Aprima Medical Software, Inc
Carrollton, TX 75006
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Labeling System utilizes off-the-shelf components.
Labeling System prints and applies variable information labels to trailing corner of cases and cartons. Model 250 prints and applies labels, while secondary tamp tamps label to side of carton and wipes it around trailing edge corner. Scanner Interface verifies barcode and lets case continue down line or rejects it. Integrated, stainless steel conveyor features variable speed DC drive motor....
Read More »Software supports Linux development platform.
ObjectAdaÃ-® Real-Time Linux cross PowerPC/LynxOS provides real-time features developers need with full Ada 95 language support. It integrates set of LynxOS features that collectively support development of complex networked applications. Software offers PosixWorks interoperability, LynxOS kernel threads, LynxOS MMU, Graphical Motif IDE, TCP/IP networking, and language-sensitive tools. Ada 95...
Read More »SCADA Software suits small- to medium-sized applications.
Based on open, standardized technology, TelemecaniqueÃ-® Vijeo Look v2.0 entry-level SCADA solution provides historical and real-time trending, data logging, alarming, and communication capabilities. It includes graphics for custom libraries and objects such as PID loops and conveyors. Software database management tools enable size and age limitation, purging, and archiving capabilities,...
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Wire and Ribbon can withstand temperatures up to 1,250-
Custom-engineered Platinum Clad Wire and Ribbon provide thermal and corrosion resistance. Core materials include iron-nickel or molybdenum for applications up to 1,250Ã-
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Injection Molding Service utilizes liquid silicone rubber.
Liquid Injection Molding Service produces clear and colored silicon parts. Twenty-four ton Boy Presses can handle mold sizes of 10 x 12 in. and max shot size of 65 g. Molding systems utilize modular mold base, which is set up to receive cavity blocks of 4 x 4, 6 x 6, and 8 x 8 in. Liquid Silicone Rubber features temperature range of -94 to +400Ã-
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Software provides multi-disciplinary design environment.
Suited for optimizing conceptual design of PCBs, FLO/PCB enables users to directly take account of thermal design constraints. Software promotes conceptual design process that enables collaboration in common design environment. Changes made in one view are reflected in all other views to keep team members current and let them contribute to design concept development in real-time. Software also...
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Signal Conditioner is powered via computer USB port.
Model 485B36 pocket-sized, dual-channel ICPÃ-® sensor signal conditioner offers low-noise performance found in battery-powered signal conditioners. In addition to providing sensor with required constant current supply, unit decouples sensor's bias voltage from measurement signals. Features include BNC jack input connectors, 19.5 Vdc @ 4.5 mA sensor excitation power, and 50 kHz upper frequency...
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Signal Conditioners are DC powered.
Series 485M signal conditioners provide constant current excitation for ICPÃ-® sensors from 18-30 Vdc battery or lab power supply. Unit includes options for connecting directly to readout devices and data acquisition systems. Variety of power connections allows for flexibility in connecting directly into various power supplies. Compact signal conditioners feature x1 gain circuitry and are...
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Power Adapters provide I/O isolation of 3,000 Vac.
Desktop-style, 12-130 W, External Switching Power Adapters feature auto-switching universal input from 90-264 Vac and single, dual, and triple outputs ranging from 5-48 Vdc. With typical efficiency of 80%, all models include over-voltage and over-current protection. Output connections are made via standard coaxial plug or 5-pin DIN/Mini-DIN. Adapters have full UL, CSA, and IEC safety...
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Bus Converter Module achieves 97% efficiency.
VoI Chip Model B048K480T30 provides 2,250 Vdc primary-to-secondary isolation with unity transformation ratio over input range of 38-55 Vdc. It may be surface-mounted into PCB with profile as low as 0.16 in., for power density of 1,750 W/inÃ-³, or on board with overall height of 0.25 in., for power density of 1,095 W/inÃ-³. Rated for 300 W, module is suited for Power-over-Ethernet and...
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