Fujipoly America
Carteret, NJ 07008
Don't Get Stressed Out
Carteret, NJ —Wednesday, November 20, 2019— The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and...
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New Sarcon GR45A for Higher Power Electronics Applications
Offered in thicknesses from 0.50mm to 5.0mm and can be custom cut to precisely fit the shape you need up to a maximum dimension of 300mm × 200mm. Delivers thermal conductivity of 6.0 W/m•K. Thermal resistance ranges from 0.24 to 0.70 °C•in2/W.
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New Thermal Gap Filler Available in Sheets up to 300 x 200 mm
Sarcon® GR80A-00-100GY delivers a thermal conductivity of 13.0 W/m•K with a thermal resistance of only 1.0° C•in2/W. Silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. Can be die-cut to fit users exact application shape.
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New Silicone Thin Film Available in Roll Form up to 125mm Wide
Sarcon 30YR‐c ideal for filling near‐microscopic air gaps. Exist between high-power heat-generating components and heatsinks. Exhibits thermal conductivity of 4.0 W/m.K and a thermal resistance of 21°C in2/W.
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New Sarcon GR-Ae Available in Thicknesses Ranging from 0.5mm to 5.0mm
Softly fills air gaps that reduce the cooling performance of the heatsink. Can be die cut to fit almost any shape of electronic component. Delivers a thermal conductivity of 1.3 W/mK with a thermal resistance as low as .50 °C in2/W.
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Fujipoly Releases Sarcon PG80A Thermal Interface Material for Applications Requiring Material Compression Between 30 and 90 Percent
Available in 0.5, 1.0, 1.5 and 2.0 mm sheet thicknesses up to maximum dimension of 300 x 200 mm. Exhibits a thermal resistance of 0.08°C.in²/W at 14.5 PSI and a thermal conductivity of 13 W/m°K. Suitable for applications with operating temperature ranging from -40 to +150°C.
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Fujipoly Introduces Sarcon 45-YR-a Thin Film with a Thermal Conductivity of 2.2 W/m.K
The Sarcon 45-YR-a Thin Film is available in rolls or can be die-cut to required specification. It is suitable for applications that operate in temperatures ranging from -40°C to +150°C. The film features a thermal resistance as low as .33°C•in2/W. It is fabricated from silicone material with a thickness of 0.45 mm and eliminates the near-microscopic air gaps exist between heat source and...
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New Sarcon Cases from Fujipoly Provide Vibration/Impact Protection
The Sarcon® Cases are offered in 10 standard sizes that are made of TR or HR material. The cases provide a thermal conductivity ranging from 1.1 to 1.7 W/m.K and a thermal resistance between 0.62 and 1.35°C.in²/W. The units are open on one end that facilitates easy and fast installation over transistors.
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New Zebra Gold Elastomeric Connectors are Constructed from Silicone Core
The Zebra® Gold 8000 A Elastomeric Connectors are designed for transferring both data and power between parallel components and circuit boards. The unit features an electrical resistance of less than 25 mΩ. The connectors are offered in custom lengths ranging from 0.200 in. to 6.00 in. with heights ranging from 0.10 in. to 0.50 in. They come with 0.050 mm x 0.127 mm gold-plated element that...
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New Sarcon 15GTR Composite Film Comes with 0.05 mm Fiberglass Reinforcement Layer
Sarcon® 15GTR Composite Film is made from heat-conducting silicone material and is offered in rolls up to 300 mm widths. Product when placed between heat-generating component and heatsink offers a thermal conductivity and thermal resistance of 0.9 W/m•K and 0.51°C•in²/W respectively. Sarcon® 15GTR is suitable for die-cut shape applications in ‐40°C to +150°C temperature range.
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