ALMAC GROUP LTD,
Craigavon BT63 5QD GBR
Share:
Oscilloscope Software provides SATA compliance testing.
Designed for Infiniium oscilloscopes, N5411B Test Software performs range of tests for general specifications, transmitted signal requirements, and out-of-band specification for SATA products. Program provides design and validation engineers with way to verify physical layer transmitter compliance for SATA 1.5, 3.0, and 6.0 Gb/s silicon, host bus adapters, port multipliers, and high-density,...
Read More »Extrusions are made from recycled aluminum.
Recycled aluminum billets are now offered to extrusion customers for use when specified by architects who require this green feature to qualify for L.E.E.D. certification. Environmentally friendly secondary aluminum billet can be used for shower doors, trim parts, lights, and displays, as well as shelves, frames, and signs. Aluminum can be recycled and reused without losing any of its...
Read More »Software provides view of network cloud.
TellabsÃ-® 8000 Network Manager Release 17 helps service providers handle everyday network routines. With simple point-and-click operations, users can view exact traffic path, hop by hop, as well as status of individual pseudowires and tunnels. Software incorporates performance tool to monitor network traffic/use and calculate trends, along with features for testing and fault monitoring....
Read More »Touchscreen Platform incorporates finger-pressure detection.
PMatrix(TM) resistive multitouch detection platform lets users simultaneously move unlimited number of fingers, fingernails, or styli on screen, with soft, medium, and hard pressure levels differentiated. It is suitable for camera shutters, with half pressure for autofocus and full pressure to take picture, and drag and drop, with soft touch to select item and medium touch to move it. Platform...
Read More »System provides LTE wireless and wireline monitoring.
Integrated into Network and Service Analyzer, K2Air collects data via digital RF interfaces, and supports LTE networks with Uu Interface monitoring capabilities and eNodeB functionality. K2Air probe supports both uplink and downlink monitoring of up to 300 UEs in parallel on air interface in real-time. It correlates this information with data on fixed LTE as well as legacy 2G and 3G interfaces,...
Read More »Development Platform accelerates mobile application creation.
Suited for Smartphone and MID application developers creating applications for mobile operating systems, Zoom(TM) OMAP34x-II Mobile Development Platform (MDP) features 4.1 in. WVGA multi-touch display with QWERTY keypad in landscape, handheld form factor. Solution is based on OMAP3430 applications processor, which supports up to 720p HD video encode/decode, and supports various wireless...
Read More »Non-Volatile Cache targets server and storage applications.
Providing non-volatile protection of RAID cache data during power failure, ArxCis-NV(TM) consists of JEDEC edge compatible registered DRAM module with ECC, paired with embedded SSD for data backup. If voltage drops below defined level, backup function is activated, and supercapacitors provide enough power for DRAM, NAND, and logic to transfer data into non-volatile flash. SATA bridge transfers...
Read More »Single-Chip RF Transceiver features high integration.
Offered as dual-band TD-SCDMA and quad-band EDGE transceiver in 9 x 9 mm QFN64 package, QS3200 provides 2G/2.5G/3G/3.5G multimode support as well as support for TD-SCDMA/HSDPA/EDGE/GPRS/GSM standards. It exceeds 3GPP TS 25.102 requirements and is optimized to meet demands of small form factor cellular handsets. Along with HSDPA/HSUPA and front-end component support, features include SPI control...
Read More »Platform offers secure IP-peering solution.
Deployed in mobile operators' IP cores, Mobile SecurEdge brings benefits of end-to-end IP connectivity for international roaming and national peering traffic. It provides wholesale carriers with GSMA-compliant IPX proxy interconnect platform supporting multiple standards for signaling, network interworking, and legacy TDM interworking.
Read More »High Temperature ICs feature plastic packages.
Targeting applications between -55 and +175Ã-
Read More »