Dry Photoresists provide wafer bumping.

Press Release Summary:



Series WB Photoresists offer alternative for wafer bumping versus liquid resists. Thick, dry photoresists, ranging from 50-100 microns, are applied in one step, with no solvents or drying required. Range of formulations are available for use in lead-free, photostencil, and standard electroplating applications.



Original Press Release:



DuPont Electronic Technologies Introduces WB Dry Photoresist for Semiconductor Wafer Bumping at Semicon Europe



RESEARCH TRIANGLE PARK, N.C., April 20, 2004 - DuPont Electronic Technologies is pleased to introduce its newest offering in Europe for semiconductor packaging, DuPont WB Series dry photoresist for wafer bumping. DuPont will highlight this new technology at Semicon Europa, 2004 at the New Munich Trade Fair Centre, Munich, Germany, from April 20 - 22 in Hall B1 - 242. DuPont will feature WB Series dry photoresists in conjunction with offerings from EKC Technology, Europe's leading manufacturer of high-quality, value-added process materials and chemicals for the semiconductor industry, including solvent photoresist stripers; aqueous and semi aqueous etch residue removes; choline base developers as TMAH replacement, strippers and cleaning solutions.

DuPont WB dry photoresist is an attractive alternative for wafer bumping vs. liquid resists. This thick, dry photoresist (from 50 to over 100 microns) is applied in one step, with no solvents or drying required. The result is fewer overall process steps, and exact thickness uniformity from edge to edge of the wafer can be achieved, no matter what wafer size is being produced. A range of WB dry photoresist thicknesses and formulations are available for use in lead free, photostencil and standard electroplating applications.

"DuPont supplies a wide range of materials for the semiconductor industry overall, and we see advanced integrated circuit packaging and fabrication materials in particular as key to growth," said DuPont Electronic Technologies Vice President and General Manager David B. Miller. "WB Series dry photoresists for wafer bumping are a great example of how we are putting our expertise as a science company to work, changing the way products are manufactured to meet the needs of our customers in electronics -- better, faster and more economically. Specifically, WB Series dry photoresists offer ease of use, precision, control, great yields and productivity."

DuPont Electronic Technologies offers the industry's broadest array of electronic materials, including printed circuit materials, high-performance and micro-circuit materials, semiconductor fabrication materials and integrated circuit packaging and interconnects. For further information on DuPont dry photoresists for integrated circuit packaging, visit the web site at www.dupont.com/pcm/icp or stop by Hall B1-242 during Semicon Europa 2004.

DuPont is a science company. Founded in 1802, DuPont puts science to work by solving problems and creating solutions that make people's lives better, safer and easier. Operating in more than 70 countries, the company offers a wide range of products and services to markets including agriculture, nutrition, electronics, communications, safety and protection, home and construction, transportation and apparel.

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