities include Electrolytic Nickel per QQ-N-290 and ASTM B-689, Electroless Nickel per Mil-C-26074E and ASTM B-733, and Gold per ASTM B-488 and Mil-G-45205C.
About CPS Technologies
CPS Technologies is the worldwide leader in the design and high-volume production of metal matrix composites. With over 30 years combined experience, CPS engineers and scientists use a net-shape fabrication process, including patented QuickSet(TM) injection molding and QuickCast(TM) infiltration. AlSiC components are utilized in applications in the wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets. CPS' customers include TI, Motorola, HP, Agilent and Amkor. For more information on CPS' AlSiC components, contact CPS at 1 (508) 222-0614 x42; e-mail marko@alsic.com, or visit www.alsic.com.
