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Stamped Spring Pin Socket is suited for 0.5 mm pitch BGA.
Stamped Spring Pin Socket is suited for 0.5 mm pitch BGA.

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Stamped Spring Pin Socket is suited for 0.5 mm pitch BGA.


June 23, 2009 - Designed for Burn-in and Test applications, SBT-BGA-7003 is stamped spring pin with 26 g actuation force per ball and cycle life of 100,000 insertions. Contactor has self inductance of 0.88 nH, insertion loss of less than 1 dB at 20 GHz, capacitance of 0.097 pF, and temperature range of -55 to +180°C. Socket also features floating guide for precise ball to pin alignment, while current capacity of each contactor is 4 A at 80°C temperature rise.

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 See more related product stories:
Test Sockets handle small and fragile devices.
BGA Socket is designed for 0.8 mm pitch BGA 289 pin ICs.
Data Transfer Modules work with Profibus, Interbus, CANbus.
Socket holds 1,156-pin, 1 mm pitch BGA packages.
Contactors feature Everlink® termination technology.
BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.
QFN Sockets are suited for 0.5 mm pitch BGA 256 pin IC's.
BGA Socket has cycle life of 500,000 insertions.
Test Sockets accommodate devices with pitches down to 0.3 mm.
BGA Socket accommodates devices up to 6.5 mm˛.
BGA Socket features 0.028 pF capacitance to ground.
BGA Sockets are developed for 0.8 mm pitch SDRAM.
ZIF Sockets are suited for 1.0 mm pitch BGA.
ZIF Socket is suited for 0.4 mm pitch BGA.
Socket accommodates 0.4 mm pitch BGA ICs.
Socket is designed for 1.0 mm pitch BGA packages.
RF Sockets suit devices with pitches as low as 0.40 mm.
Socket suits 1.0 mm pitch BGA chips.
Lighting Contactors are suited for global lighting control.
Test Socket suits devices from 28 to 40 mm˛.


Stamped Spring Pin Socket for 0.5mm Pitch BGA


BURNSVILLE, MN - June, 2009 - Ironwood Electronics recently introduced a new socket product line addressing high performance requirements for Burn-in and Test applications - SBT-BGA-7003. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 100,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 20 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps at 80C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the SBT-BGA-7003 is BGA, 8x8mm body size, 0.5mm pitch and 14x14 ball array. To use, drop IC into the socket, place floating compression plate, swivel the lid, and apply down force using compression screw. This socket can be used for hand test and quick turn custom burn-in applications with the most stringent requirements.

Pricing for the SBT-BGA-7003 is $1061 at qty 1 with reduced pricing available depending on quantity required.

Ila Pal

Vice President of Marketing

Ironwood Electronics

Phone: 800-404-0204

Email: ila@ironwoodelectronics.com

Skype: ila.pal


Contacts:

Marketing:
Ila Pal Vice President of Marketing
USA
Phone: 800-404-0204
Send email  E-mail this person

Company Information:
Name: Ironwood Electronics, Inc.
Address: P.O. Box 21151
City: St. Paul
State: MN
ZIP: 55121
Country: USA
Phone: 952-452-8100
FAX: 952-452-8400
http://www.ironwoodelectronics.com


More New Product News from this company:
BGA Socket Adapter accepts Samsung MCP memory device.
Chip Size BGA Adapter suits automotive applications.
Adapter allows prototyping of BGA ICs.
BGA SMT Adapters are available in many different pin counts.
BGA Socket is designed for 0.8 mm pitch BGA 289 pin ICs.
Socket holds 1,156-pin, 1 mm pitch BGA packages.
QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.
BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.
QFN Sockets are suited for 0.5 mm pitch BGA 256 pin IC's.


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