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Assembly Adhesive suits edgebonding applications.

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Assembly Adhesive suits edgebonding applications.
Assembly Adhesive suits edgebonding applications.
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November 7, 2013 - Designed for rapid ruggedization of circuit board components, Ultra Light-Weld® 9309-SC cures upon exposure to UV/visible light. Adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Formulated with patented See-Cure technology, 9309-SC is bright blue in uncured state, enabling automated vision systems and manual operations to confirm placement prior to cure. As product cures, blue color transitions to colorless.

New Edgebond/Cornerbond Material for Rapid, Economical Ruggedization


Dymax Corp.
318 Industrial Lane
Torrington, CT, 06790
USA



Press release date: October 30, 2013

Dymax Corporation has introduced Ultra Light-Weld® 9309-SC, an adhesive that cures upon exposure to UV/Visible light and is designed for rapid ruggedization of circuit board components.  It provides rapid bonding to lead frame, PCB, silicon, and ceramic, and its tack-free surface allows for quicker handling and minimization of surface contamination.  9309-SC is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense.  This new material is ideal for edgebonding and cornerbonding applications where shock attenuation or ruggedization is necessary, including use as an economic alternative to underfill.  It can specifically be used to address the shock and impact challenges presented by portable electronics and smart connected devices.

Formulated with patented See-Cure technology, 9309-SC is bright blue in an uncured state, enabling automated vision systems and manual operations to confirm placement prior to cure.  As the product cures with sufficient exposure, its blue color transitions to colorless and provides obvious visual confirmation that the adhesive is fully cured and the bond site is secure.

9309-SC edgebond/cornerbond material is a significant addition to the Dymax portfolio of printed circuit board assembly materials, which include conformal coatings, encapsulants, and potting products, as well as masking materials and other related products.

For additional information, visit www.dymax.com  or contact Dymax Application Engineering at info@dymax.com or 860-482-1010.  Dymax Corporation develops innovative oligomer, adhesive, coating, dispensing, and light-curing systems for applications in a wide range of markets.  Major markets include aerospace, appliance, automotive, electronics, industrial, medical device, and metal finishing.
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