Asus Computer, Inc.
Newark, CA 94560
Jul 23, 2008 Measuring 137 x 120 x 123 mm, Triton 85 is designed with top flow 120 mm fan and features high-density fins, dynamic fan speed control, and 4 pure copper heat pipes. PWM function controls fan speed (1,400 rpm ±10%) depending on CPU temperature. Suited for users who need to overclock past 130-180 W and retain quiet operation, cooler supports Intel® Core(TM)2, Core(TM)2 Quad/Duo, and Pentium® processors as well as AMD Athlon(TM) 64/X2/FX and Phenom(TM) FX/X2/X4 processors.

Celsia Technologies
Miami, FL 33131
Mar 25, 2008 NanoSpreader Vapor Chambers are 2-phase chambers into which pure water is vacuum-sealed, absorbed by copper wick, and passed as vapor through micro-perforated copper sheet and returned as liquid to wick. Contained in packages from 1.5-70 mm, they attach directly to heat source and can cool power densities up to 150 W/cm² while offering multidirectional thermal spreading as low as 0.02°C/W. Units can withstand clamping forces up to 90 psi and repeated exposure from -40 to +100°C.

Optek Technology, Inc.
Carrollton, TX 75006-6905
Mar 17, 2008 Meeting UL-94 V0 flammability specifications, OptoTherm(TM) OCB201 Series heat spreader substrates create thermal path for removing heat from visible LEDs. Substrates feature high isolation voltage with dielectric breakdown of 4 kVdc, 1.1 W/m°K thermal conductivity, and 1.8°C/W thermal resistance. Copper and aluminum thicknesses are 0.0042 and 0.062 in., respectively. Maximum substrate panel size is 18 x 16.5 in. with available thicknesses of 0.038, 0.070, and 0.133 in.

Nexus Technology
Nieuwerkerk aan den IJssel   Netherlands
Feb 22, 2008 Available in black, blue, and plain aluminum, HXR-5500 features aluminum extrusion heatsink with integrated 5 mm dia heat pipe used to cool memory modules. Heat pipe transports heat from memory module onto detached aluminum heat sink on top of module. By using this product, memory module temperature can be reduced by 13 to 14°C.

Elite Thermal Engineering
Bothell, WA 98021
Jan 16, 2008 Intended for fiber laser OEM or laboratory cooling applications, Model OCP-110 provides 110 W cooling capacity when set temperature is same as ambient. Set temperature can be 48°C below ambient when heat load is zero. All thermoelectric coolers in device are environmentally sealed so that OCP-110 can operate at below dew point set temperatures. Side-cooled by ducting air through high-density heatsinks, copper plate accommodates lasers made by QPC, LIMO, and nLight.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Apr 02, 2007 Made from black anodized, extruded aluminum, Models ATS-590 and ATS-619 RoHS compliant heat sinks maintain component case temperature at or below manufacturer's thermal specifications. Model ATS-590 measures 9.5 x 25 x 25 mm, has thermal resistance of 8.42°C/W at its base in air velocity of 200 ft/min. Measuring 22 x 24 x 16.25 mm, ATS-619 has thermal resistance of 6.11°C/W, and employs maxiGRIP(TM) attachment solution with plastic frame clip that snaps securely around chip.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Feb 06, 2007 Fabricated from extruded aluminum, models ATS-486, ATS-503, and ATS-504 mitigate intensity of heat generated by high-output LEDs and ensure maintenance-free service life. These maxiFLOW(TM) heat sinks feature low-profile, spread fin array that maximizes surface area for effective convection cooling, particularly when air flow is limited. Available un-anodized or black anodized, with thermal tape or without, products have been tested on OSRAM's DRAGONstick® LEDs.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Jan 31, 2007 Designed for Freescale Semiconductor's MPC8349E PowerQUICC II Pro processors, Model ATS-552 helps ensure that junction temperatures do not exceed maximum specified value. Unit's thermal resistance is 2.7°C/W at its base in air velocity of 200 fpm. Made from black anodized aluminum, heat sink features 14 integral linear fins, 0.5 mm thick, to maximize cooling surfaces in local airflow. Unit is preassembled with ATS maxiGRIP(TM) mounting system.

Celsia Technologies
Miami, FL 33131
Dec 07, 2006 Iceon(TM) 1000CG graphics card cooling product offers manufacturers of graphics cards, boards, and PCs quiet operation while maintaining very low temparatures. Product includes fan packaged with NanoSpreader(TM) thin and light heat spreader technology, which enables slow fan speeds to increase fan life and decrease noise.

Celsia Technologies
Miami, FL 33131
Oct 26, 2006 With micro thermofluidic casing, Iceon(TM)1000C desktop cooler is built for cooling computers that are used for heat-intensive graphic and video-rich processing applications. Cooler includes fan along with lightweight 2-phase NanoSpreader(TM) heat spreader which uses razor-thin plates or tubes that integrate with any electronic device. Product offers quiet operation under extreme conditions.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Aug 31, 2006 Featuring integral fan that blows air through linear field of flat aluminum fins, Juneau ATS-405 Active Heat Sink delivers thermal resistance of 0.51°C/W with thermal grease. Developed to cool Freescale processors in restricted height enclosures, Anchorage ATS-474 Passive Heat Sink features maxiFLOW(TM) angled fin technology with thermal resistance of 1.05°C/W in air velocity of 100 lfm and 0.49°C/W in air velocity of 400 lfm.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Aug 01, 2006 Measuring 9 mm in height, Model EX2 is suited for use inside enclosures where space is limited. Case-to-ambient thermal resistance is 1.8°C/W within air velocity of 600 fpm. Unit can be securely attached to component with double-sided, thermally conductive adhesive tape. No mechanical hardware is required.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Jan 24, 2006 Fabricated from lightweight extruded aluminum, maxiFLOW(TM) heat sinks are utilized for cooling BGAs and hot components inside electronic systems. Featuring low profile spread fin arrays to enable convectional air cooling within restricted/low air flow conditions, they are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at 2 mm.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Apr 22, 2005 Measuring 4–7 mm in height, blueICE™ Heat Sinks feature thermal resistance as low as 1.23°C/W within air velocity of 600 fpm. Double-sided, thermally conductive adhesive tape can be used to attach heat sinks securely to components so no mechanical hardware is needed. Units are suited for use inside most telecommunications enclosures where space is limited.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Mar 15, 2005 Low-profile powerICE™ heat sinks optimize thermal management of PCB-mounted power modules in spatially-constrained applications with bypassed and unducted flow conditions. Measuring 58 x 61 x 4–7 mm, products have aluminum fins and base and exhibit thermal resistance down to 1.23°C/W with air velocity of 600 fpm. They are provided with double-sided, thermally conductive adhesive tape for assembly without fasteners.

Lytron, Inc.
Woburn, MA 01801 1039
Aug 29, 2003 Ascent™ Series all-copper cold plates provide contact cooling of high watt-density electronic components such IGBTs, MOSFETs, resistors, and diodes. Normalized thermal resistance at 1 gpm is 0.58°C in²/W, and pressure drop at 0.5 gpm is 3 psi. Internal crisscrossed fin structure offers increased surface area. Available with straight or beaded fittings, plates are pressure tested to 30 psi and have maximum operating temperature of 125°F.

Advanced Thermal Solutions Inc.
Norwood, MA 02062
Aug 12, 2003 Low-profile powerICE™ heat sinks optimize thermal management of pcb-mounted power modules in spatially constrained applications with inadequate airflow. Offered with 100, 200, 400, and 600 ft/min velocities, products provide resistance values from 1.23–14.0 Rca. Suited for bypassed and unducted flow conditions, units are offered in 6 package sizes from 7 x 58.2 x 61 to 4.0 x 58.2 x 36 mm.

Lytron, Inc.
Woburn, MA 01801 1039
Aug 09, 2002 High Performance Series™ cold plates offer corrugated aluminum fins, which provide heat transfer surface. Vacuum brazing produces parts with uniform thermal conductivity over large surface area. Cold plates may be customized to any application and are available in sizes from 4 to 700 in² (as thin as 0.10 in.). They are manufactured by inserting aluminum fin into aluminum plate with machined cavity. Plate, lid, and fin are joined with vacuum brazing.

Lytron, Inc.
Woburn, MA 01801 1039
Jun 07, 2002 Press-Lock II™ series uses smaller, tightly packed tubes to improve thermal performance by 40 to 50% over company’s previous models. Plates are 0.3 in. thick and tubes are 0.25 in. dia, allowing for tight packaging and stack construction. Tubes are coplanar with plate, allowing parts to be mounted on both sides. Applications include cooling electronics, power supplies, lasers, RF transmitters, semiconductor processing equipment, thermoelectrics, and UPSes.

Lytron, Inc.
Woburn, MA 01801 1039
Apr 08, 2002 Aluminum Saddle has through or tapped holes for securing company's CP-20 Extended Surface cold plates to electronic boards. It applies consistent force across cold plate, ensuring good thermal connection. All-aluminum cold plates consist of connector tubes welded to micro-channel aluminum extrusion. They can be used with EGW, refrigerant, Fluorinert(R), and other fluids to remove heat from high heat load discrete components.