CPS Technologies Corp.

Pin Fin Coolers suit hybrid vehicle IGBT applications.
Electronic Components & Devices

Pin Fin Coolers suit hybrid vehicle IGBT applications.

Coolers with AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates are designed for liquid-cooled, high-power module systems used in hybrid electric vehicle applications. They provide isotropic thermal expansion (8 ppm/°C) compatible with thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling....

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CPS Technologies Offers Hermetic Microelectronic Packages
Electronic Components & Devices

CPS Technologies Offers Hermetic Microelectronic Packages

Ideal for military, electronics, satellite, and aerospace markets CPS Technologies, the worldwide leader in the design and production of metal matrix composites, now offers hermetic microelectronic packages. Made from materials such as Kovar, aluminum, and steel, CPS' highly engineered hermetic microelectronic packages enable successful communication for military, electronics, satellite, and...

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Pin Fin Coolers suit hybrid vehicle IGBT applications.
Electronic Components & Devices

Pin Fin Coolers suit hybrid vehicle IGBT applications.

Coolers with AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates are designed for liquid-cooled, high-power module systems used in hybrid electric vehicle applications. They provide isotropic thermal expansion (8 ppm/°C) compatible with thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling....

Read More »
Company News

Ceramics Process Systems and sp³ Diamond Technologies form Strategic Partnership

CHARTLEY, Mass.-- Ceramics Process Systems Corporation (CPS) (OTC Bulletin Board: CPSX), a developer and manufacturer of Aluminum Silicon Carbide (AlSiC) thermal management and packaging solutions announced today a strategic partnership with spÂ-³ Diamond Technologies, Inc. (sp³), a supplier of DiaTherm(TM) diamond heat spreaders and diamond products for solving thermal management...

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CPS Technologies Offers Hermetic Microelectronic Packages
Electronic Components & Devices

CPS Technologies Offers Hermetic Microelectronic Packages

Ideal for military, electronics, satellite, and aerospace markets CPS Technologies, the worldwide leader in the design and production of metal matrix composites, now offers hermetic microelectronic packages. Made from materials such as Kovar, aluminum, and steel, CPS' highly engineered hermetic microelectronic packages enable successful communication for military, electronics, satellite, and...

Read More »
Company News

CPS Technologies Receives Subcontract from 3M Under Army Contract

July 11, 2006. Ceramics Process Systems Technologies (CPS) today announced that 3M Company recently awarded CPS a subcontract in support of 3M's U.S. Government R&D Agreement No. W15QKN-05-9-0700 titled Research and Development for Metal Matrix Technology Project. 3M and CPS are working under the sponsorship of the Armament Research, Development and Engineering Center (ARDEC) of the U.S. Army's...

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Company News

CPS Awarded Patent for Metal Matrix Composite Armor

CPS Corporation, the worldwide leader in the design and production of metal matrix composites, has recently been awarded a patent for their lightweight armor system (USPO #6955112B1). The armor is reinforced with AlSiC (Aluminum Silicon Carbide), a metal matrix composite, which is typically used for thermal management in electronics. Lightweight armor systems can be used for a wide range of...

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