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Optics & Photonics -> Optical Transmission Equipment & Systems -> Couplers -> Other


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IC-Photocouplers are housed in low-profile S08 packages.

Toshiba America Electronic Components (TAEC)
Irvine, CA 92618-1811
Apr 22, 2009 Model TLP2105 with buffer logic output and TLP2108 with inverter logic output are 5 Mbps units offering common-mode transient immunity of ±10 kV/µs. Both operate from power supply voltage of 4.5-20 V. Featuring inverter logic output, 15 Mbps TLP2166 features common-mode transient immunity of ±15 kV/µs and 3.0-3.6 V supply voltage. Contained in S08 5.1 x 3.95 x 2.5 mm packages, all 3 dual-channel, totem-pole output devices operate in temperatures from -40 to +100°C.

Broadband IR Laser Output Coupler offers stable performance.

Reynard Corp.
San Clemente, CA 92673
Feb 23, 2009 Delivering consistent operation in LWIR wavelength band, Broadband IR Laser Output Coupler uses all-dielectric approach that reduces absorption in thin film design and stabilizes thermal effects as well as overall laser system design. Design addresses 7-11 µm wavelength band, providing stable reflectivity of 90% ±2%, and can be custom-sized and designed directly from specifications/drawings. Filter operation lends to optimized performance at, or near, normal angle of incidence.

Triac Photocouplers include built-in noise immunity.

Toshiba America Electronic Components (TAEC)
Irvine, CA 92618-1811
Nov 25, 2008 Housed in 6-pin DIP packages, Models TLP3782 and TLP3783 provide peak off-stage output voltage of 800 V and isolation voltage up to 5,000 Vrms. Each consists of GaAs IR emitting diode and zero crossing turn-on photo-triac. Units feature trigger LED current of 10 and 5 mA, respectively, input forward current of 30 mA, and on-state current of 0.1 Arms. Zero crossing devices provide optical isolation between logic and AC current to minimize EMI and provide protection from current surges.

Photocoupler suits direct gate driving of IGBTs and MOSFETs.

Toshiba America Electronic Components (TAEC)
Irvine, CA 92618-1811
Jun 16, 2008 Housed in 6-pin SDIP package that meets insulation requirements of international safety standards, Model TLP700 features ±2.0 A peak output current, 2 mA supply current, and 5,000 Vrms isolation voltage. Unit consists of integrated photodetector optically coupled to gallium-aluminum-arsenide LED in package measuring 6.8 x 7.62 x 3.65 mm. Operating from -40 to 100°C, device is suited for factory automation equipment, robots, general-purpose inverters, and ac servo motor control.

Photocouplers incorporate transistor output.

Toshiba America Electronic Components (TAEC)
Irvine, CA 92618-1811
May 02, 2008 Supplied in 4-pin, 6.5 x 4.6 x 3.5 mm plastic DIP, general-purpose TLP781 consists of silicone photo-transistor optically coupled to gallium-arsenide IR emitting diode. Solution meets reinforced insulation class UL, BSI, SEMKO, and VDE international safety standard requirements; offers isolation voltage up to 5,000 V(rms); and has 7.62 mm lead pitch. Variation with wide lead spacing (10.16 mm pitch), TLP781F, is also available.

Modules offer optical coupler/splitter/WDM functionality.

Modules offer optical coupler/splitter/WDM functionality.

M2 Optics, Inc.
Holly Springs, NC 27540
Dec 19, 2007 M2 FiberSplit(TM) Micro Modules feature 2U packages allowing 20 single width passive optical modules to fit into 19 in. rack. At 5.1 x 0.7 in. and 2U high, modules are available in 1 x 2 through 1 x 8 splitters as well as in CWDM and DWDM configurations. They are also available in combinations operating in 1,310 nm, S, C, and L bands. Applications include telecom, Passive Optical Networks (PON), LAN, CATV, and data distribution centers.

IC Photocoupler offers high tolerance for noise.

Toshiba America Electronic Components (TAEC)
Irvine, CA 92618-1811
Jun 07, 2007 Housed in 4.4 x 3.6 x 2.5 mm MFSOP6 package, 20 MBd Model TLP2066 operates from 3.3 V with common mode transient immunity ratio of 15 kV/µsec and 3,750 Vrms isolation voltage. RoHS-compliant unit features operating temperature of -40 to +100°C, and addresses isolation requirements and switching noise elimination in switching power supplies, instrument I/O, computer peripheral interfaces, high-speed disk drive I/O, and microprocessor system interfaces.




(Showing headlines 1 - 7)   


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