Applied Power Systems, Inc.
Hicksville, NY 11801
Sep 29, 2009 Featuring voltages from 100-20,000 V and currents ranging from 30-3,000 A, Semiconductor Assemblies come in single, double, or 3-phase circuit configurations. Units are also available as full bridge or as series stacks and AC or static switches. Bus bars, gate firing circuits, fuses, snubbers, blowers, and fans are optional. Typical applications include power supplies, AC/DC and static converters, AC phase controllers, UPS, and motor starters.

Custom Sensors & Technologies (CST)
Moorpark, CA 93021
Jul 31, 2009 Designed for DIN rail or panel mounting, HS series heat sinks accept 1, 2, or 3 industry standard, single-, dual-, or 3-phase relays. They are available with thermal impedance ratings from 5.0-0.5°C/W. Solid state relay/heat sink assemblies are available at either 280 or 600 Vac. Systems feature 3-32 Vdc input control voltage, zero voltage turn on, and output RC snubber networks and are suited for controlling most heating, motion, or lighting loads.

Advanced Anti-Vibration Components - AAC
New Hyde Park, NY 11040
Jun 19, 2009 Measuring 15.7 x 15.7 and 0.5-3 mm thick, V30Z62MCH Series is usable over temperature range of -40 to +392°F and offers thermal conductivity range of 1.8-6.5 Wm-k. Soft gel sheets provide electric insulation, and are both RoHS-compliant and UL-94 V-0 approved. Applications include computer internal components such as CPU, motherboards, power transformers, power supply equipment, and electronic parts such as semiconductors that produce heat.

Corsair Memory
Fremont, CA 94538
Jun 16, 2009 Supplied pre-filled and fully connected, Corsair Cooling(TM) Hydro Series H50 utilizes copper CPU cooling plate and integrated pump connected to 120 mm radiator and low-noise fan. Low permeability tubing virtually eliminates evaporation and leaking. Closed-loop system includes mounting brackets for both Intel LGA775 and Intel LGA1366 socket motherboards. Brackets for AMD socket AM2 and AM3 motherboards are also available.

Nexus Technology
Nieuwerkerk aan den IJssel   Netherlands
Jun 03, 2009 Model TDD-9000 is soft black velvet blanket with gel-like liquid inside that is able to dissipate heat. When used with active laptop for 40 min, computer temperature is reduced by 17°C. For optimal cooling, pad should be lifted and shaken every 20 min. It can be folded and carried with laptop and will not scratch it.

Elma Electronic Inc.
Fremont, CA 94538
Apr 29, 2009 Aluminum based black anodized Elma front panel heat sinks dissipate heat while covering open sections of enclosure. Cooling fin extrusion has width of 42 HP and comes in 1U high increments. Each fin is built upon 1.5 HP pitch to leave enough space in between for screw heads. Heat sink front panels come in various sizes and configurations, but are specifically designed for 19 in. technology. EMC versions with mounting bracket for gaskets are also available.

Elite Thermal Engineering
Bothell, WA 98021
Feb 02, 2009 With ability to deliver 0.04ºC/w in 320 x 160 mm footprint, model HS-004 suits applications in high power IGBTs, power converter modules, and high power laser sources. It is available with 5 high power fans, fan duct, and terminal block, facilitating power supply connection. Other features include segmented high density fins to break down laminar flow layers periodically along flow path to increase turbulence.

Celsia Technologies
Miami, FL 33131
Jan 14, 2009 Available to computer OEMs and ODMs, NanoSpreader(TM) model 401-AM-001 is used to cool AMD's quad core Opteron processors. Use results in both performance enhancements as well as weight savings, which minimizes stress on retention mechanism and processor. Offered as alternative to solid copper/copper fin heat sinks, vapor chamber-based heat sink can be used with any Socket F 1U server.

Elite Thermal Engineering
Bothell, WA 98021
Aug 20, 2008 Combining forging and heatpipe technology, Model HS-008 fan/heatsink combo delivers 0.08ºC/W in compact 160 x 160 mm footprint. It has segmented high density fins that break down laminar flow layers periodically along flow path to increase turbulence. Suited for high power IGBTs, power converter modules, and high power laser sources, unit is available with 2 high power 60 mm fans, one fan duct, and one terminal block for connection to power supplies.

Asus Computer, Inc.
Newark, CA 94560
Jul 23, 2008 Measuring 137 x 120 x 123 mm, Triton 85 is designed with top flow 120 mm fan and features high-density fins, dynamic fan speed control, and 4 pure copper heat pipes. PWM function controls fan speed (1,400 rpm ±10%) depending on CPU temperature. Suited for users who need to overclock past 130-180 W and retain quiet operation, cooler supports Intel® Core(TM)2, Core(TM)2 Quad/Duo, and Pentium® processors as well as AMD Athlon(TM) 64/X2/FX and Phenom(TM) FX/X2/X4 processors.

Celsia Technologies
Miami, FL 33131
Mar 25, 2008 NanoSpreader Vapor Chambers are 2-phase chambers into which pure water is vacuum-sealed, absorbed by copper wick, and passed as vapor through micro-perforated copper sheet and returned as liquid to wick. Contained in packages from 1.5-70 mm, they attach directly to heat source and can cool power densities up to 150 W/cm² while offering multidirectional thermal spreading as low as 0.02°C/W. Units can withstand clamping forces up to 90 psi and repeated exposure from -40 to +100°C.

Optek Technology, Inc.
Carrollton, TX 75006-6905
Mar 17, 2008 Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/m°K thermal conductivity, and 1.8°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in.

Nexus Technology
Nieuwerkerk aan den IJssel   Netherlands
Feb 22, 2008 Available in black, blue, and plain aluminum, HXR-5500 features aluminum extrusion heatsink with integrated 5 mm dia heat pipe used to cool memory modules. Heat pipe transports heat from memory module onto detached aluminum heat sink on top of module. By using this product, memory module temperature can be reduced by 13 to 14°C.

Elite Thermal Engineering
Bothell, WA 98021
Jan 16, 2008 Intended for fiber laser OEM or laboratory cooling applications, Model OCP-110 provides 110 W cooling capacity when set temperature is same as ambient. Set temperature can be 48°C below ambient when heat load is zero. All thermoelectric coolers in device are environmentally sealed so that OCP-110 can operate at below dew point set temperatures. Side-cooled by ducting air through high-density heatsinks, copper plate accommodates lasers made by QPC, LIMO, and nLight.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Apr 02, 2007 Made from black anodized, extruded aluminum, Models ATS-590 and ATS-619 RoHS compliant heat sinks maintain component case temperature at or below manufacturer's thermal specifications. Model ATS-590 measures 9.5 x 25 x 25 mm, has thermal resistance of 8.42°C/W at its base in air velocity of 200 ft/min. Measuring 22 x 24 x 16.25 mm, ATS-619 has thermal resistance of 6.11°C/W, and employs maxiGRIP(TM) attachment solution with plastic frame clip that snaps securely around chip.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Feb 06, 2007 Fabricated from extruded aluminum, models ATS-486, ATS-503, and ATS-504 mitigate intensity of heat generated by high-output LEDs and ensure maintenance-free service life. These maxiFLOW(TM) heat sinks feature low-profile, spread fin array that maximizes surface area for effective convection cooling, particularly when air flow is limited. Available un-anodized or black anodized, with thermal tape or without, products have been tested on OSRAM's DRAGONstick® LEDs.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Jan 31, 2007 Designed for Freescale Semiconductor's MPC8349E PowerQUICC II Pro processors, Model ATS-552 helps ensure that junction temperatures do not exceed maximum specified value. Unit's thermal resistance is 2.7°C/W at its base in air velocity of 200 fpm. Made from black anodized aluminum, heat sink features 14 integral linear fins, 0.5 mm thick, to maximize cooling surfaces in local airflow. Unit is preassembled with ATS maxiGRIP(TM) mounting system.

Celsia Technologies
Miami, FL 33131
Dec 07, 2006 Iceon(TM) 1000CG graphics card cooling product offers manufacturers of graphics cards, boards, and PCs quiet operation while maintaining very low temparatures. Product includes fan packaged with NanoSpreader(TM) thin and light heat spreader technology, which enables slow fan speeds to increase fan life and decrease noise.

Celsia Technologies
Miami, FL 33131
Oct 26, 2006 With micro thermofluidic casing, Iceon(TM)1000C desktop cooler is built for cooling computers that are used for heat-intensive graphic and video-rich processing applications. Cooler includes fan along with lightweight 2-phase NanoSpreader(TM) heat spreader which uses razor-thin plates or tubes that integrate with any electronic device. Product offers quiet operation under extreme conditions.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Aug 31, 2006 Featuring integral fan that blows air through linear field of flat aluminum fins, Juneau ATS-405 Active Heat Sink delivers thermal resistance of 0.51°C/W with thermal grease. Developed to cool Freescale processors in restricted height enclosures, Anchorage ATS-474 Passive Heat Sink features maxiFLOW(TM) angled fin technology with thermal resistance of 1.05°C/W in air velocity of 100 lfm and 0.49°C/W in air velocity of 400 lfm.