Electronic Packages

StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications

StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications

Accommodate frequencies up to 18 GHz Santee, Calif. — 18 November 2020 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz,...

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StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020

StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020

~ Make an appointment to talk with our technical experts Santee, Calif. — 5 October 2020 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that StratEdge technical experts will be available to discuss the best types of packaging and...

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Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure

Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure

Protect high-power laterally-diffused metal-oxide semiconductor (LDMOS), gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) devices. Uses copper-molybdenum-copper (CMC) bases to dissipate heat, increasing the power output the chip achieves and enabling the device to operate at cooler temperatures. Device is mounted directly onto layer of thermally-conductive copper and...

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Synopsys Releases Enhanced Security Package with Integrated Watchdog Timer

Synopsys Releases Enhanced Security Package with Integrated Watchdog Timer

Available for ARC HS3x and HS4x processors to enable development of secure environment in embedded applications. Embedded with multiple privilege levels, integrity protection and MPU-based access controls that help to protect SoC against physical and logical attacks. Offers integrity protection for registers and memory to detect fault injection attacks.

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Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS

Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS

StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...

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StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements

StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements

San Diego, CA - 16 October 2017 - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices. StratEdge...

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QFN Test Package features Nickel Palladium Gold plated terminal and ground pads.

QFN Test Package features Nickel Palladium Gold plated terminal and ground pads.

Designed with 100 pins, spaced very fine pitch at 0.4mm, QFN Test Package features Nickel Palladium Gold plated terminal and ground pads. Operating in -65⁰C to +150⁰C temperature range, packages are suitable in SMT process and thermal profile testing applications. Measuring 12 x 12 mm size with height not exceeding 1.0 mm, Unit’s zero-ohm connections are used for determining cause of PCB...

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CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.

CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.

Available for gallium nitride transistor and MMIC devices in leaded and leadless versions, CMC Base Laminate Packages can accommodate MMICs with die attach areas as high as 5.92 X 12.14 mm. Suitable in communications, radar, automotive, aerospace and defense applications, standard transistor package measures 0.8 in. Long x 0.23 in. Wide with 2 leads and epoxy sealed raised lid. CMC package...

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Future Electronics Promotes Fairchild's Dual Cool MOSFET Packaging Technology

Pointe Claire, Quebec - Future Electronics, a global leading distributor of electronic components, recently announced immediate availability of Fairchild's Dual Cool™ MOSFET packaging technology. Fairchild's Dual Cool™ MOSFET packaging technology provides both bottom- and top-side cooling in the industry standard PQFN package, offering performance flexibility for designers. With enhanced...

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