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Available for gallium nitride transistor and MMIC devices in leaded and leadless versions, CMC Base Laminate Packages can accommodate MMICs with die attach areas as high as 5.92 X 12.14 mm. Suitable in communications, radar, automotive, aerospace and defense applications, standard transistor package measures 0.8 in. Long x 0.23 in. Wide with 2 leads and epoxy sealed raised lid. CMC package... Read More
Measuring 0.8 x 0.39 in., LL family of leaded laminate copper-moly-copper base packages include model LL802302, with 2 leads and raised lid with epoxy seal, and LL362302 flangeless, fully hermetic version with flat ceramic lid. Packages dissipate heat from compound semiconductor devices such as GaN, GaAs, and SiC. Suitable for applications through 6 GHz, both units can be used in RF radios for... Read More
Meeting MIL-STD hermetic requirements, SM series leadless SMT packages are suited for LEDs, MEMS, and optical devices used in aerospace, avionics, automotive, and telecom industry applications. Metal plug in base allows direct ground path for enhanced electrical performance, and outlines match industry standards for direct replacement of traditional quad flat package designs. With rated... Read More
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