Adhesive bonds ceramic to metal at temperatures to 3,000°F.
Press Release Summary:
Able to bond to ceramic, metal, and quartz substrates, Ceramabond(TM) 569 single-part, ceramic-filled paste cures by being heating at 200°F for 2 hr or drying at room temperature for 24 hr. It exhibits dielectric strength of 200 V/mil, volume resistivity of 109 ohm-cm, CTE of 4.2 in/in/°F, and torque strength of 6.0 lb-ft. Applied via brush, syringe, or automatic dispensing equipment, product offers moisture and thermal shock resistance.
Original Press Release:
New Ceramabond 569 Bonds Ceramic to Metal at High Temps
Valley Cottage, NY - November 18, 2005
SUMMARY
Ceramabond(TM) 569, a new high temperature ceramic adhesive developed by Aremco Products, Inc., is now used to assemble ceramic and metal components used in ultra high temperature applications to 3000 oF (1650 oC).
FEATURES
Ceramabond(TM) 569 is a single part, ceramic-filled paste that bonds tenaciously to ceramic, metal and quartz substrates. This compound is rated for operating temperatures to 3000 oF (1650 oC) and exhibits a dielectric strength of 200 volts per mil, volume resistivity of 109 ohm-cm, coefficient of thermal expansion of
4.2 in/in/ oF, and torque strength of 6.0 ft-lbs.
Ceramabond(TM) 569 is applied easily using a brush, syringe or automatic dispensing equipment. Once applied, curing is accomplished by heating at 200 oF for 2 hours or drying at room temperature for 24 hours. Cured product exhibits minimal shrinkage and offers exceptional mechanical strength, and moisture and thermal shock resistance.
Primary applications for Ceramabond(TM) 569 include the assembly of igniters, thermocouples, probes and sensors such as oxygen analyzers, gas chromatographs, mass spectrometers, and high vacuum components.
Ceramabond(TM) 569 is available from stock in pint, quart, gallon and five-gallon pails. For more information about this advanced product, please contact Aremco's Technical Sales Department.
