Stratedge Corporation

Getting a Good Signal: StratEdge's High-Performance Power Amplifier Packages on the Red Planet
Communication Systems & Equipment

Getting a Good Signal: StratEdge's High-Performance Power Amplifier Packages on the Red Planet

Currently en route, again, on NASA's Mars 2020 Perseverance Rover Santee, Calif. — 4 February 2021 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that its SE20 power amplifier packages are playing a key role in transmitting signals with information gathered...

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StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
Electronic Components & Devices

StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications

Accommodate frequencies up to 18 GHz Santee, Calif. — 18 November 2020 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz,...

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StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020
Electronic Components & Devices

StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020

~ Make an appointment to talk with our technical experts Santee, Calif. — 5 October 2020 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that StratEdge technical experts will be available to discuss the best types of packaging and...

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Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure
Electronic Components & Devices

Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure

Protect high-power laterally-diffused metal-oxide semiconductor (LDMOS), gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) devices. Uses copper-molybdenum-copper (CMC) bases to dissipate heat, increasing the power output the chip achieves and enabling the device to operate at cooler temperatures. Device is mounted directly onto layer of thermally-conductive copper and...

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StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62
Electronic Components & Devices

StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62

San Diego, CA - 1 March 2018 - StratEdge Corporation, leader in the design, production, and assembly of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort...

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Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
Electronic Components & Devices

Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS

StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...

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Getting a Good Signal: StratEdge's High-Performance Power Amplifier Packages on the Red Planet
Communication Systems & Equipment

Getting a Good Signal: StratEdge's High-Performance Power Amplifier Packages on the Red Planet

Currently en route, again, on NASA's Mars 2020 Perseverance Rover Santee, Calif. — 4 February 2021 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that its SE20 power amplifier packages are playing a key role in transmitting signals with information gathered...

Read More »
StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications
Electronic Components & Devices

StratEdge Molded Ceramic: Straightforward Packaging Solutions for GaN Used in Mil-Std Applications

Accommodate frequencies up to 18 GHz Santee, Calif. — 18 November 2020 — StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz,...

Read More »
StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020
Electronic Components & Devices

StratEdge to Display New Broadband QFNs and Revolutionary Eutectic Die Attach for GaN Devices at IMAPS Virtual 2020

~ Make an appointment to talk with our technical experts Santee, Calif. — 5 October 2020 — StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that StratEdge technical experts will be available to discuss the best types of packaging and...

Read More »
Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure
Electronic Components & Devices

Latest Ceramic and Molded Ceramic Packages Support 5G Infrastructure

Protect high-power laterally-diffused metal-oxide semiconductor (LDMOS), gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) devices. Uses copper-molybdenum-copper (CMC) bases to dissipate heat, increasing the power output the chip achieves and enabling the device to operate at cooler temperatures. Device is mounted directly onto layer of thermally-conductive copper and...

Read More »
People in the News

Reginald Nocom Joins StratEdge as Process Engineer for Manufacturing Semiconductor Packages and IC Assembly Services

Santee, Calif - January 14, 2020 - StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that Reginald (Regi) Nocom has joined StratEdge as a process engineer. With over 20 years in the microelectronics industry and extensive experience in...

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People in the News

StratEdge President and CEO Tim Going Selected as a Finalist for the 2019 CEO of the Year Award

San Diego Business Journal honored local industry leaders' achievements San Diego, CA - July 24, 2019 - StratEdge Corporation, leader in the design, production, and assembly of high frequency and high power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that StratEdge president and CEO Tim Going has been selected as a finalist for the 2019...

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