Renesas Electronics America Inc.
Santa Clara, CA 95050
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Renesas Electronics Innovative Automotive Chips Adopted by Nissan for its New Skyline ProPILOT 2.0
Tokyo, Japan, August 7, 2019 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that Nissan Motor Co., Ltd. has adopted Renesas’ innovative and high-peformance automotive technology for the ProPILOT 2.0 system featured in the new Nissan Skyline unveiled on July 16, 2019. The driver assistance system combines navigated highway...
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New RX651 MCUs with 64-pin BGA and 64-pin LQFP Package
Provides performance with 520 CoreMark® score at 120 MHz and power efficiency with a 35 CoreMark/mA score. Addresses advanced security needs for endpoint devices employing compact sensor and communication modules. Enables data exchange to change production instructions and reprogram MCU memory to update equipment settings.
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New RV1S9x60A Photocouplers Feature High Common Mode Rejection up to 50 kV/microsecond
RV1S9160A, RV1S9060A and RV1S9960A operates at 2.0mA, 2.2mA and 3.8mA respectively. Offer packages with the small footprint for each reinforced isolation (up to 690 Vrms). Withstands harsh operating environments of industrial and factory automation equipment.
Read More »Microcontroller suits automotive powertrain control.
Built around 32-bit SH-2A CPU core on 90 nm process, SH72531 is supplied in 24 x 24 x 0.5 mm, 176-pin LQFP package. It integrates 1.25 MB on-chip Flash memory and supports 120 MHz operation at temperatures up to 125-
Read More »Driver-MOSFET achieves 96.5% power supply efficiency.
Supplied in 6 x 6 x 0.95 mm, 40-pin QFN package with 0.5 mm lead pitch, R2J20651NP is 35 A integrated driver-MOSFET for CPU and DDR type SDRAM power supplies in PCs and servers. It conforms to Intel-® DrMOS specifications and achieves max efficiency when running at switching speed of 200 kHz and producing 1.8 Vdc from 5 Vdc input. Comprised of 2 high-side/low-side power MOSFETs and driver...
Read More »Dual-Core SoC offers built-in image recognition processing.
Intended for car navigation systems, Model SH7776 integrates two SH-4A 32-bit CPU cores on single chip and achieves processing performance of 1,920 MIPS when operating at 533 MHz. Graphics engine incorporates PowerVR SGX 3-D graphics IP, which supports 3-D rendering. Model SH7776 also incorporates 2D and 3D graphics processor for detailed map rendering. Two-channel 16-bit dedicated bus interface...
Read More »ICs enable precision battery-remaining detection.
R2J24020F Group ICs are available in SiP configuration that features 16-bit MCU integrated with A/D converter for measuring current and voltage. Designed for lithium-ion battery packs with Smart Battery System (SBS) support, ICs are available in 3 flash memory capacities for storing MCU programs and come in compact 48-pin LQFP package. E8a Emulator on-chip debugger with single-pin interface...
Read More »Digital Amplifier supports IIS digital audio signal input.
Featuring built-in 24-bit audio DSP, R2J15116FP delivers stereo output to 2 speakers at up to 15 W/channel, and is intended for use in thin flat-screen TVs employing LCD or plasma display panels. It features compact package measuring 7 x 7 mm, uses feedback circuit to stabilize output level during voltage fluctuations, while it's DSP also performs processing for volume control and parametric...
Read More »MCUs feature extended operating voltage range of 1.8-5.5 V.
Built on 16-bit CPU core, Series R8C/3x MCUs incorporate analog functions such as level-only-sensitive power-on reset circuits, digital-to-analog converters, and analog comparators. Devices are offered in 3 product groups including 52-, 32-, and 20-pin packages in R8C/35A, R8C/33A, R8C/32A group, respectively. MCUs have on-chip oscillator that provides precise clock signals at 40, 36.864, or 32...
Read More »Smart Card Microcontroller suits financial applications.
Intended for identification and financial applications, 32-bit Model AE55C1 incorporates CPU core, 40 Kbytes of EEPROM, and 240 Kbytes mask ROM. Upward compatibility with existing system facilitates migration to AE55C1 and system development.
Read More »Renesas RX MCU Becomes World's First General-purpose MCU to Obtain CMVP Level 3 Certification Under NIST FIPS 140-2 Security Standard
By Using Certified RX MCUs, Customers Can Easily Develop Devices Meeting Security Requirements Tokyo, Japan, April 22, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its 32-bit RX65N microcontroller (MCU) has achieved Cryptographic Module Validation Program (CMVP) (Note 1) Level 3 certification under the FIPS...
Read More »Renesas and SiFive Partner to Jointly-develop Next-Generation High-End RISC-V Solutions for Automotive Applications
SiFive to License Industry-Leading RISC-V Core IP Portfolio to Renesas TOKYO, Japan, and SAN MATEO, Calif., April 21, 2021 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and SiFive, Inc., the industry leader in RISC-V processors and silicon solutions, today announced a strategic partnership to jointly develop next-generation, high-end...
Read More »Renesas Collaborates with Qualcomm Technologies to Speed Mainstream Adoption of Wireless Charging for Smartphones
New Reference Design Expands Best-in-Class Wireless Charging for Mass Market Devices; Solution for 5G Smartphones Available Now Tokyo, Japan, April 14, 2021 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, has expanded its ongoing work with Qualcomm Technologies, Inc., a leader in wireless technologies, to include 30W wireless charging...
Read More »Renesas Introduces Innovative New Lab on the Cloud Environment That Provides Instant Access to Popular Application Solutions
Designers Can Configure Evaluation Boards Remotely Through an Intuitive GUI TOKYO, Japan, January 21 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its new “Lab on the Cloud” environment where Renesas solutions, including popular evaluation boards, winning combinations and software, are hosted in a remote lab that...
Read More »Renesas Collaborates with Microsoft to Accelerate Connected Vehicle Development
R-Car Starter Kit uses Microsoft Connected Vehicle Platform and Azure IoT to Improve Development Efficiency for Cloud-Based Mobility Devices TOKYO, Japan, January 12, 2021 ―Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its collaboration with Microsoft to accelerate the development of connected vehicles. Renesas’ R-Car...
Read More »Renesas Unveils Industry's First 60W Wireless Power Receiver
Single-Chip P9418 IC Combines WattShare Technology, Best Thermal Performance, and Best-in-Class Current Sense Accuracy in the Highest Power Density Solution for Smartphone and Mobile Device Charging Tokyo, Japan, January 7, 2020 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the world’s first 60W wireless power receiver,...
Read More »Renesas Shifts Mobility System Development Into High Gear With Its New Online Market Place for R-Car SoC
Offers Developers Quick Access to Evaluation Software and Documentation to Jump Start Evaluation and Speed Time to Market TOKYO, Japan, October 27, 2020 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the launch of its online Market Place, which offers a one-stop source of solutions that help accelerate technical innovation...
Read More »Renesas and Sequans to Collaborate on 5G/4G Cellular IoT
Renesas Modules Based on Sequans Technology to Become Available Worldwide Tokyo, Japan and Paris, France – October 22, 2020 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and Sequans Communications (NYSE: SQNS), a leading provider of 5G/4G chips and modules for IoT, will partner to develop IoT modules based on Sequans’ Monarch...
Read More »Renesas Selects Andes RISC-V 32-Bit CPU Cores for its First RISC-V Implementation of ASSPs
TOKYO, Japan, October 1, 2020 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a technology IP cooperation with Andes Technology, an advanced supplier of RISC-V based embedded CPU cores and associated SoC development environment. Renesas selected the AndesCore™ IP 32-bit RISC-V CPU cores to embed into its new...
Read More »Renesas Joins The Global Semiconductor Alliance
Tokyo, Japan, September 24, 2020 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced it has joined the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry. “I am excited for Renesas to join the Global Semiconductor Alliance,” said Hidetoshi Shibata, CEO at Renesas. “Being a GSA member will...
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