Aprima Medical Software, Inc
Carrollton, TX 75006
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Quad DAC includes internal reference and SPI interface.
Available with 16- or 12-bit resolution and internal 1.25 or 2.048 V reference, Series LTC2654 achieves 16-bit performance of Ã-
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Rail Emergency Pushbutton Switch meets TSI-PRM standards.
Designed for use by disabled passengers, especially visually impaired, Series 56 meets European Technical Specifications of Interoperability for Persons with Reduced Mobility (TSI-PRM) standards. Design features large pushbutton within bright yellow triangular bezel, which is visible in all light levels. Also, SOS is printed in ink and Braille text. Letters are 15 mm high, and Braille is raised...
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PC Card Kits come in snap-on, ultrasonic versions.
Providing complete EMI shielding, PCMCIA RoHS compliant I/O kits include snap-fit model with pair of mechanically-assembled SS card covers that provide PC card with torsional stiffness and optimal drop test performance. With ultrasonic kit, plastic cover set is welded around card ultrasonically to create solid protective shell. Both secure, tamper-proof kits feature standard card end closure...
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Web-Based Software extends cloud deployment options.
Web-based ITIL 3 Service Management Platform enables SaaS-based cloud deployment options such as Google App Engine, Amazon EC2, and Rackspace Cloud. Utilizing HTML5 standards, platform requires no browser plug-ins, no ActiveX components, and no client downloads and supports every major browser. It also features RESTful Web Services as primary API for Web service integrations. Search engine and...
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Optical Mouse is available in wireless/wired versions.
ENGAGE(TM) Wireless Optical Mouse features wireless receiver, comfort side grips, and vertical scroll wheel for PC and Mac computers. With plug-in cord for PC/Mac computers, ENGAGE Wired Optical Mouse offers vertical and horizontal scroll wheel and forward/backward side buttons. Both ergonomic, midsize laser products deliver smooth tracking on various surfaces. They offer efficient navigation...
Read More »Mobile SDRAMs suit power sensitive applications.
Operating from 1.8 V, Mobile SDRAM family includes 32 Mb SDR Models IS42VM16200C and IS42VM32100C, organized as 2M x 16 and 1M x 32 respectively, and DDR Models IS43LR16200C and IS43LR32100C. Devices feature operating current of 50 mA, standby current in power down mode of 80 Ã-µA, and deep power down mode current of 10 Ã-µA. Available in commercial and industrial temperature ranges,...
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Open Frame Power Supplies are rated up to 80 W.
Suited for medical (MTB080) and industrial (FTB080) applications, Elpac Power Systems(TM) power supplies offer 12.5 W/in.Ã-³ power density and 91% converter efficiency. Open frame design, measuring 2 x 4 x 1 in., accommodates applications with limited space and little to no airflow. Series delivers 80 W continuous output power with convection cooling, which rises to 100 W with 5 cfm forced...
Read More »Business Phone System provides hosted, scalable solution.
Allowing users to determine number of extensions/lines needed and order/change those services, NuvioFlex virtual PBX is outsourced phone system that is purchased same way as in-house system. Each extension and user on system can utilize portal access, voicemail, voicemail-to-email, find me/follow me, time-of-day scheduling, on-demand call recording, and detailed call log features. Product is...
Read More »Predictive Fraud Score delivers consistent protection for SMBs.
Fraud Shield(SM) Score Plus provides SMBs with approach to combat fraud with little to no IT investment or process change. Working with Fraud Shield, solution generates predictive fraud score and delivers it in tandem with consumer credit profile. This helps reduce fraud losses, consistently approve legitimate applications, meet various compliance requirements, and decrease fraudulent application...
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Copper Barrier-Seed PVD System is intended for TSV packaging.
For copper barrier-seed applications, INOVA-® NExT PVD system features Hollow Cathode Magnetron (HCM) IONX source technology. Copper barrier-seed physical vapor deposition (PVD) process, intended for through-silicon-via (TSV) packaging market, delivers optimal sidewall and bottom coverage and enables void-free copper fill during subsequent TSV electroplating step. TSVs enable 3D packaging, where...
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