Ironwood Electronics, Inc

BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.
Electrical Equipment & Systems

BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.

RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter....

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Electrical Equipment & Systems

CCGA IC Socket does not incur significant performance loss.

Accommodating- 1 mm pitch, 1,272-pin CCGA ICs, SG-CGA-7002 is designed for 37.5 x 37.5 mm package size and has compact footprint (2.5 mm more on each side). Socket operates at bandwidths up to 8 GHz with less than 1 dB- insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100- W with custom heat sink. Mounted on target PCB without any soldering,...

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Electrical Equipment & Systems

Elastomer Socket accommodates high-speed QFP ICs.

Available for 0.4 mm pitch 128-pin QFP, Model SG-QFE-7011 operates at- up to 10 GHz with less than 1 dB of insertion loss. Unit is designed for 14 x 14 x 1.6 mm package size with 16 x 16 mm lead tip to tip. Contact resistance is typically 20 mΩ per I/O. Mounted- on PCB using supplied hardware with no soldering, socket incorporates swivel lid with compression screw, and floating compression...

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Thermal Management System facilitates IC characterization.
Agricultural & Farming Products

Thermal Management System facilitates IC characterization.

Using direct thermal contact technology, TSL-ST-01 Thermal Socket Lid and Control System enables temperature control of IC devices during thermal characterization. Chiller supplies liquid to thermal socket lid, while controller monitors lid and supplies necessary electrical input to accurately control temperature. With GUI, users can set temperature, tune system, change and save configuration...

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Electrical Equipment & Systems

Socket accommodates 656-pin, 0.8 mm pitch BGA IC.

Model SF-BGA656A-B-64F allows 0.8 mm pitch, 23 x 23 mm body, 28 x 28 array LG XD(TM) Engine to be socketed and operate without compromising performance in HDTV applications. Giga-snaP(TM) BGA socket adapter pair consists of SF-BGA656A-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin LS-BGA656A-61 adapter. In latter, user attaches target 656 ball LG...

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BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.
Electrical Equipment & Systems

BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.

RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter....

Read More »
Electrical Equipment & Systems

CCGA IC Socket does not incur significant performance loss.

Accommodating- 1 mm pitch, 1,272-pin CCGA ICs, SG-CGA-7002 is designed for 37.5 x 37.5 mm package size and has compact footprint (2.5 mm more on each side). Socket operates at bandwidths up to 8 GHz with less than 1 dB- insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100- W with custom heat sink. Mounted on target PCB without any soldering,...

Read More »
Electrical Equipment & Systems

Elastomer Socket accommodates high-speed QFP ICs.

Available for 0.4 mm pitch 128-pin QFP, Model SG-QFE-7011 operates at- up to 10 GHz with less than 1 dB of insertion loss. Unit is designed for 14 x 14 x 1.6 mm package size with 16 x 16 mm lead tip to tip. Contact resistance is typically 20 mΩ per I/O. Mounted- on PCB using supplied hardware with no soldering, socket incorporates swivel lid with compression screw, and floating compression...

Read More »
Thermal Management System facilitates IC characterization.
Agricultural & Farming Products

Thermal Management System facilitates IC characterization.

Using direct thermal contact technology, TSL-ST-01 Thermal Socket Lid and Control System enables temperature control of IC devices during thermal characterization. Chiller supplies liquid to thermal socket lid, while controller monitors lid and supplies necessary electrical input to accurately control temperature. With GUI, users can set temperature, tune system, change and save configuration...

Read More »
Electrical Equipment & Systems

Socket accommodates 656-pin, 0.8 mm pitch BGA IC.

Model SF-BGA656A-B-64F allows 0.8 mm pitch, 23 x 23 mm body, 28 x 28 array LG XD(TM) Engine to be socketed and operate without compromising performance in HDTV applications. Giga-snaP(TM) BGA socket adapter pair consists of SF-BGA656A-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin LS-BGA656A-61 adapter. In latter, user attaches target 656 ball LG...

Read More »

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