Solder Joint Encapsulant for Ball Bumping Applications: BP 256


Albany, NY – YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant.



YINCAE's BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications, creating a solder joint bond that is 5-to-10 times stronger than a conventional solder joint. Thus, using BP 256 eliminates the cleaning process due to the nature of epoxy and the later underfilling process. The products are also designed for use in lead-free, Sn/Pb and Sn/Bi processes.



Although encapsulant products are not new, the industry has been hard pressed to find an encapsulant that performs like the BP 256. YINCAE's BP 256 eliminates the need for flux, underfilling, and the cleaning process. BP 256 demonstrates superior performance, can be applied at low temperatures, and is 100% reworkable.



Additional information on the product series is available on our Website at: http://www.yincae.com/technical-information.html or by contacting YINCAE at: tfarrell@yincae.com.



YINCAE Advanced Materials, LLC is a leading manufacturer and supplier of high-performance coatings, adhesives and encapsulants used in the computer microchip and optoelectronics industries. Our manufacturing operations and headquarters are located in Albany, NY USA, with technical sales and support available through a worldwide sales and service organization.



FOR ADDITIONAL INFORMATION CONTACT:

Taylor Farrell

Business Development Specialist

YINCAE Advanced Materials, LLC

19 Walker Way

Albany, NY 12205

Phone: (518) 452-2880

E-mail: tfarrell@yincae.com

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