EV Group Inc.    Tempe, AZ 85284
May 17, 2013 Featuring robot with dual arms for accelerated wafer swapping, EVG®120 Automated Resist Processing System supports coating and developing applications for MEMS systems, advanced packaging, and compound semiconductors. Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Accommodating wafers up to 200 mm in diameter, EVG120 includes CoverSpin™ rotating bowl cover for coating uniformity across substrate.

Rudolph Technologies, Inc.    Flanders, NJ 07836
Dec 19, 2012 Accommodating needs of semiconductor advanced packaging market, JetStep™ total lithography system delivers full, closed-loop control. Components include JetStep 2X reduction stepper integrated with Rudolph equipment automation and fault detection software; NSX® inspection tool for CD overlay measurements; ProcessWORKS® APC run-to-run control system software; ARTIST® fault detection and classification system; and Discover® fabwide yield management system.

Canon U.S.A. Inc.    Lake Success, NY 11042-1113
Oct 04, 2011 Accommodating Through Silicon Via (TSV) and Bump process requirements, FPA-5510iV is equipped with adjustable Numerical Aperture for patterning features sized from 1-50 microns as well as small, deep, vertical holes in thick resist. Projection lens optics, variable from 0.10-0.18, expose 52 x 34 mm area, and illumination optics utilize 4.5 kW, high-intensity, Mercury lamp as light source. Tool also incorporates automated alignment system and optional, non-contact Wafer Edge Shielding unit.

Molecular Imprints, Inc.    Austin, TX 78758-3605
Jan 17, 2011 Perfecta(TM) MR5000 Jet and Flash(TM) Imprint Lithography imprint mask replication platform enables multiple identical replica masks to be fabricated from one e-beam master. Taking e-beam written leading-edge 6025 master masks, nanopatterning system transfers patterns flawlessly onto 6025 replicas that can be accepted by manufacturing wafer imprint lithography system. System dispenses picoliter resist droplets mapped to local feature density, optimizing residual layer thickness uniformity.

EV Group Inc.    Tempe, AZ 85284
Oct 15, 2010 Based on UV-NIL systems, Soft Molecular Scale Nanoimprint Lithography (SMS-NIL) technology enables ultra-high-resolution patterning of features down to 12.5 nm on large-area surfaces. Soft working stamp process allows full-area nanoimprints and optically aligned UV-NIL on existing EVG equipment. While stamp and imprinting can be processed on same tool without additional processing steps, soft polymeric working stamp's properties reduce mechanical damage to master templates.

Epson America, Inc.    Torrance, CA 90509
Oct 07, 2010 Based on Epson Stylus® Pro 7900 printer with 24 in. wide format, Epson Stylus Pro 7900CTP includes plate curing device, EFI® Computer-to-Plate RIP software package, and plate guide attachment. DirectPlate Aluminum technology enables true aluminum lithographic printing press plates to be created using Epson UltraChrome® HDR inks, and each plate can be used to produce up to 20,000 impressions. Water-based system eliminates handling of hazardous chemicals and delivers up to 175 lpi resolution.

Suss Microtec AG    Usa, VT 05677
Aug 12, 2010 Used for production of high-brightness light emitting diodes (HB-LEDs), MA100e Gen2 Automatic Mask Aligner processes wafers up to 4 in. and enables throughput of 145 wafers/hr. High-intensity exposure optics and pre-alignment options minimize process time, while functionalities such as proximity exposure for high resolution down to 2.5 µm maximize yield. All together, functionality helps LED equipment manufacturers support LED production demands.

Intelligent Micro Patterning, LLC    St. Petersburg, FL 33703
Jul 07, 2010 Available with optimized optics and precision stages, SF-100 XCEL (5 micron resolution) and SF-100 XPRESS (1 micron resolution) are based on maskless photolithography technology that utilizes Smart Filter technology. Latter incorporates micro-optical techniques to project master images directly onto silicon wafers; diverse substrate materials - quartz, ceramics, metals and plastics; and photomask blanks without use of photomasks.

EV Group Inc.    Tempe, AZ 85284
Jul 22, 2009 UV-nanoimprint lithography (UV-NIL) step and repeat system, EVG770 Gen II NIL Stepper, incorporates abilities that promote process reliability, accuracy, and pattern fidelity at decreasing feature densities. While vacuum imprinting on spun-on polymer layer eliminates defect issues caused by trapped air bubbles, optical sensors align stamp and wafer into perfect parallelism for contact-free wedge compensation. Chuck movement, via non-contact bearing system, reduces particle contamination.

Pemco Inc.    Sheboygan, WI 53082
Mar 26, 2009 Providing optimal decurler capability, T.I.P. WEB-0401 features heavy duty 3-bar motorized roller decurler assembly. Available in 12, 20, 30, 40, 50, and 75 mm dia, diameter of 3 decurler bars depend on machine/product details. Decurler needed for converting dedicated product can be selected by moving pin and rotating assembly using supplied handle and then reinserting pin to lock it. With remote adjustment, unit has less or no product markings.

Energetiq Technology    Woburn, MA 01801
Mar 06, 2009 Operating at pulse rate of 10 kHz, EQ-10HR produces EUV light suited for infrastructure development for EUV lithography. It incorporates electrodeless Z-Pinch technology, which inductively couples current into discharge plasma, optimizing plasma control and stability and confining plasma away from source components. Product offers simplified integration into process tools and maintains repetition rate over billions of pulses.

NanoInk, Inc.    Chicago, IL 60607
Feb 24, 2009 Utilizing Dip Pen Nanolithography® (DPN®) process, DPN 5000 system offers nanopatterning capabilities coupled with AFM (atomic force microscopy) imaging for immediate characterization of deposited patterns. Various custom MEMS-based ink delivery devices allow range of materials to be deposited under precisely controlled conditions. Included lithography software, InkCAD(TM) 4.0, offers functionality for control of tip-based patterning along with nanoscale mapping and positioning.

Intelligent Micro Patterning, LLC    St. Petersburg, FL 33703
Feb 04, 2009 Providing 1 micron min feature size, SF-100 XPRESS can be custom-configured with various options to meet specific application requirements. Maskless exposure system utilizes Smart Filter technology, which incorporates micro-optical techniques to project master images directly onto diverse substrate materials. Serving researchers and manufacturers in various market segments, system capabilities may be added as dictated by technical requirements.

Intelligent Micro Patterning, LLC    St. Petersburg, FL 33703
Oct 08, 2008 SF-100 XTREME maskless photolithography system utilizes Smart Filter technology, which incorporates micro-optical techniques to rapidly project master images directly onto diverse substrate materials. Microfluidics Research Option test capabilities include varying excitation and emissions spectra, allowing for gray scale spatial illumination and fluorescence imaging and measuring particles in flow, including creating particle image velocimetry like conditions.

Azores Corp    Wilmington, MA 01887
Sep 25, 2008 Based on step-and-repeat technology, Model 8700 PanelPrinter(TM) System features high performance lens that provides up to ±30 ppm real-time magnification adjustment via 6 degree of freedom reticle chuck, allowing every substrate to be compensated for, according to alignment results, ensuring precise alignment. Measuring 3.4 x 2.9 m, system can be configured with either 18709i or 18715i lens with resolution of 2.5 and 1.5 µm and depth of focus of 30 and 9 µm, respectively.

Intelligent Micro Patterning, LLC    St. Petersburg, FL 33703
Jul 14, 2008 Utilizing Smart Filter technology, which incorporates micro-optical techniques to project master images directly onto diverse substrates, maskless SF-100 XTREME enables micropatterning of features as small as 1 micron. System features precise substrate movement and inline, confocal camera system to optimize overall system results. Users can customize SF-100 XTREME to provide precise energy levels, exposure wavelengths, and minimum feature sizes for application.

Molecular Imprints, Inc.    Austin, TX 78758-3605
Feb 27, 2008 Leveraging S-FIL® (Step and Flash Imprint Lithography) technology, Imprio® 300 is used for IC prototyping and process development at 32 nm node and beyond. It offers sub-10 nm resolution patterning in single exposure and can create dense, high-resolution structures in 2 dimensions. Drop-in technology - suitable for mix-and-match strategies where resolution advantage can be deployed on specific critical layers - is capable of meeting overlay requirements of semiconductor industry.

Photo Sciences, Inc.    Torrance, CA 90505
Oct 25, 2007 Photo Sciences uses multi-faceted micro lithography capabilities to pattern Indium Tin Oxide (ITO) coated substrates using direct-write laser, direct-write e-beam, optical reduction, and full field exposure lithography. Multi-level aligners expose and selectively etch other thin film metals and dielectrics, which can be layered with ITO patterns to create array of circuit and display configurations. Measurement and test equipment ensure that coatings meet thickness and resistance specifications.

Luminescent Technologies, Inc.    Mountain View, CA 94041
Jan 03, 2006 Acting as replacement for Resolution Enhancement Technology (RET) software, Explorer uses Inverse Lithography Technology (ILT) platform to evaluate desired on-wafer pattern and mathematically determine mask features needed to produce intended silicon outcome. ILT analyzes entire image and generates globally optimized mask design in single pass. Combining software and hardware, Explorer features selectable e-beam or laser mask output format.

NanoInk, Inc.    Chicago, IL 60607
Nov 09, 2004 Activeâ„¢ Pen Array transforms NSCRIPTOR System into multi-pen plotter for nanoscale. Each probe in array is addressable and able to move individually in Z-direction while scanning and writing. Active Pen includes microfabricated pens, electronics and interconnect modules, and alignment software. Each pen array consists of 8-pen configuration, having 6 central writing pens and 2 flanking reader probes. InkCADâ„¢ v3.0 software facilitates nanoscale tip-to-tip alignment.