DuPont Technologies
Research Triangle Park, NC 27709
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DuPont Introduces Thermal Mass Innovation for Sustainable Construction
DuPont(TM) EnergainÃ-® Reduces Air Conditioning and Heating Costs up to 35 Percent WILMINGTON, Del., April 30 -- DuPont (NYSE:DD) has introduced DuPont(TM) EnergainÃ-®, an innovative concept in thermal mass that provides a long-term sustainable solution to reduce energy consumption and greenhouse gas emissions in public, commercial and residential buildings. DuPont(TM) EnergainÃ-®, a...
Read More »DuPont Tate & Lyle Bio Products Begin Bio-PDO(TM) Production in Tennessee
$100 Million Plant Is World's First to Produce Propanediol From Corn Sugar LOUDON, Tenn., Nov. 27 -- DuPont Tate & Lyle Bio Products, LLC, an equally owned joint venture of DuPont and Tate & Lyle, today announced the first commercial shipments of Bio-PDO(TM) from its $100 million facility here. The Loudon facility produces 1,3 propanediol (Bio-PDO(TM)) from renewable resources -- in this case...
Read More »Flame Resistant Fabrics provide electric arc protection.
Engineered to meet NFPA 70E Category 2 requirements, DuPont(TM) Protera(TM) Fabrics provide more comfort and longer lifecycle than FR cotton nylon blends. Inherent flame resistance will not diminish through laundering or bleaching and will not require special laundry processing. Available in fabric weights of 6.5 and 8.0 oz/sq-yd, Protera fabrics come in medium blue, khaki, and navy blue colors.
Read More »Multimedia News Release - DuPont Names Glyphosate, ALS Tolerant Trait Optimum(TM) GAT(TM)
ANAHEIM, Calif., March 2 / -- DuPont today announced that its new proprietary glyphosate, ALS-tolerant trait from its subsidiary, Pioneer Hi-Bred International, Inc., will be branded as Optimum(TM) GAT(TM). The Optimum(TM) GAT(TM) trait is targeted for commercialization later in the decade in a number of crops. In addition to unsurpassed glyphosate tolerance, this new proprietary trait from...
Read More »Dry Photoresists provide wafer bumping.
Series WB Photoresists offer alternative for wafer bumping versus liquid resists. Thick, dry photoresists, ranging from 50-100 microns, are applied in one step, with no solvents or drying required. Range of formulations are available for use in lead-free, photostencil, and standard electroplating applications.
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