Heat Sink Screw is designed for GHz BGA socket.
May 17, 2010 -
Able to dissipate up to 16 W with additional fan mounted on top, HS-SG-6002 is designed for 31 x 31 to 42.5 x 42.5 mm package size, and also serves as compression mechanism for GHz socket. Constructed with 7075 Aluminum and optimized using fin design, heat sink screw has thermal resistance of 0.530 C/W.
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Original Press release
Ironwood Electronics, Inc.
P.O. Box 21151
St. Paul, MN, 55121
USA
Heat Sink Screw for GHz Socket
BURNSVILLE, MN - Ironwood Electronics has recently introduced a series of heat sink screw for our high performance GHz BGA socket family. The HS-SG-6002 heat sink screw is designed for 31mm x 31mm to 42.5mm x 42.5mm package size and dissipates up to 16 watt with additional fan mounted on the top. In addition to heat dissipation, the heat sink screw also serves as a compression mechanism for the GHz socket. The heat sink screw threads into the socket lid which can be swivel open from the socket base. After placing the IC inside the socket cavity, swivel the lid and turn the heat sink compression screw. This provides enough force to compress the device on to the contact element as well as optimum surface contact with IC top side for heat dissipation to keep IC's junction temperature without exceeding its limits.
The HS-SG-6002 heat sink screws are constructed with 7075 Aluminum and optimized using fin design with maximum surface area per simulation results from Qfin software. The thermal resistance of heat sink screw is 0.530 C/W. Maximum temperature seen at heat sink base was 30.27C and the minimum temperature seen at fins was 29.89C.
Heat sink screw family consists of 4 different types with a cross reference to corresponding GHz socket family. Pricing for the HS-SG-6002 is $99 at qty 1; with reduced pricing available depending on quantity required.
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