Ironwood Electronics, Inc
Burnsville, MN 55337
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Clamshell Spring Pin QFN Socket accommodates 10TDFN package.
Designed for testing 3 x 3 mm QFN package with 0.5 mm pitch, 10 positions, and center ground pad, CBT-QFN-7039 mounts using supplied hardware on target PCB without any soldering. Stamped spring pin contactor has 17 g actuation force per ball, cycle life of 50,000 insertions, self-inductance of 0.75 nH, insertion loss of
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BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.
RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter....
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Swivel Lid Spring Pin BGA Socket supports geometric processors.
Designed for testing 10 x 8 mm, 0.5 mm pitch, 223-position, 15 x 19 ball array packages, Model SBT-BGA-7019 features stamped spring pin contactor with 31 g actuation force per ball and cycle life of 125,000 insertions. Contactor provides self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, capacitance of 0.097 pF, and current capacity of 4 A at 30-
Read More »Elastomer Socket accommodates 0.5 mm pitch QFN package.
Designed for 8 x 8 x 0.8 mm package size, Model SG-MLF-7079 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mΩ per pin and pin self inductance- is 0.15 nH. Mounted using supplied hardware on target PCB with no soldering, socket operates from -35 to +100-
Read More »CCGA IC Socket does not incur significant performance loss.
Accommodating- 1 mm pitch, 1,272-pin CCGA ICs, SG-CGA-7002 is designed for 37.5 x 37.5 mm package size and has compact footprint (2.5 mm more on each side). Socket operates at bandwidths up to 8 GHz with less than 1 dB- insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100- W with custom heat sink. Mounted on target PCB without any soldering,...
Read More »Elastomer Socket accommodates high-speed QFP ICs.
Available for 0.4 mm pitch 128-pin QFP, Model SG-QFE-7011 operates at- up to 10 GHz with less than 1 dB of insertion loss. Unit is designed for 14 x 14 x 1.6 mm package size with 16 x 16 mm lead tip to tip. Contact resistance is typically 20 mΩ per I/O. Mounted- on PCB using supplied hardware with no soldering, socket incorporates swivel lid with compression screw, and floating compression...
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QFN Socket supports 12 x 12 mm devices with 0.5 mm pitch.
Designed to JEDEC STD, Model SBT-QFN-4015 features contact design with outside spring and flat stamped plungers for burn-in and test applications. Contactor provides current capacity of 4 A, self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, and 0.097 pF capacitance. Operating from -55 to +180-
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Thermal Management System facilitates IC characterization.
Using direct thermal contact technology, TSL-ST-01 Thermal Socket Lid and Control System enables temperature control of IC devices during thermal characterization. Chiller supplies liquid to thermal socket lid, while controller monitors lid and supplies necessary electrical input to accurately control temperature. With GUI, users can set temperature, tune system, change and save configuration...
Read More »Socket accommodates 656-pin, 0.8 mm pitch BGA IC.
Model SF-BGA656A-B-64F allows 0.8 mm pitch, 23 x 23 mm body, 28 x 28 array LG XD(TM) Engine to be socketed and operate without compromising performance in HDTV applications. Giga-snaP(TM) BGA socket adapter pair consists of SF-BGA656A-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin LS-BGA656A-61 adapter. In latter, user attaches target 656 ball LG...
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Clamshell Spring Pin QFN Socket accommodates 10TDFN package.
Designed for testing 3 x 3 mm QFN package with 0.5 mm pitch, 10 positions, and center ground pad, CBT-QFN-7039 mounts using supplied hardware on target PCB without any soldering. Stamped spring pin contactor has 17 g actuation force per ball, cycle life of 50,000 insertions, self-inductance of 0.75 nH, insertion loss of
Read More »
BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.
RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter....
Read More »
Swivel Lid Spring Pin BGA Socket supports geometric processors.
Designed for testing 10 x 8 mm, 0.5 mm pitch, 223-position, 15 x 19 ball array packages, Model SBT-BGA-7019 features stamped spring pin contactor with 31 g actuation force per ball and cycle life of 125,000 insertions. Contactor provides self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, capacitance of 0.097 pF, and current capacity of 4 A at 30-
Read More »Elastomer Socket accommodates 0.5 mm pitch QFN package.
Designed for 8 x 8 x 0.8 mm package size, Model SG-MLF-7079 operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Contact resistance is typically 20 mΩ per pin and pin self inductance- is 0.15 nH. Mounted using supplied hardware on target PCB with no soldering, socket operates from -35 to +100-
Read More »CCGA IC Socket does not incur significant performance loss.
Accommodating- 1 mm pitch, 1,272-pin CCGA ICs, SG-CGA-7002 is designed for 37.5 x 37.5 mm package size and has compact footprint (2.5 mm more on each side). Socket operates at bandwidths up to 8 GHz with less than 1 dB- insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100- W with custom heat sink. Mounted on target PCB without any soldering,...
Read More »Elastomer Socket accommodates high-speed QFP ICs.
Available for 0.4 mm pitch 128-pin QFP, Model SG-QFE-7011 operates at- up to 10 GHz with less than 1 dB of insertion loss. Unit is designed for 14 x 14 x 1.6 mm package size with 16 x 16 mm lead tip to tip. Contact resistance is typically 20 mΩ per I/O. Mounted- on PCB using supplied hardware with no soldering, socket incorporates swivel lid with compression screw, and floating compression...
Read More »
QFN Socket supports 12 x 12 mm devices with 0.5 mm pitch.
Designed to JEDEC STD, Model SBT-QFN-4015 features contact design with outside spring and flat stamped plungers for burn-in and test applications. Contactor provides current capacity of 4 A, self inductance of 0.88 nH, insertion loss of less than 1 dB at 15.7 GHz, and 0.097 pF capacitance. Operating from -55 to +180-
Read More »
Thermal Management System facilitates IC characterization.
Using direct thermal contact technology, TSL-ST-01 Thermal Socket Lid and Control System enables temperature control of IC devices during thermal characterization. Chiller supplies liquid to thermal socket lid, while controller monitors lid and supplies necessary electrical input to accurately control temperature. With GUI, users can set temperature, tune system, change and save configuration...
Read More »Socket accommodates 656-pin, 0.8 mm pitch BGA IC.
Model SF-BGA656A-B-64F allows 0.8 mm pitch, 23 x 23 mm body, 28 x 28 array LG XD(TM) Engine to be socketed and operate without compromising performance in HDTV applications. Giga-snaP(TM) BGA socket adapter pair consists of SF-BGA656A-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin LS-BGA656A-61 adapter. In latter, user attaches target 656 ball LG...
Read More »