Renesas Electronics America Inc.

Renesas' Intersil-Brand Radiation-Hardened ICs Onboard the Hayabusa2 Six-Year Asteroid Samples Retrieval Mission
Electrical Equipment & Systems

Renesas' Intersil-Brand Radiation-Hardened ICs Onboard the Hayabusa2 Six-Year Asteroid Samples Retrieval Mission

JAXA’s Hayabusa2 Spacecraft Enabled by Renesas’ Intersil-Brand Rad-Hard ICs TOKYO, Japan, February 25, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the Hayabusa2 spacecraft that returned asteroid samples to Earth in an armored...

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Controls & Controllers

Renesas and LUPA Accelerate Automotive Smart Camera Development with Open Platform Turnkey Solutions

Jointly-Developed Open Camera Platform Significantly Shortens Time to Mass Production of Euro NCAP, C-NCAP, and L2+ Applications TOKYO, Japan and BERLIN, Germany, February 24, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and LUPA-Electronics GmbH, an automotive safety solution provider, today announced the EagleCAM module, an open...

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Renesas' Intersil-Brand Radiation-Hardened ICs Onboard the Hayabusa2 Six-Year Asteroid Samples Retrieval Mission
Electrical Equipment & Systems

Renesas' Intersil-Brand Radiation-Hardened ICs Onboard the Hayabusa2 Six-Year Asteroid Samples Retrieval Mission

JAXA’s Hayabusa2 Spacecraft Enabled by Renesas’ Intersil-Brand Rad-Hard ICs TOKYO, Japan, February 25, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that its radiation-hardened (rad-hard) integrated circuits (ICs) were onboard the Hayabusa2 spacecraft that returned asteroid samples to Earth in an armored...

Read More »
Controls & Controllers

Renesas and LUPA Accelerate Automotive Smart Camera Development with Open Platform Turnkey Solutions

Jointly-Developed Open Camera Platform Significantly Shortens Time to Mass Production of Euro NCAP, C-NCAP, and L2+ Applications TOKYO, Japan and BERLIN, Germany, February 24, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, and LUPA-Electronics GmbH, an automotive safety solution provider, today announced the EagleCAM module, an open...

Read More »
Company News

Renesas Introduces Innovative New "Lab on the Cloud" Environment That Provides Instant Access to Popular Application Solutions

Designers Can Configure Evaluation Boards Remotely Through an Intuitive GUI TOKYO, Japan, January 21 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its new “Lab on the Cloud” environment where Renesas solutions, including popular evaluation boards, winning combinations and software, are hosted in a remote lab that...

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