Kopp Glass, Inc.    Pittsburgh, PA 15218
Jul 20, 2011 Compatible with Night Vision Imaging Systems, Models K0321 and K0323 feature application thickness of 0.5 mm and 1.0 mm, respectively. Products made from these white LED-compatible, high transmission compositions can be used in civilian or military aircraft to function as annunciators, indicators, and cockpit display light filters. Formulations were designed so that both cast glass and molded forms could be produced.

Morgan Technical Ceramics    Fairfield, NJ 07004
Jul 19, 2011 Made in various sizes and tolerances to meet requirements, extruded micro-sized rods and tubes are available in high-purity Alumina and Steatite to accommodate needs of medical, aerospace, and electronic applications. ODs of extruded rod range from .025-.400 in., and available geometries include solid rod, single-hole, or multi-hole. Rods and tubes extruded from 96%-99.8% pure Alumina provide insulating properties for use in temperatures to 3,200°F and corrosive environments.

King's New Energy    San Jose,, CA 95161-2050
Jul 14, 2011 Utilizing wireless, water-, and wiper-based technology that can be mounted on new or existing solar panel installations, Automatic Cleaning System is integrated with solar panel frame and can effectively remove dirt, dust, and pollutants, optimizing panels' ability to absorb sunlight. Smart, self-cleaning solution includes digital timer that allows customer to preset cleaning intervals.

Mitsubishi Heavy Industries America    Leetonia, OH 44431
Jul 13, 2011 Utilizing Fast Atom Beam gun to irradiate atoms on surface of bonding material, Wafer Bonding Machine enables 3-D integration of LSI circuits on 8 in. wafers at room temperature. FAB gun removes oxide film on surface of bonding metal material that normally impedes bonding. Cassette, capable of housing twenty 8 in. wafers, can perform wafer conveying and alignment for bonding automatically. By eliminating heating process, room-temperature bonding frees devices from heat stress.

Objet Geometries Inc.    Billerica, MA 01821
Jul 12, 2011 Based on 3D inkjet technology, Objet260 Connex prints in 16 micron layers and can print model replica made of up to 14 individual materials in single print run. Users can create prototypes containing distinct material elements, such as rigid walls with flexible, rubber-like joints or models combining transparent and opaque parts. Featuring 10.2 x 10.2 x 7.9 in. tray size, printer uses sealed material cartridges that are easily inserted and removed.

Lincoln Electric Co. Inc., The    Cleveland, OH 44117
Jul 12, 2011 Accommodating fully automated pipe welding applications where consistent arc length is critical, Pipeliner® 81M gas-shielded, flux-cored (FCAW-G) wire can be used on up to X70 grade pipe. Fast-freezing slag provides flat bead shape with consistent puddle support around entire pipe. Capable of producing weld deposits with Charpy V-Notch impact toughness exceeding 27 J at -40°F, wire is available in 0.045 in. dia on 10 and 25 lb plastic spools.

Manncorp    Willow Grove, PA 19090
Jul 08, 2011 Compatible with delicate SMD packages, BR810 has adjustable PCB holder that accepts PCBs up to 18.5 x 13.8 in. as well as split-vision optics with 22x electronic zoom and focus controls and LED lighting. Additional features include profile settings for independent and programmable top and bottom heating, 5 separate thermocouple inputs, control software, and LCD touchscreen display. Capable of micrometer adjustments, system offers automated Z-axis motion with vertical height sensing.

Milliken & Co.    Spartanburg, SC 29304
Jul 07, 2011 Intended mainly for use in polypropylene compounds, Hyperform® HPR-803i can be used to partly or fully replace talc. Parts using reinforcing agent have balance of stiffness and impact strength as well as surface finish that is resistant to scratching. Available as free-flowing powder that can be incorporated during compounding via side-feeder, Hyperform HPR-803i is suited for automobile interior applications.

ITW Devcon    Danvers, MA 01923
Jul 06, 2011 DFense Blok(TM) alumina ceramic bead-filled epoxy compound, when used with surface wetting agent, increases drop impact strength over 1 in. ceramic tile as tested using 85 lb weight with 0.25 in.² striking surface. It also withstood abrasion testing via No. 14 silicon carbide blasted at 40 psi and 45° angle. With working time of 25 min, non-sagging compound can be applied by trowel at thicknesses of ¾ in. on vertical surfaces and ½ in. on overhead surfaces. Functional cure occurs in 4-5 hr.

Bac2 Limited    Southampton SO15 0DJ  United Kingdom
Jul 06, 2011 With CSR Catalysts, users can create formulations suitable for production of storage-stable phenolic and furan-based pre-polymeric mixes. These inherently flame-retardant bulk and sheet molding compounds can be cured rapidly at 120°C or more slowly at temperatures above 50°C. Applications requiring flame-retardant moldings include interior fittings for all forms of transportation, seating for stadia, electrical insulation products, and electronic/electrical systems packaging.

EMI Supply, Inc.    Concord, NC 28027
Jul 06, 2011 Offered in 29 x 28 x 44 in., 24 gal mini and 38 x 27 x 43 in., 37 gal maxi versions, Bio-Circle Parts Washers come with 6 scheduled maintenance calls, Bio-Circle L solution, system startup, and employee training. Bio-Circle L cleaner/degreaser is non-flammable, non-toxic, NSF C1 Listed, and VOC-free, eliminating waste disposal issues. It also carries Triple Zero rating on NFPA Safety Diamond and continuously renews itself while safely removing grease, grime, and debris.

Dorf Ketal Chemicals LLC    Stafford, TX 77477
Jul 05, 2011 Without affecting ink color or gloss, acetylacetone-free Vertec(TM) IA-10 enhances ink adhesion as well as resistance to solvents and greases while also improving heat stability. Product is appropriate for inks used in packaging made with nitrocellulose, polyamide, and polyolefin films for food and consumer products. It is also recommended on NC-coated cellophane, OPP film, shellac-washed aluminum, pearlized polypropylene, and polyethylene-coated milk cartons.

The Modal Shop, Inc.    Cincinnati, OH 45241
Jul 01, 2011 By integrating solid-state power amplifier, SmartShaker(TM) K2007E01 can be driven directly from any sound source. Unit provides force rating of 7 lbf with ½ in. usable stroke and 92% efficiency, contributing to precise modal testing or vibration studies. Model K2007E01 includes flexure suspension arms built from carbon fiber composite and EasyTurn handles for shaker positioning. Multiple gain settings and system mute are selectable via integrated digital control.

Industrial Minerals Corporation Limited    Coos Bay, OR 97420
Jul 01, 2011 Featuring spherical nature and uniform grain sizing, SpheriChrome(TM) provides iron and steel foundries with specialty casting sand that enables production of high-quality products while reducing after casting defects and emissions. Additional benefits include ability to pack in molds tightly for smooth cast finish, optimize tensile strength, and minimize finishing/cleaning costs.

Wilmington Machinery, Inc.    Wilmington, NC 28406 7308
Jun 30, 2011 Featuring 14.5 x 5 m footprint, Lumina Pallateer No. 4 Plastic Pallet System utilizes extruder capable of melting 2,400 lb/hr and can produce 960,000 nestable one-way 48 x 48 in. or 1,200 x 1,200 mm pallets/year. Fully automated production cell includes top entry stacking robot, blender, loaders, nitrogen gas generator, mold cooling water chiller, and 2 stack type dual cavity aluminum molds with support beams.

DuPont Co., Packaging & Industrial Polymers    Wilmington, DE 19898
Jun 29, 2011 Kalrez® 9300 parts offer balanced performance in remote and in-situ plasma for etch process manufacturers. For deposition processes where ozone is prominent, Kalrez® 9500 provides manufacturers with parts that demonstrate resistance to process chemistry. Additional applications for low outgassing Kalrez 9500 parts, resistant to ozone, ammonia, and water vapor, include SACVD and ash/strip processes. Max continuous service temperature rating is 310°C.

Integral Technologies, Inc.    Bellingham, WA 98225
Jun 28, 2011 Composed of polyamide 66 and nickel-plated carbon fiber, ElectriPlast(TM)-CF66 is engineered to meet electro-magnetic shielding, thermal requirements, and mechanical properties for automotive, marine, and aerospace applications. Non-corrosive electrically conductive, resin-based composite can be molded into any shape or size associated with plastics, rubbers, and other polymers. Material also withstands corrosive fluids and high-frequency vibration.

Advantech Manufacturing, Inc.    New Berlin, WI 53151
Jun 28, 2011 Occupying 10 in. footprint and weighing 36 lb, portable Meinzer II eliminates need for hand sieving with its gentle motion. Electromagnetic drive produces simultaneous vertical and horizontal movement needed for basic dry particle sizing analysis, while rugged construction and lack of internal moving parts promotes maintenance-free, repeatable use. Supporting timed or continuous operation, unit can accommodate several 3 or 8 in. test sieves concurrently.

Chemineer, Inc., A Unit of Robbins & Myers, Inc.    Dayton, OH 45401
Jun 27, 2011 With design that facilitates seal maintenance, Model 20 HT/GT modular agitators eliminate need to lift or remove gearbox. Replacement of mechanical seal is done by rotating gearbox 90° around pivot pin. Seal pedestal top opens for clear, line-of-site view and provides ample room for removal of coupling half and seal assembly. Other components include gearbox optimized for efficiency with helical gearing and parallel shaft configuration. Available range of speeds promote process control.

EV Group Inc.    Tempe, AZ 85284
Jun 27, 2011 Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing enables ramp-up of 3D-IC and TSV manufacturing from pilot-line to volume production.