Zeiss Industrial Metrology
Maple Grove, MN 55369
New ZEISS Crossbeam Laser Accelerates Package Failure Analysis
Provides fast cross-section solution at the high imaging performance, while providing minimal sample damage. Laser preparation is suitable for many materials, including silicon carbide and glass. Enables structural analysis, construction analysis, reverse engineering, FIB tomography and transmission electron microscopy sample preparation.
Read More »New ZEISS Crossbeam Laser Accelerates Package Failure Analysis
Provides fast cross-section solution at the high imaging performance, while providing minimal sample damage. Laser preparation is suitable for many materials, including silicon carbide and glass. Enables structural analysis, construction analysis, reverse engineering, FIB tomography and transmission electron microscopy sample preparation.
Read More »New Xradia 620 Versa RepScan Imaging Solution from ZEISS Comes with RaaD Technology
Utilizes 3D X-ray microscopy (XRM) that provides volumetric and linear measurements of advanced packages. Supports design verification, product development, process optimization and quality assurance/control (QA/QC) of complex fine-pitch 3D architectures. Features include inspection and measurement for IC packages, 500 nm spatial resolution with minimum voxel size
Read More »New Xradia 620 Versa RepScan Imaging Solution from ZEISS Comes with RaaD Technology
Utilizes 3D X-ray microscopy (XRM) that provides volumetric and linear measurements of advanced packages. Supports design verification, product development, process optimization and quality assurance/control (QA/QC) of complex fine-pitch 3D architectures. Features include inspection and measurement for IC packages, 500 nm spatial resolution with minimum voxel size
Read More »New Multiplex Mode for ZEISS Airyscan 2 Delivers More Information in Less Time
Smart illumination and detection schemes allow parallel pixel acquisition for fast and gentle confocal microscopy. Provides more options to fit imaging speeds and resolution to experimental needs. Multiplex mode is available for ZEISS LSM 980 with multiphoton and superresolution capabilities and ZEISS LSM 900 to delivers image quality without complexity.
Read More »New Multiplex Mode for ZEISS Airyscan 2 Delivers More Information in Less Time
Smart illumination and detection schemes allow parallel pixel acquisition for fast and gentle confocal microscopy. Provides more options to fit imaging speeds and resolution to experimental needs. Multiplex mode is available for ZEISS LSM 980 with multiphoton and superresolution capabilities and ZEISS LSM 900 to delivers image quality without complexity.
Read More »ZEISS Releases 3D X-Ray Imaging Systems for Use in Semiconductor Industry
The 3D X-Ray Imaging Systems consist of Xradia 600-series Versa and Xradia 800 Ultra X-ray microscopes and Xradia Context microCT models. The units are designed to provide submicron and nanoscale 3D images. The Xradia 600-series system is embedded with RaaD capability and delivers 0.5 micron spatial resolution and 40 nm min voxel size. The Xradia 800 Ultra system comes with 150 nm and 50 nm...
Read More »ZEISS Releases 3D X-Ray Imaging Systems for Use in Semiconductor Industry
The 3D X-Ray Imaging Systems consist of Xradia 600-series Versa and Xradia 800 Ultra X-ray microscopes and Xradia Context microCT models. The units are designed to provide submicron and nanoscale 3D images. The Xradia 600-series system is embedded with RaaD capability and delivers 0.5 micron spatial resolution and 40 nm min voxel size. The Xradia 800 Ultra system comes with 150 nm and 50 nm...
Read More »ZEISS SPECTRUM Coordinate Measuring System with CALYPSO Measurement Software
The ZEISS SPECTRUM Coordinate Measuring Machine is offered in measuring volumes from 500 x 500 x 600 mm to 700 x 1000 x 600 mm. The machine is equipped with a C99L intelligent scanning controller, wrap-around air bearings. The CALYPSO software eliminates the time required for structured programming, code editing and line-by-line text editing. The CMM with RDS-C5 articulating probe holder and VAST...
Read More »ZEISS SPECTRUM Coordinate Measuring System with CALYPSO Measurement Software
The ZEISS SPECTRUM Coordinate Measuring Machine is offered in measuring volumes from 500 x 500 x 600 mm to 700 x 1000 x 600 mm. The machine is equipped with a C99L intelligent scanning controller, wrap-around air bearings. The CALYPSO software eliminates the time required for structured programming, code editing and line-by-line text editing. The CMM with RDS-C5 articulating probe holder and VAST...
Read More »ZEISS Receives ACEC Award for Wixom Quality Excellence Center
New Facility Showcases Interconnectivity Between Quality and Smart Factories Wixom, Mich., March 4, 2021 /PRNewswire/ -- The interconnectivity of quality inspection equipment with the infrastructure of modern smart factory environments is becoming increasingly critical. ZEISS Industrial Quality Solutions opened its Wixom, Michigan Quality Excellence Center to demonstrate that interconnectivity...
Read More »ZEISS Receives ACEC Award for Wixom Quality Excellence Center
New Facility Showcases Interconnectivity Between Quality and Smart Factories Wixom, Mich., March 4, 2021 /PRNewswire/ -- The interconnectivity of quality inspection equipment with the infrastructure of modern smart factory environments is becoming increasingly critical. ZEISS Industrial Quality Solutions opened its Wixom, Michigan Quality Excellence Center to demonstrate that interconnectivity...
Read More »New ZEISS Crossbeam Laser Accelerates Package Failure Analysis
Provides fast cross-section solution at the high imaging performance, while providing minimal sample damage. Laser preparation is suitable for many materials, including silicon carbide and glass. Enables structural analysis, construction analysis, reverse engineering, FIB tomography and transmission electron microscopy sample preparation.
Read More »New ZEISS Crossbeam Laser Accelerates Package Failure Analysis
Provides fast cross-section solution at the high imaging performance, while providing minimal sample damage. Laser preparation is suitable for many materials, including silicon carbide and glass. Enables structural analysis, construction analysis, reverse engineering, FIB tomography and transmission electron microscopy sample preparation.
Read More »ZEISS and Oak Ridge National Laboratory Partner for Advancement of Powder Bed Additive Manufacturing
MAPLE GROVE, Minn., Nov. 18, 2019 /CNW/ -- Carl Zeiss Industrial Metrology, LLC and Oak Ridge National Laboratory (ORNL) have entered into a five-year cooperative research and development agreement (CRADA) to gain a deeper understanding of additive manufacturing (AM) processes and materials using ZEISS' unique 3D ManuFACT solution, a correlative multi-scale multi-modal workflow utilizing advanced...
Read More »ZEISS and Oak Ridge National Laboratory Partner for Advancement of Powder Bed Additive Manufacturing
MAPLE GROVE, Minn., Nov. 18, 2019 /CNW/ -- Carl Zeiss Industrial Metrology, LLC and Oak Ridge National Laboratory (ORNL) have entered into a five-year cooperative research and development agreement (CRADA) to gain a deeper understanding of additive manufacturing (AM) processes and materials using ZEISS' unique 3D ManuFACT solution, a correlative multi-scale multi-modal workflow utilizing advanced...
Read More »New Xradia 620 Versa RepScan Imaging Solution from ZEISS Comes with RaaD Technology
Utilizes 3D X-ray microscopy (XRM) that provides volumetric and linear measurements of advanced packages. Supports design verification, product development, process optimization and quality assurance/control (QA/QC) of complex fine-pitch 3D architectures. Features include inspection and measurement for IC packages, 500 nm spatial resolution with minimum voxel size
Read More »New Xradia 620 Versa RepScan Imaging Solution from ZEISS Comes with RaaD Technology
Utilizes 3D X-ray microscopy (XRM) that provides volumetric and linear measurements of advanced packages. Supports design verification, product development, process optimization and quality assurance/control (QA/QC) of complex fine-pitch 3D architectures. Features include inspection and measurement for IC packages, 500 nm spatial resolution with minimum voxel size
Read More »New Multiplex Mode for ZEISS Airyscan 2 Delivers More Information in Less Time
Smart illumination and detection schemes allow parallel pixel acquisition for fast and gentle confocal microscopy. Provides more options to fit imaging speeds and resolution to experimental needs. Multiplex mode is available for ZEISS LSM 980 with multiphoton and superresolution capabilities and ZEISS LSM 900 to delivers image quality without complexity.
Read More »New Multiplex Mode for ZEISS Airyscan 2 Delivers More Information in Less Time
Smart illumination and detection schemes allow parallel pixel acquisition for fast and gentle confocal microscopy. Provides more options to fit imaging speeds and resolution to experimental needs. Multiplex mode is available for ZEISS LSM 980 with multiphoton and superresolution capabilities and ZEISS LSM 900 to delivers image quality without complexity.
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