Burn-in Sockets are designed for devices up to 6.5 mm2.
Press Release Summary:
Featuring 0.3 mm pitch, Center Probe and CSP/MicroBGA test and burn-in sockets include replaceable interposer sets and require minimal handler tooling for use in CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices for PCBs. Operating from -67 to +302°F, they also include solderless pressure mount compression spring probes, located by 2 molded plastic alignment pins and mounted with 2 SS screws. Signal path of sockets is 1.96 mm and each is rated for minimum of 500,000 cycles.
Original Press Release:
New 0.3 mm Pitch RF and Test & Burn-in Sockets for Devices Up to 6.5 mm2 Available from Aries Electronics
November 7, 2008
Bristol, Pa. - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers its high frequency Center Probe and CSP/MicroBGA test and burn-in sockets in sizes up to 6.5 mm2 with pitches down to 0.3 mm. The reduced socket pitch meets the growing need to test smaller components while increasing reliability.
The cost-effective sockets feature replaceable interposer sets and require minimal handler tooling for use in an increased number of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices. In addition, with an operating temperature from -55°C (-67°F) up to 150°C (302°F), the new sockets are ideal for devices that require exceptional thermal management qualities in a compact package.
The sockets' solderless pressure mount compression spring probes, accurately located by two molded plastic alignment pins and mounted with two stainless steel screws, enable easy mounting to and removal from the printed circuit board (PCB) for RF sockets and the burn-in-board (BIB) for test and burn-in sockets.
The heat-treated beryllium copper compression spring probes are plated in a minimum of 30 micron inches (0.75 micron mm) gold per MIL-G-45204 over a minimum of 30 micron inches (0.75 micron mm) nickel per SAE-AMS-QQ-N-290, so spring probes leave very small witness marks on the solder balls' bottom surface. The probe can be either sharp point (for non-BGA devices) or crown shape (for BGA). The four-point crown version ensures scrub on the solder balls and a pressure pad compression spring provides the proper force against the device to allow for height variations in device thickness.
Signal path of the sockets is only 0.077" (1.96 mm). Sockets with a 0.30 mm to 0.35 mm pitch feature only 15 g of contact force per contact and a test PCB diameter ("P") of 0.009" (0.23 mm). Each socket is rated for a minimum of 500,000 cycles.
Molded components come standard in UL94V-0 Ultem but, as with all Aries sockets, the new sockets are available in custom materials, platings, sizes and configurations to suit specific customer applications.
Pricing for a 100-lead socket starts at $300. Delivery is 4-5 weeks ARO.
For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: arieselec.com; Europe Email: europe@arieselec.com.
RF Datasheet #24013 - http://arieselec.com/products/24013.pdf
CSP/MicroBGA Datasheet #23021 - http://arieselec.com/products/23021.pdf
Headquartered in Bristol, Pa., Aries Electronics Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.
