Stratedge Corporation

StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62
Electronic Components & Devices

StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62

San Diego, CA - 1 March 2018 - StratEdge Corporation, leader in the design, production, and assembly of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort...

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Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
Electronic Components & Devices

Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS

StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...

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StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
Electronic Components & Devices

StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements

San Diego, CA - 16 October 2017 - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices. StratEdge...

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CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.
Electronic Components & Devices

CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.

Available for gallium nitride transistor and MMIC devices in leaded and leadless versions, CMC Base Laminate Packages can accommodate MMICs with die attach areas as high as 5.92 X 12.14 mm. Suitable in communications, radar, automotive, aerospace and defense applications, standard transistor package measures 0.8 in. Long x 0.23 in. Wide with 2 leads and epoxy sealed raised lid. CMC package...

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Electronic Components & Devices

Laminate IC Packages dissipiate heat from high-power devices.

Measuring 0.8 x 0.39 in., LL family of leaded laminate copper-moly-copper base packages include model LL802302, with 2 leads and raised lid with epoxy seal, and LL362302 flangeless, fully hermetic version with flat ceramic lid. Packages dissipate heat from compound semiconductor devices such as GaN, GaAs, and SiC. Suitable for applications through 6 GHz, both units can be used in RF radios for...

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Electronic Components & Devices

Fully Hermetic, SMT Packages have leadless, low-profile design.

Meeting MIL-STD hermetic requirements, SM series leadless SMT packages are suited for LEDs, MEMS, and optical devices used in aerospace, avionics, automotive, and telecom industry applications. Metal plug in base allows direct ground path for enhanced electrical performance, and outlines match industry standards for direct replacement of traditional quad flat package designs. With rated...

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Company News

StratEdge Receives ISO 9001:2015 Quality Management Systems Certification

San Diego, CA - 22 August 2018 - StratEdge Corporation, leader in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, announces that DNV GL - Business Assurance has found StratEdge Corporation to conform to the Quality Management System standard ISO 9001:2015. The certificate is valid for the design and...

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StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62
Electronic Components & Devices

StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference at Booth 62

San Diego, CA - 1 March 2018 - StratEdge Corporation, leader in the design, production, and assembly of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort...

Read More »
Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
Electronic Components & Devices

Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS

StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 in Tel Aviv, Israel. In addition to StratEdge products, Elecsys will be showing J...

Read More »
StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
Electronic Components & Devices

StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements

San Diego, CA - 16 October 2017 - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz, including gallium nitride (GaN) devices. StratEdge...

Read More »
CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.
Electronic Components & Devices

CMC Base Laminate Packages are built with base material ratio of 1:3:1 CMC.

Available for gallium nitride transistor and MMIC devices in leaded and leadless versions, CMC Base Laminate Packages can accommodate MMICs with die attach areas as high as 5.92 X 12.14 mm. Suitable in communications, radar, automotive, aerospace and defense applications, standard transistor package measures 0.8 in. Long x 0.23 in. Wide with 2 leads and epoxy sealed raised lid. CMC package...

Read More »
Electronic Components & Devices

Laminate IC Packages dissipiate heat from high-power devices.

Measuring 0.8 x 0.39 in., LL family of leaded laminate copper-moly-copper base packages include model LL802302, with 2 leads and raised lid with epoxy seal, and LL362302 flangeless, fully hermetic version with flat ceramic lid. Packages dissipate heat from compound semiconductor devices such as GaN, GaAs, and SiC. Suitable for applications through 6 GHz, both units can be used in RF radios for...

Read More »
Electronic Components & Devices

Fully Hermetic, SMT Packages have leadless, low-profile design.

Meeting MIL-STD hermetic requirements, SM series leadless SMT packages are suited for LEDs, MEMS, and optical devices used in aerospace, avionics, automotive, and telecom industry applications. Metal plug in base allows direct ground path for enhanced electrical performance, and outlines match industry standards for direct replacement of traditional quad flat package designs. With rated...

Read More »

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