Renesas Electronics America Inc.
Santa Clara, CA 95050
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New RX23W Module Incorporates Trusted Secure IP (TSIP)
Equipped with antenna, oscillator and custom-matched circuit. Supports Bluetooth 5.0 low energy communication, including long-range and 2 Mbps data throughput. Delivers communication characteristics, with reception sensitivity level of −105 dBm at 125 kbps.
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New RA6M5 Group MCUs Support Error Correction Code in RAM
Employ Arm® Cortex®-M33 core based on Armv8-M architecture. Feature Arm TrustZone® technology and secure crypto engine. Offer numerous communication interface options, including CAN FD, Ethernet MAC, and multiple serial interfaces.
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Renesas Introduces Complete Power and Functional Safety Solution for R-Car V3H ADAS Camera Systems
New Synchronous Buck Pre-Regulator and Safe Seven-Channel PMIC Combine to Reduce Power Loss, System Cost and Design Time Tokyo, Japan, March 30, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a new power and functional safety solution for systems based on the R-Car V3H system-on-chip (SoC) for advanced driver assistance...
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New RE01B Microcontroller Comes with On-Chip Energy Harvesting Control Circuit
Features Arm Cortex®-M0+ core with maximum operating frequency of 64 MHz. Supports Bluetooth 5.0 with long range (up to 400 m) and high data throughput (2 Mbps). Operates in voltage range from 1.62 V to 3.6 V with high-speed operation of up to 64 MHz.
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New Timing Solutions Deliver Phase Noise and High Clock Frequency
8V19N850 radio synchronizer is suitable for use in emerging 5G O-RAN networks for radio units. 8V19N880 and 8V19N882 clock jitter attenuators support frequencies up to 3932.16 MHz. Offers jitter performance as low as 74fs RMS and -90dB spurious attenuation.
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Renesas Intersil-Brand Radiation-Hardened ICs Onboard the Hayabusa2 Six-Year Asteroid Samples Retrieval Mission
JAXA’s Hayabusa2 Spacecraft Enabled by Renesas’ Intersil-Brand Rad-Hard ICs TOKYO, Japan, February 25, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the Hayabusa2 spacecraft that returned asteroid samples to Earth in an armored...
Read More »Renesas and LUPA Accelerate Automotive Smart Camera Development with Open Platform Turnkey Solutions
Jointly-Developed Open Camera Platform Significantly Shortens Time to Mass Production of Euro NCAP, C-NCAP, and L2+ Applications TOKYO, Japan and BERLIN, Germany, February 24, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and LUPA-Electronics GmbH, an automotive safety solution provider, today announced the EagleCAM module, an open...
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New R-Car V3U System-on-Chip Meets ISO 26262 Automotive Functional Safety Standard
Integrates multiple safety mechanisms for fast detection of and response to random hardware failures. Delivers 60.4 TOPS and 13.8 TOPS/W in CNN Processing. Ideal for applications such as next-generation ADAS and AD systems.
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New Server Clock Generator is CK440Q-Compliant
Features PCIe Gen5 and UPI v2.0-compliant clocks for 32GT/s SerDes. Supports multiple CPU socket topologies, ranging from self-contained single socket to modular multi-socket approaches. Designed for next-generation Intel platforms used in high-performance computing and data center applications.
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New RA4M2 MCU is Ideal for Low Power Applications
Features 100-MHz Arm Cortex-M33 core with TrustZone technology. Offers operating current of 80 µA/MHz in active mode, and standby current of 0.7 mA. Comes with fast wakeup time from standby of 30 µs.
Read More »Renesas RX MCU Becomes Worlds First General-purpose MCU to Obtain CMVP Level 3 Certification Under NIST FIPS 140-2 Security Standard
By Using Certified RX MCUs, Customers Can Easily Develop Devices Meeting Security Requirements Tokyo, Japan, April 22, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its 32-bit RX65N microcontroller (MCU) has achieved Cryptographic Module Validation Program (CMVP) (Note 1) Level 3 certification under the FIPS...
Read More »Renesas and SiFive Partner to Jointly-develop Next-Generation High-End RISC-V Solutions for Automotive Applications
SiFive to License Industry-Leading RISC-V Core IP Portfolio to Renesas TOKYO, Japan, and SAN MATEO, Calif., April 21, 2021 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and SiFive, Inc., the industry leader in RISC-V processors and silicon solutions, today announced a strategic partnership to jointly develop next-generation, high-end...
Read More »Renesas Collaborates with Qualcomm Technologies to Speed Mainstream Adoption of Wireless Charging for Smartphones
New Reference Design Expands Best-in-Class Wireless Charging for Mass Market Devices; Solution for 5G Smartphones Available Now Tokyo, Japan, April 14, 2021 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, has expanded its ongoing work with Qualcomm Technologies, Inc., a leader in wireless technologies, to include 30W wireless charging...
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New RX23W Module Incorporates Trusted Secure IP (TSIP)
Equipped with antenna, oscillator and custom-matched circuit. Supports Bluetooth 5.0 low energy communication, including long-range and 2 Mbps data throughput. Delivers communication characteristics, with reception sensitivity level of −105 dBm at 125 kbps.
Read More »
New RA6M5 Group MCUs Support Error Correction Code in RAM
Employ Arm® Cortex®-M33 core based on Armv8-M architecture. Feature Arm TrustZone® technology and secure crypto engine. Offer numerous communication interface options, including CAN FD, Ethernet MAC, and multiple serial interfaces.
Read More »
Renesas Introduces Complete Power and Functional Safety Solution for R-Car V3H ADAS Camera Systems
New Synchronous Buck Pre-Regulator and Safe Seven-Channel PMIC Combine to Reduce Power Loss, System Cost and Design Time Tokyo, Japan, March 30, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a new power and functional safety solution for systems based on the R-Car V3H system-on-chip (SoC) for advanced driver assistance...
Read More »
New RE01B Microcontroller Comes with On-Chip Energy Harvesting Control Circuit
Features Arm Cortex®-M0+ core with maximum operating frequency of 64 MHz. Supports Bluetooth 5.0 with long range (up to 400 m) and high data throughput (2 Mbps). Operates in voltage range from 1.62 V to 3.6 V with high-speed operation of up to 64 MHz.
Read More »
New Timing Solutions Deliver Phase Noise and High Clock Frequency
8V19N850 radio synchronizer is suitable for use in emerging 5G O-RAN networks for radio units. 8V19N880 and 8V19N882 clock jitter attenuators support frequencies up to 3932.16 MHz. Offers jitter performance as low as 74fs RMS and -90dB spurious attenuation.
Read More »
Renesas Intersil-Brand Radiation-Hardened ICs Onboard the Hayabusa2 Six-Year Asteroid Samples Retrieval Mission
JAXA’s Hayabusa2 Spacecraft Enabled by Renesas’ Intersil-Brand Rad-Hard ICs TOKYO, Japan, February 25, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the Hayabusa2 spacecraft that returned asteroid samples to Earth in an armored...
Read More »Renesas and LUPA Accelerate Automotive Smart Camera Development with Open Platform Turnkey Solutions
Jointly-Developed Open Camera Platform Significantly Shortens Time to Mass Production of Euro NCAP, C-NCAP, and L2+ Applications TOKYO, Japan and BERLIN, Germany, February 24, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and LUPA-Electronics GmbH, an automotive safety solution provider, today announced the EagleCAM module, an open...
Read More »