Electronic Packages

Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
Semiconductors

Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS

StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...

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StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
Electronic Packages

StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements

San Diego, CA - 16 October 2017 - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices. StratEdge...

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QFN Test Package features Nickel Palladium Gold plated terminal and ground pads.
Electronic Packages

QFN Test Package features Nickel Palladium Gold plated terminal and ground pads.

Designed with 100 pins, spaced very fine pitch at 0.4mm, QFN Test Package features Nickel Palladium Gold plated terminal and ground pads. Operating in -65⁰C to +150⁰C temperature range, packages are suitable in SMT process and thermal profile testing applications. Measuring 12 x 12 mm size with height not exceeding 1.0 mm, Unit’s zero-ohm connections are used for determining cause of PCB...

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CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.
Electronic Packages

CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.

Available for gallium nitride transistor and MMIC devices in leaded and leadless versions, CMC Base Laminate Packages can accommodate MMICs with die attach areas as high as 5.92 X 12.14 mm. Suitable in communications, radar, automotive, aerospace and defense applications, standard transistor package measures 0.8 in. Long x 0.23 in. Wide with 2 leads and epoxy sealed raised lid. CMC package...

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Electronic Packages

Future Electronics Promotes the 600 V E Series MOSFETs from Vishay

Pointe Claire, Quebec - Future Electronics, a global leading distributor of electronic components, recently announced immediate availability of Vishay's 600 V E Series MOSFETs in PowerPAK® 8 x 8. Vishay's 600 V E Series features Kelvin connections to reduce gate drive inductance. The construction of the PowerPAK 8 x 8 package allows one of the source pins to be arranged as a dedicated...

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Electronic Packages

Future Electronics Promotes Fairchild's Dual Cool MOSFET Packaging Technology

Pointe Claire, Quebec - Future Electronics, a global leading distributor of electronic components, recently announced immediate availability of Fairchild's Dual Cool™ MOSFET packaging technology. Fairchild's Dual Cool™ MOSFET packaging technology provides both bottom- and top-side cooling in the industry standard PQFN package, offering performance flexibility for designers. With...

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Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX® 10 FPGA Products
Arrays

Altera and TSMC Innovate Industry-first, UBM-free WLCSP Packaging Technology Platform for MAX® 10 FPGA Products

Companies Extend 55nm Embedded Flash Collaboration with Unique Packaging Innovation SAN JOSE, Calif. and HSINCHU, TaiwanÂ- – Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have produced an innovative, UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology that provides enhanced quality, reliability...

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Substrates

LED Packaging is custom tailored to requirements.

Designed to specific customer requirements, LED Substrates and SubmountsÂ- utilize variety of metallization technologies on alumina, AIN, and BeO ceramics, including PCTF® Plated Copper on Thick and Thin Film with 20–75 µm copper, AgENIG® Electroless Nickel and Immersion Gold over Silver, and DBC Direct Bond Copper with 125–250 µm copper. LED substrates for...

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Neagle Choice, LLC Announces New Available Services
Sponsored

Neagle Choice, LLC Announces New Available Services

Neagle Choice has long been known as a quality source for commercial sewing, printing, die cutting, and the manufacturing of a wide range of custom products. Enhancing our service capabilities has been the key to our success, and has driven our growth into many new and exciting markets. Continuing on this trajectory, we now offer precision laser cutting and etching, adding to our long line of manufacturing services. See our video to learn all about it.

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