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Original Press Release
StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
Press release date: Oct 16, 2017
San Diego, CA - 16 October 2017 - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices. StratEdge molded ceramic packages come in over 200 standard outlines, dramatically increasing the packaging options for GaN devices. StratEdge also offers complete automated assembly and test services for these packages, including gold-tin solder die attach.
GaN devices are traditionally packaged in StratEdge's LL family of high-power laminate copper-moly-copper (CMC) base packages with a ratio of 1:3:1 CMC. These packages accommodate frequencies up to 63GHz. In the molded ceramic package, the standard Kovar® base can be replaced with CMC. For frequencies of 18 GHz or less, using a molded ceramic package provides the advantages of hermeticity, a broad array of outline packages, and lower cost, while the CMC provides the heat dissipation needed for GaN devices to meet requirements for aerospace applications. For SMT applications, these packages can be manufactured with gull-wing formed leads. They offer flexibility because it's inexpensive to change the lead design to match an existing footprint.
"StratEdge has hundreds of molded ceramic MC Series packages in standard, open-tooled configurations, which are all MIL-STD hermetic," said Tim Going, StratEdge president. "By swapping out their bases with CMC, you get a low-cost, high-power, fully hermetic packaging solution."
StratEdge will be exhibiting at the 2017 IEEE Compound Semiconductor IC Symposium (CSICS), being held October 22-25, at the Miami Marriott Biscayne Bay, Miami, FL. Stop by the StratEdge booth to discuss your packaging requirements.
StratEdge designs and manufactures high-performance semiconductor packages and provides chip assembly and test services. We specialize in packages for high-frequency, very high power, extremely demanding Gallium Arsenide (GaAs) and Gallium Nitride (GaN) devices and have a complete line of post-fired and molded ceramic semiconductor packages that operate from DC to 50+ GHz. Our patented electrical transition designs give StratEdge packages exceptionally low electrical losses, even at 50+ GHz. Markets served include telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, and MEMS. StratEdge is an ISO 9001:2008 facility.