Ohmite Mfg.    Rolling Meadows, IL 60008
May 14, 2012 C-series heatsinks feature camming clips that eliminate need for mounting holes and screws and provide same amount of force after repeated use. They are now offered in 30, 58, and 85 mm for TO-264 packages. Series is also offered in 25, 50, and 75 mm lengths for TO-220 and TO-247 devices, and TO-126 heatsinks are offred in 25 mm for single clip and 40 mm for 2 clips. Custom lengths and clip quantities are available.

GlacialTech Inc.    Taipei   Taiwan
Apr 16, 2012 Igloo 5761 series, comprising 96 x 128 x 90 mm tower style exposed heatpipe base CPU coolers, is designed for socket types from Intel LGA775/1155/1156 and AMD FM1/AM2/AM2+/AM3/AM3+ and also provides cooling effect to components around CPU. With 30 dBA noise rating, PWM version increases/deceases fan speed, from 800 (±300 rpm) to 2,000 rpm (±10%), to match CPU load and produces 43 cfm airflow. Constant fan speed version, operating at 1,200 rpm, produces 34 cfm and is rated at 20 dBA.

GlacialTech Inc.    Taipei   Taiwan
Apr 13, 2012 Designed for reduced noise operation, CE- and UL-approved Igloo S26 Series CPU coolers also provide cooling to components around CPU. This 80 x 65 x 125 mm product, weighing 260 g, is available for various socket types, from Intel® LGA775/1155/1156 to AMD® FM1/AM2/AM2+/AM3/AM3+, and enhances CPU working hours. With rated voltage of 12 Vdc, 80 x 80 x 25 mm fan operates at up to 1,600 rpm ±10% and produces up to 26.5 cfm airflow @ 17 dBA.

Ohmite Mfg.    Rolling Meadows, IL 60008
Apr 03, 2012 At 27 mm long, MV/MA 101 and 301 heatsinks hold 2 TO-264 devices with single spring clip. This eliminates need for mounting holes and screws and provides same amount of force after repeated use. At 38 mm tall, R2 Series is offered in TO-264 configuration with cam-clip that secures device without mounting holes or screws. W Series, featuring integrated spring clip, is also designed to secure TO-264 device. All heatsinks are available with degreased, black, or anodized finishes.

congatec AG    Deggendorf   Germany
Mar 08, 2012 Based on cooling pipes which are integrated in standardized heatspreader of COM Express specification, Cooling System makes it possible to cool next generation processors with power dissipation of well over 35 W thermal design power (TDP). Design is available in different variants comprising passive, active, and customer-specific solutions. By eliminating mechanical stress, cooling system optimizes quality and extends life span of module.

Noctua, Inc.    Mountain View, CA 94043
Feb 29, 2012 Suited for small form factor cases and HTPC environments, Model NH-L12 combines 120 mm Model NF-F12 with 92 mm Model NF-B9 and can be configured for full performance in dual fan mode or extra-low profile with top fan removed. Fans support PWM for automatic speed control, and maximum fan speed can be reduced to 1,200/1,300 rpm using supplied low noise adaptors for quieter operation. NT-H1 thermal compound and SecuFirm2(TM) multi-socket mounting system are included.

Ohmite Mfg.    Rolling Meadows, IL 60008
Feb 17, 2012 Measuring 38 mm tall x 35.2 mm wide, R Series Heatsinks utilize cam-clip, which eliminates need for screw hole. Since no screws are required for device mounting, additional fins can be added to rear side of heatsink for maximum total surface area and optimal thermal performance. Designed to attach TO-220 or TO-247 components, clip has self-aligning features and provides same amount of force after repeated use.

Ohmite Mfg.    Rolling Meadows, IL 60008
Oct 17, 2011 Measuring 2.2 in. across x 1.71 in. tall, MV/MA 302 Series uses 2 internal spring clips for mounting up to four TO-247 or TO-264 devices, eliminating need for mounting holes and screws. Units are constructed of aluminum alloy 6063-T5 or equivalent with either degreased or black anodized finish. Four models are available with thermal resistance of 6.0, 5.2, 3.6, and 3.0°C/W.

Advanced Thermal Solutions Inc.    Norwood, MA 02062
Jul 26, 2011 With integral push pin mounting system, maxiFLOW(TM) heat sinks offer accelerated, safe attachment onto BGAs and other hot components. Each heat sink comes with one pair of plastic or brass push pins that run through opposite corners of heat sinks and mount securely into 3.00 mm holes in PCB as laid out in industry standard patterns. While integral spring on each pin provides ~2 lb of retention load, low-profile spread fin array maximizes surface area for effective convection cooling.

GlacialTech Inc.    Taipei   Taiwan
Jul 06, 2011 Intended for 65 W AMD CPUs with FM1/AM2/AM2+/AM3 sockets, Igloo A200 Series includes 3 models made of aluminum alloy that measure 68 x 76 x 42.3 mm and weigh 165 g. Included 12 Vdc fan measures 70 x 70 x 15 mm and operates, depending on model, up to 2,600, 3,200 rpm, or 1,200 PWM (±300 rpm) to 3,600 ±10%. Respectively, airflow values of 18.4, 22.4, and 27.6 ±10% cfm are achieved with noise ratings of 21, 26, and 34 dBA. In PWM version, fan speed increases with CPU load.

Novel Concepts Inc.    San Francisco, CA 94123
May 11, 2011 Developed to fit inside notebooks, monitors, and tablets, ThinSink(TM) cools integrated circuits, semiconductors, LEDs, and other microelectronic heat generating devices. Using 40 mm diameter fan spinning at 6,000 rpm, heat sink consumes 0.031 W of electricity and provides thermal performance of 2.73°C/W. Thin, smooth fan surface eliminates pulsating sound and vibration caused by traditional fan blades. At 6,000 rpm, ThinSink has sound output less than 34 dBA.

Fischer Elektronik GmbH und Co. KG    Lüdenscheid   Germany
Sep 16, 2010 Adapted to suit 19 in. subracks, heatsinks promote reliable functioning of electronic subassemblies in EMC applications. Heatsinks have width of 84U and height that matches subrack. Able to be installed on rear or front of subrack, heatsink complies with EMC requirements and features electrically conductive surface coating and contact strips for connection to subrack chassis. Customer-specific designs can be accommodated.

Fischer Elektronik GmbH und Co. KG    Lüdenscheid   Germany
Sep 07, 2010 Attached by being pushed onto housing, FK 252 series are designed to accommodate electronic components in TO220 housings with 0.5 mm thick base plates. Integral retaining clips keep component in place and ensure favorable heat transfer from component to heatsink. Series includes 4 different versions: for vertical installation using 2 soldering pins with different lengths, for horizontal soldering, and for installation without soldering pin.

Ironwood Electronics, Inc.    St. Paul, MN 55121
May 17, 2010 Able to dissipate up to 16 W with additional fan mounted on top, HS-SG-6002 is designed for 31 x 31 to 42.5 x 42.5 mm package size, and also serves as compression mechanism for GHz socket. Constructed with 7075 Aluminum and optimized using fin design, heat sink screw has thermal resistance of 0.530 C/W.

IXYS Corp.    Santa Clara, CA 95054 2704
Feb 02, 2010 Aluminium Nitride cooler, featuring 133 mm dia, is suitable for press-pack devices with electrode contacts up to 125 mm dia. Unit incorporates geometric water channel design to ensure low values of thermal resistance even at moderate coolant flows. Typical cooler to input water thermal resistance for flow rate of 10 L/min are 5.2 K/kW, with 2 coolers and 1 semiconductor, and 6.1 K/kW with 3 coolers and 2 semiconductors. Isolation voltage between water and device is 10 kV.

Advanced Thermal Solutions Inc.    Norwood, MA 02062
Jan 20, 2010 Featuring spread fin array that maximizes surface area for effective convection cooling, maxiFLOW(TM) heat sinks cool ICs and other hot components in narrow packaging and low airflow velocity conditions. Standard heights are as low as 9.5 mm, and extruded aluminum fabrication minimizes thermal resistance from base to fins. Pre-assembled with ATS maxiGRIP(TM) mounting hardware, sinks meet requirements for Telcordia GR-63-Core, ETSI 300 019, and MIL-STD-810.

Noctua, Inc.    Mountain View, CA 94043
Dec 16, 2009 Featuring NF-P14 140 mm fan with Vortex-Control Notches for quiet operation, Model NH-C12P SE14 provides CPU cooling as well as optimal airflow for near-socket motherboard components. Cooler includes pro-grade NT-H1 thermal compound and SecuFirm2(TM) multi-socket mounting, which supports LGA1366, LGA1156, LGA775, AM2, AM2+, and AM3, making cooler compatible with Intel's Core i7 and Core i5 processors.

Applied Power Systems, Inc.    Hicksville, NY 11801
Sep 29, 2009 Featuring voltages from 100-20,000 V and currents ranging from 30-3,000 A, Semiconductor Assemblies come in single, double, or 3-phase circuit configurations. Units are also available as full bridge or as series stacks and AC or static switches. Bus bars, gate firing circuits, fuses, snubbers, blowers, and fans are optional. Typical applications include power supplies, AC/DC and static converters, AC phase controllers, UPS, and motor starters.

Custom Sensors & Technologies (CST)    Moorpark, CA 93021
Jul 31, 2009 Designed for DIN rail or panel mounting, HS series heat sinks accept 1, 2, or 3 industry standard, single-, dual-, or 3-phase relays. They are available with thermal impedance ratings from 5.0-0.5°C/W. Solid state relay/heat sink assemblies are available at either 280 or 600 Vac. Systems feature 3-32 Vdc input control voltage, zero voltage turn on, and output RC snubber networks and are suited for controlling most heating, motion, or lighting loads.

Advanced Anti-Vibration Components - AAC    New Hyde Park, NY 11040
Jun 19, 2009 Measuring 15.7 x 15.7 and 0.5-3 mm thick, V30Z62MCH Series is usable over temperature range of -40 to +392°F and offers thermal conductivity range of 1.8-6.5 Wm-k. Soft gel sheets provide electric insulation, and are both RoHS-compliant and UL-94 V-0 approved. Applications include computer internal components such as CPU, motherboards, power transformers, power supply equipment, and electronic parts such as semiconductors that produce heat.