Other

Machinery & Machining Tools, Printing & Duplicating Equipment

Rudolph JetStep Lithography System Selected for First Panel Fan-out Packaging Manufacturing Line

February 5, 2016

Rudolph is positioned to capture the early adopters of the emerging advanced packaging panel lithography market Flanders, New Jersey – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading outsourced assembly and test facility (OSAT) has placed an order for the JetStep® Lithography System for the semiconductor advanced packaging industry’s first panel manufacturing... Read More

Machinery & Machining Tools, Printing & Duplicating Equipment, Test & Measuring Instruments

Ultratech and Qoniac Jointly Develop 3D Lithography APC Solution

February 1, 2016

3D Distortion Inspection and Lithography APC Leaders to Deliver Second Generation 3D Distortion Lithography APC SAN JOSE, Calif. - Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB  -LEDs), as well as atomic layer deposition (ALD) systems, and Qoniac GmbH of... Read More

Machinery & Machining Tools, Printing & Duplicating Equipment

Leading OSAT and FPD Manufacturers Order JetStep Lithography Systems from Rudolph

December 8, 2015

Lithography stepper gains further traction in advanced packaging and flat panel markets Flanders, New Jersey - Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test facility (OSAT) has placed a repeat order for the JetStep® W Series Lithography system, which it will use for both fan-out and fan-in packaging approaches. Additionally, Rudolph... Read More

Machinery & Machining Tools, Printing & Duplicating Equipment

Ultratech Receives Large Multiple System Order for Fan-Out Wafer-Level Packaging Application

October 20, 2015

Ultratech's AP300 Lithography Systems Chosen for Next Generation High-Volume, Fan-Out Wafer-Level Packaging Application SAN JOSE, Calif., – Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser­-processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HBLEDs), as well as atomic layer deposition (ALD) systems, today... Read More

Machinery & Machining Tools, Printing & Duplicating Equipment, Test & Measuring Instruments

Rudolph Wins Lithography and Inspection Orders for Fan-out Wafer Level Packaging Applications

April 30, 2015

The JetStep System boasts new productivity improvements and lower cost-of-ownership Flanders, New Jersey – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has placed a $12 million order for a follow-on JetStep® Advanced Packaging Lithography System and multiple NSX® Inspection Systems for use in their planned capacity... Read More

Printing & Duplicating Equipment

Rudolph JetStep Lithography System Gains Traction for Advanced Packaging Applications

March 18, 2015

Tool to be used for development of copper pillar bumping and TSV processes Flanders, New Jersey – Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a major outsourced assembly and test (OSAT) manufacturer has selected the JetStep® Advanced Packaging Lithography System for evaluation. The tool, which ships this week, will be used to develop copper (Cu) pillar bumping and through... Read More

Computer Hardware & Peripherals, Mechanical Components & Assemblies, Printing & Duplicating Equipment

Luminite Products Corp Acquires European Patent for Load-N-Lok Technology

March 17, 2015

Bradford, Pennsylvania Luminite Products Corporation, a digital direct, laser engraved, sleeve and covered cylinder supplier to the flexographic printing industry, announces the acquisition of the European patent for their "air sleeve" system that does not require an air mandrel. (European patent #2398646 and US patent #8,307,764) The Load-N-Lok system allows the press operator to... Read More

Printing & Duplicating Equipment, Software

Media Alert: Cadence to Showcase Computational Lithography and Design for Manufacturing Solutions at SPIE 2015

February 16, 2015

SAN JOSE, Calif. - Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that it plans to exhibit its latest Design for Manufacturing (DFM) Physical Signoff and Computational Lithography technologies at this year's SPIE Advanced Lithography Exhibition at booth 227 from February 22 to 26, 2015, in San Jose, CA. To register for the conference, visit Read More

Printing & Duplicating Equipment

Nanoimprint Lithography Process aids photonic device production.

October 29, 2014

Available on NIL platforms, including mask aligners as well as EVG®720 and EVG7200 UV-NIL systems, SmartNIL&trade; large-area nanoimprint lithography (NIL) process provides large-area, high-volume-manufacturing solution for photonic-based devices. Room-temperature process offers full-field imprint area up to 200 mm and full-substrate UV-NIL solution for high-volume-manufacturing applications at >40 substrates/hr for 200 mm substrates. Soft stamp fabrication technology provides replication at <10 min. Read More

Machinery & Machining Tools, Printing & Duplicating Equipment

Rudolph Technologies Wins Multiple Lithography Orders

February 13, 2014

Systems sold into advanced packaging and flat panel display markets Flanders, New Jersey – Rudolph Technologies, Inc. (NYSE: RTEC) announced today it has received two orders for its lithography systems, totaling more than $11 million. Purchase orders include a repeat order for the JetStep™ Lithography System for advanced packaging (AP) applications and a repeat order for a... Read More

Printing & Duplicating Equipment

Heidelberg Instruments Provides Lithography Platform for Wafer Level Packaging

December 2, 2013

Heidelberg, Germany – Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from a leading Asian based semiconductor packaging group. System will be used in production of advanced semiconductor and wafer level packaging devices used in the production of consumer products such as... Read More

Computer Hardware & Peripherals, Printing & Duplicating Equipment

Heidelberg Instruments Supplies Lithography Platform for Touchscreen Photomask Production

November 19, 2013

Heidelberg, Germany – Heidelberg Instruments, a leader in design, development and production of laser lithography systems, announced an order for a VPG 800 Maskless Lithography System from a large Asian based photomask production group. System will be used in production of advanced photomasks used in the fabrication of touch panel screens.   "Growth in the touchscreen market will be... Read More

Machinery & Machining Tools, Printing & Duplicating Equipment

SUSS MicroTec Honored with Amkor Technology's "2013 Best of Class Equipment Award"

November 13, 2013

Garching — SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, was honored with the "2013 Best of Class Equipment Award" from Amkor Technology on October 18, 2013. Every year the most successful suppliers of Amkor receive this award. SUSS MicroTec was especially honored for its lithography equipment and process solutions for the... Read More

Machinery & Machining Tools, Material Handling & Storage, Printing & Duplicating Equipment

EV Group Introduces Roll-To-Roll Nanoimprint Lithography System for Biomedical, Optical, and Flexible Electronics Applications

October 14, 2013

EVG®570R2R developed with A*STAR IMRE's Industrial Consortium on Nanoimprint (ICON) DRESDEN, Germany – PLASTIC ELECTRONICS – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG® 570R2R--the industry's first roll-to-roll thermal nanoimprint lithography (NIL) tool.  Jointly... Read More

Printing & Duplicating Equipment

Molecular Imprints J-FIL Technology Has Now Demonstrated the Ability to Produce High Performance Wire Grid Polarizers for Use in Flat Panel Displays

August 6, 2013

- Large area wire grid polarizers with feature sizes of 50nm and below will increase the resolution, reduce the power consumption and lower the cost of a flat panel display AUSTIN, Texas – Molecular Imprints Inc. (MII), the market and technology leader for nanopatterning systems and solutions, today announced it has developed a roll-based Jet and Flash® Imprint Lithography (J-FIL®)... Read More

Material Handling & Storage, Printing & Duplicating Equipment

Ultratech Secures Repeat AP Order Win with OSAT Customer

July 11, 2013

Major OSAT Orders Ultratech AP300W for High-volume Advanced Packaging Applications SAN JOSE, Calif. -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs) announced that it has received a repeat order from a leading outsourced semiconductor assembly and test (OSAT) company... Read More

Cleaning Products & Equipment, Printing & Duplicating Equipment, Textile Industry Products

Central Impression (CI Press Cleaner) Drum Cleaner targets wide web flexographic printing industry.

June 3, 2013

Featuring selectable multi-wiping functions, MX Central Impression Printing Press Drum Cleaner enables operator to select smooth pad or bristle brush for cleaning inks and slip that has accumulated on drum surface. System also offers multi-function controls for maximum wiping effectiveness. It can provide full drum wipe, wipe from center of drum out to each edge of product, or just product edges. In addition, cleaner can wipe in single spot location dialed in on HMI by operator. Read More

Machinery & Machining Tools, Material Handling & Storage, Printing & Duplicating Equipment

Resist Processing System supports micro- and nano-electronics.

May 17, 2013

Featuring robot with dual arms for accelerated wafer swapping, EVG®120 Automated Resist Processing System supports coating and developing applications for MEMS systems, advanced packaging, and compound semiconductors. Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Accommodating wafers up to 200 mm in diameter, EVG120 includes CoverSpin&trade; rotating bowl cover for coating uniformity across substrate. Read More

Machinery & Machining Tools, Material Handling & Storage, Packaging Equipment, Printing & Duplicating Equipment

Rudolph Receives Customer Acceptance of First JetStep System for Advanced Packaging Applications

May 10, 2013

• Validates commercialization of revolutionary 2X stepper total lithography solution • Flexible substrate handling and large exposure field provide critical benefits in wafer level packaging process Flanders, New Jersey – Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED... Read More

Machinery & Machining Tools, Printing & Duplicating Equipment, Green & Clean

Molecular Imprints Ships Its Next Generation Imprint Module System Targeted for Use in Semiconductor Memory Production

April 29, 2013

Molecular Imprints will ship three of its next generation imprint systems this quarter.  Two of these systems are expected to be delivered to a leading semiconductor IDM. AUSTIN, Texas– Molecular Imprints, Inc. (MII), a technology leader in advanced semiconductor lithography and the market and technology leader for nanopatterning systems and solutions, today announced the shipment of the... Read More