StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
Accommodate frequencies up to 18 GHz Santee, Calif. — 18 November 2020 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz,...
Read More »
StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
Accommodate frequencies up to 18 GHz Santee, Calif. — 18 November 2020 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz,...
Read More »
StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020
~ Make an appointment to talk with our technical experts Santee, Calif. — 5 October 2020 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that StratEdge technical experts will be available to discuss the best types of packaging and...
Read More »
StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020
~ Make an appointment to talk with our technical experts Santee, Calif. — 5 October 2020 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that StratEdge technical experts will be available to discuss the best types of packaging and...
Read More »
Super Precision Bearings for Machine Tools: Factors For A Successful Spindle Bearing Set Up
This white paper provides an in-depth overview into choosing the right bearing for machine tools.
Read More »
Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure
Protect high-power laterally-diffused metal-oxide semiconductor (LDMOS), gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) devices. Uses copper-molybdenum-copper (CMC) bases to dissipate heat, increasing the power output the chip achieves and enabling the device to operate at cooler temperatures. Device is mounted directly onto layer of thermally-conductive copper and...
Read More »
Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure
Protect high-power laterally-diffused metal-oxide semiconductor (LDMOS), gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) devices. Uses copper-molybdenum-copper (CMC) bases to dissipate heat, increasing the power output the chip achieves and enabling the device to operate at cooler temperatures. Device is mounted directly onto layer of thermally-conductive copper and...
Read More »
New Thermally-efficient Packages Operate Efficiently at Frequencies as High as 63+ GHz
Enable compound semiconductor devices to meet the critical requirements of markets. Offers complete automated assembly services including gold-tin solder die attach. Ideal for compound semiconductor devices, such as gallium nitride (GaN) and gallium arsenide (GaAs).
Read More »
New Thermally-efficient Packages Operate Efficiently at Frequencies as High as 63+ GHz
Enable compound semiconductor devices to meet the critical requirements of markets. Offers complete automated assembly services including gold-tin solder die attach. Ideal for compound semiconductor devices, such as gallium nitride (GaN) and gallium arsenide (GaAs).
Read More »
Synopsys Releases Enhanced Security Package with Integrated Watchdog Timer
Available for ARC HS3x and HS4x processors to enable development of secure environment in embedded applications. Embedded with multiple privilege levels, integrity protection and MPU-based access controls that help to protect SoC against physical and logical attacks. Offers integrity protection for registers and memory to detect fault injection attacks.
Read More »
Synopsys Releases Enhanced Security Package with Integrated Watchdog Timer
Available for ARC HS3x and HS4x processors to enable development of secure environment in embedded applications. Embedded with multiple privilege levels, integrity protection and MPU-based access controls that help to protect SoC against physical and logical attacks. Offers integrity protection for registers and memory to detect fault injection attacks.
Read More »
560 and 572 Series IP67 Waterproof Inline Plug and Socket Connectors with Shock and Vibration Resistance
EDAC's new line of IP67 waterproof plug and socket connectors represent the cutting edge of waterproof connection technology. Part of the 560 and 572 series of connectors, they utilize innovative design concepts to deliver a level of performance and value that is unmatched in the industry. See our video to learn more.
Read More »
