Electronic Components & Devices

Electronic Components & Devices, Software, Materials & Material Processing, Test & Measuring Instruments

Rapid Prototyping Kit digitizes wideband RF signals.

November 21, 2014

With AD-FMCDAQ2-EBZ Kit, digital and analog designers can prototype JEDEC JESD204B SerDes GSPS data converter-to-FPGA interface on major FPGA platforms, including Xilinx’s UltraScale FPGA and Zynq All Programmable SoC devices for radar, instrumentation, wireless radio, and other DAQ applications. FMC form factor enables users to verify hardware and processing algorithms and rapidly move from prototype to production, minimizing risk associated with designing wideband RF signal processing systems. Read More

Electronic Components & Devices, Controls & Controllers

P-Cap Touch Controller supports large format sensing sensors.

November 21, 2014

With 32-bit ARM® Cortex® M4 processor that can run at 168 MHz, ZXY110 improves speed, accuracy, and EMI stability of self-service touchscreens. Processor is accompanied by 2 ASIC devices that maximize touch detection performance, even through cover glass exceeding 10 mm thick. While 32-input version covers self-capacitive p-cap (PCT™) touch sensors with up to ~19 in. diagonals, 64-input version suits PCT sensors with 19–46 in. diagonals. Controler updates touch event coordinates in <5 msec. Read More

Electronic Components & Devices

High-Power LF Initiator IC integrates immobilizer functionality.

November 21, 2014

Supplied in 48-pin TQFP, MLX74190 consists of 2 independently programmable low-frequency (LF) drivers and 2 built-in immobilizers. Device can be programmed to generate sine (1 A peak) or square (2.5 A peak) waves with frequencies from 109–140 kHz and output amplitude from 0.25–32 V peak-to-peak. Drivers can be used in full- or half-bridge configurations, and amplitude-shift keying (ASK) or phase-shift keying (PSK) modulation can be used to transmit LF telegrams to key or LF receiver. Read More

Electronic Components & Devices

Automotive Grade Film Capacitors serve safety applications.

November 21, 2014

Available in capacitances up to 4.7 µF and rated voltages up to 310 Vac, F862 Metallized Polypropylene Film Class X2 Series meets AEC-Q200 qualification requirements by passing 1,000 hr life testing at 85°C with 85% RH at 240 Vac. These RFI X2 capacitors are intended for noise filtering and peak voltage protection when connected parallel to mains or in series such as in smart meter. Design resists capacitance-loss mechanisms, promoting long-term stability. Read More

Electronic Components & Devices, Communication Systems & Equipment

Wideband IF Receiver Chip provides wide dynamic range.

November 20, 2014

IF subsystem-on-a-chip, AD6676, uses programmable continuous-time bandpass sigma delta ADC technology to digitize IF signals from 70–450 MHz. Single-chip solution can reduce complexity of receiver designs while promoting frequency planning flexibility and optimal instantaneous dynamic range. Implementation in deep sub-micron CMOS allows oversampling by providing digitized bandwidth of up to 160 MHz, and combination of features enables reconfigurable radio architectures. Read More

Electronic Components & Devices, Test & Measuring Instruments

Sigma Delta A/D Converter features rail-to-rail input buffer.

November 20, 2014

Delivering 24 noise-free bits at 20 SPS and 17.2 noise-free bits at 250 kSPS, Model AD7175-2 enables small signal deviations to be measured as required within analytical laboratory instrumentation systems. Device features 2 differential or 4 single-ended channels, integrated 2.5 V buffered 2 ppm/°C reference, and per-channel programmable digital filters. With 50 kSPS/channel scan rate and 20 µs settling time, converter is suitable for PLC and distributed control system input modules. Read More

Electronic Components & Devices, Mechanical Power Transmission, Electrical Equipment & Systems

DIN Rail Mounting Enclosure houses Raspberry Pi B+.

November 20, 2014

Produced in UL94V-0 self-extinguishing material, Modulbox 4M RMB fosters use of Raspberry Pi B+ within industrial and process control applications. Enclosure features transparent top panel, body enclosure, and base, and DIN rail hook allows enclosure to be mounted on DIN Rail. Manufactured with openings for specific input and output requirements of Raspberry Pi B+ platform, enclosure can also be machined/printed to custom specifications for volumes from 50–100 minimum. Read More

Electronic Components & Devices, Computer Hardware & Peripherals

USB 3.0 Interface ICs come in low-pin count packages.

November 20, 2014

Respectively, FT600Q and FT601Q come in 56- and 76-pin QFN packages and feature 16- and 32-bit wide FIFO bus interface. Both chips, which function as SuperSpeed USB 3.0 to FIFO bridges, support up to 8 endpoints (other than management endpoints) linked to configurable buffers of 16 KB length for in and 16 KB for out. Providing data bursting rates up to 3.2 Gbps, USB 3.0 products support 2 interfacing modes: 245 FIFO mode and multi-channel FIFO mode. Read More