No-Clean Solder Paste suits PoP applications.
March 20, 2013 -
Designed for use in package-on-package applications 0.3 mm and larger, Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Product's rheology optimizes both dipping and package retention. Featuring typical viscosity of 150 kcps, typical tack strength of 40 g, and working life of 8 hours at room temperature, solder paste eliminates defects due to package warping.
|Original Press Release |
34 Robinson Rd.
Clinton, NY, 13323
Indium Corporation Announces New PoP Solder Paste
Indium9.91 is a no-clean solder paste designed for use in package-on-package (PoP) applications 0.3mm and larger. Its rheology optimizes both dipping and package retention.
• Eliminates defects due to package warping
• Provides excellent solderability
• Has a long pot life
• Provides consistent solder paste volumes
Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium, and tin compounds, and high purity metals; and Reactive NanoFoilŪ. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org.